All US MICROWAVES products are available in Military grade H and Space grade K. Custom Model Silicon Chip Capacitors MIS MOS MNOS USMC1200_100V_1P2pF
and SC01020912 - Series of chip capacitors are designed to be used as RF bypass, DC blocks coupling filter elements and microwave circuit resonant elements. When used as resonant elements in oscillators, Q must be as high as possible while the temperature coefficient must be as small as possible. U. S. MICROWAVES advanced semiconductor and thin film technologies allow for an important reduction of the series resistance DCR that is increasing the SRF of the capacitor. High quality dielectrics with low loss factors translate into an increased quality factor Q. The microwave chip capacitors are manufactured on high conductivity silicon substrates. The dielectrics are SiO2 and Si3N4 and the capacitors are available with single or dual dielectric. The die thickness is 0.005 +/- 0.001. The top plate of the capacitors is 99.99% electroplated or sputtered gold with a TiW barrier that withstands half hour at 400 deg. C without loss of adhesion. Minimum 1.5 micrometers of Au enhance the top plate bond ability. The backside of the die is metalized with Ti/Pt/Au, which is compatible with most die attaching methods. The MNOS type of capacitors has low voltage coefficients, low TCC, high Q and high dielectric breakdown. Capacitors are 100% visually inspected and packaged in waffle packs, gel packs or vials. US MICROWAVES manufacturer of high reliability microwave integrated circuits MIC technology. US Microwave offers a multitude of applied thin film products and microwave semiconductor devices: manufactures and supplies high quality standard microwave thin film circuits and microwave devices using advanced technical ceramics and semiconductor materials; Products include RF micro devices for hybrid chip and wire applications; microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes, varactor diodes and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.
SEMICONIX SEMICONDUCTOR, SMXSEMI designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high-speed RF bipolar and high-speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix Semiconductor produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain many undedicated active and passive components, i.e., transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, opto-isolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFETs, MCT (MOS controlled thyristors), IGBT.
HTELABS Provides Wafer Foundry, R&D research and development support and Specialty Wafer Fab Processing to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V bipolar super-beta technologies and high voltage dielectric isolated bipolar processes. R&D research and development support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, KOH silicon micro-machining anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors: SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump.
SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and Schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is suppling integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and Schottky diodes networks and are inventoried by the designated part numbers and can be ordered online, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request.
US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolar devices for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and TMOSFET s, MMIC - RF IC s silicon and SiGe.