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USMC3000-100V-93P1 93.1pF 100V MIS (MNOS, MOS) SILICON CHIP CAPACITORS Vishay NCBxxx, Mini-Systems Inc MSCC-3, Calmos CM80PT10V1F-CM100PT10V1F, microwave MIS MNOS chip capacitors on 5 mils Silicon Si 30 x 30 mils 93.1 pF for microwave applications manufactured by US Microwaves
USMC3000-100V-93P1 93.1pF 100V MIS (MNOS, MOS) SILICON CHIP CAPACITORS Vishay NCBxxx, Mini-Systems Inc MSCC-3,
Calmos CM80PT10V1F-CM100PT10V1F, microwave MIS MNOS chip capacitors on 5 mils Silicon Si 30 x 30 mils 93.1 pF for
microwave applications manufactured by US Microwaves US MICROWAVES 93.1pF 100V MIS (MNOS, MOS) SILICON CHIP CAPACITORS
Advanced Microwave Components USMC3000-100V-93P1 FEATURES APPLICATIONS MIS (MNOS, MOS) CHIP CAPACITOR Very high Q over
wide range of frequencies 2GHz to 40 GHz. Low insertion loss <0.08dB from 2GHz to 18GHz High reliability and ruggedness
characteristic of semiconductor devices Small chip size due to high capacitance per unit area and wide range of
capacitance Low temperature coefficient and wide operating temperature range. Microwave hybrid circuits DC blocks
Capacitive coupling RF bypass capacitors Capacitive loads Oscillators, multipliers Filters, matching networks Switch
and comb generators 93.1pF 100V MIS (MNOS, MOS) SILICON CHIP CAPACITORS USMC3000-100V-93P1 PRODUCT DESCRIPTION AND
SHORT APPLICATION NOTE USMC3000-100V Series of MIS chip capacitors are designed to be used in chip and wire hybrid
circuits as RF bypass, DC blocks coupling filter elements and microwave circuit resonant elements. When used as
resonant elements in oscillators, Q has to be as high as possible while the temperature coefficient has to be as small
as possible. US MICROWAVES advanced semiconductor and thin film technologies allow for an important reduction of series
resistance DCR, increased SRF, low insertion loss and skin effect at higher microwave frequencies. High quality
dielectrics with low loss factors translate into an increased Q, very high insulation resistance, high breakdown
voltage, long term stability under bias at high temperatures. US Microwaves MIS chip capacitors exhibit Q values in
excess of 3000 in X band, insertion loss less than 0.08dB through Ku band and series resistance much lower than
conventional ceramic chip capacitors. DCR of less than 0.1 ohms is typical for most chip sizes. MIS capacitors with
silicon nitride/silicon oxide dielectric, also known as MNOS capacitors exhibit high stability, low temperature
coefficients, low leakage in ≤nA range and high BV from 5, 10, 25, 50, 100 to 300V. MIS Chip capacitors are available
in a wide range of die sizes, capacitance values and breakdown voltages. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN
FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film
technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization
and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the
preferred solution for all applications that require low noise, long term stability and excellent performance at very
high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive
films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and
are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured
using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. ELECTRICAL CHARACTERISTICS @25°C PARAMETER VALUE
UNITS Capacitance range 93.1 pF Capacitance tolerance 5, 10, 20 % Temperature Coefficient -55°C to 150°C 50 ppm/°C
Operating Temperature range -65 to 200 °C Maximum withstanding voltage (Vw) see Note 1 250 V Maximum Continuous
Operating voltage (Vmax) [Vmax=0.4*Vw] 100 V Peak voltage at 25°C, 5 sec 150 V Insulation resistance at 25°C 1e10 Ω
Leakage current at 50% of withstanding voltage IL <1 nA Thermal conductivity 1.2 °C/cm/W Equivalent Series Res.@ 18GHz
<0.05 Ω MAXIM SAFE ESD strike level per Human Body Model [S-ESDmax=(1+C/100)*Vmax] see Note 2 193.1 V UNSAFE ESD strike
level per Human Body Model [ESDmax=(1+C/100)*WV] see Note 2 482.8 V Note 1: Devices should NEVER be subjected to
maximum withstanding voltage WV. Long term reliability will be adversely affected and severe damage of devices may
result. Note 2: This information is provided to users to be aware of this device ESD sensitivity and take appropriate
measures to prevent permanent damage. Please see NOTE 1. ESD warning! MIS capacitors are ESD sensitive. ONLY Proper die
handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause
permanent damage to the device. GENERAL DIE INFORMATION SUBSTRATE THICKNESS [mils] DIE SIZE LxW [mils] Silicon (Si) 5±1
30x30±2 (0.76x0.76±0.05 mm) CONDUCTOR BONDING PADS BACKSIDE METAL Gold (Au) min 4x4 mils, 3µm thick, 99.99%
electroplated gold with a TiW barrier Backside of the die is metallized with standard Ti/Pt/Au compatible with Au-Sn,
Au-Ge or silver filled conductive epoxy. Custom metallization is available for special orders. All US Microwaves
products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is
3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and
wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). MIS (MNOS, MOS) CHIP CAPACITOR
DIE LAYOUT / MECHANICAL SPECIFICATIONS 93.1pF 100V MIS (MNOS, MOS) SILICON CHIP CAPACITORS USMC3000-100V-93P1 MIS
(MNOS, MOS) CHIP CAPACITOR CHIP MOUNT 93.1pF 100V MIS (MNOS, MOS) SILICON CHIP CAPACITORS USMC3000-100V-93P1 MIS MNOS
MOS chip capacitor mount MIS (MNOS, MOS) CHIP CAPACITOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Silicon Microwave MIS
(MNOS, MOS) Chip Capacitors are designed for critical designs where space is at premium. The Silicon Microwave MIS
(MNOS, MOS) Chip Capacitors can be die attached to the PCB or to a base plate using AuSn or AuGe preforms. Since the
Silicon Microwave MIS (MNOS, MOS) Chip Capacitors do not have terminals, they have to be attached using gold wire after
the backside is soldered in place. Backside metallization for Silicon Microwave MIS (MNOS, MOS) Chip Capacitors is
Ti/Pt/Au which is also compatible with Sn solder. For the more common SnPb, a Ti/Ni/Au backside metallization should be
requested. STANDARD PRODUCTS ORDERING INFORMATION USM P/N C [pF] WAFFLE PACK MIN. QTY U/P [$] FILM FRAME MIN. QTY U/P
[$] USMC3000-100V-93P1 93.1 -WP 10000 0.93 -FF 9000 0.831 USMC3000-100V-93P1 93.1 -WP 50000 0.666 -FF 45000 0.45
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are
subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD
qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US
Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order
along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be
verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable
binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom
designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle
packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For
high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film
frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of
product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of
all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this
information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any
infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise
the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should
not be used within support systems which are intended for surgical implants into the body, to support or sustain life,
in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S.
Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales
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