BINARY MICROWAVE CAPACITORS MOS, MIS, MNOS MICROWAVE BINARY CHIP CAPACITORS BCC20LL 4 Bit is a 4 binary chip capacitor that is designed to facilitate bread-boarding or to use where a trimming capability is required. By connecting the pads in parallel the capacitance values are additive, so many combinations are possible. The BCC20LL 4 Bit of binary chip capacitors are designed to be used as RF bypass, DC blocks, coupling filter elements and microwave circuit resonant elements. When used as resonant elements in oscillators, Q has to be as high as possible while the temperature coefficient has to be as small as possible. U.S. Microwaves’ advanced semiconductor and thin film technologies allow for an important reduction of the series resistance DCR which is increasing the SRF of the capacitor. High quality dielectrics with low loss factors translates into an increased Q.These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. The BCC series of binary chip capacitors are manufactured on silicon substrate and designed to satisfy the requirements of prototype development and circuit trimming in hybrid packages through selective wire-bonding. BCC20LL 4 Bit has 4 bonding pads allowing the user to select specified increments and a wide range of values. The desired capacitance value is obtained by bonding gold wires to the appropriate pads. This binary chip capacitor can also be used as a single capacitor with maximum value C=C1+C2+C3+C4. Custom designs are available upon request. The dielectrics are thermally grown silicon dioxide SiO2 and LPCVD, PECVD silicon nitride Si3N4. Capacitors are available with single or dual dielectrics.The bonding pads of the capacitors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30min at 400°C in air without loss of adhesion.The backside of the capacitor die is metallized with Ti/Pt/Au, which is compatible with most die attaching methods, including conductive epoxy, AuSn, AuGe. Other metallizations are available upon special request for Au:Si eutectic die attach. MORE PROCESS INFORMATION: US Microwaves employs proprietary state-of-the-art LPCVD, PECVD and vacuum deposition technologies for deposition of a wide range of dielectric materials to satisfy every chip capacitor application. High quality dielectrics are deposited using proprietary technologies which makes it possible to pack very high capacitance values onto a quite small area. The dielectric materials are high stability, high Q, low temperature coefficients TCC, low voltage coefficients, low leakage and high breakdown voltages. For special applications, U.S.Microwaves employs a proprietary trimming technique that allows production of capacitors with tolerances as low as 1% for C>10pF.

 
 
US MICROWAVES
Advanced Microwave Components
  MOS, MIS, MNOS MICROWAVE BINARY CHIP CAPACITORS
BCC20LL 4 Bit
 
 

FEATURES
APPLICATIONS
BINARY CAPACITOR
Low to High capacitance values.
Low inductance.
High Q for RF.
High SRF, low DCR
Capacitance value obtained by bonding gold wires to one or more of the appropriate 4 pads
Single capacitor with C=C1+C2+C3+C4
Microwave & millimeter wave.
RF By-pass and D.C. blocking applications.
Coupling and filtering
Prototype development and circuit trimming

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
BCC20LL 4 Bit Series is a 4 bit binary chip capacitor that is designed to facilitate bread-boarding or to use where a trimming capability is required. By connecting the pads in parallel the capacitance values are additive, so many combinations are possible. The BCC20LL 4 Bit of binary chip capacitors are designed to be used as RF bypass, DC blocks, coupling filter elements and microwave circuit resonant elements. When used as resonant elements in oscillators, Q has to be as high as possible while the temperature coefficient has to be as small as possible. U.S. Microwaves’ advanced semiconductor and thin film technologies allow for an important reduction of the series resistance DCR which is increasing the SRF of the capacitor. High quality dielectrics with low loss factors translates into an increased Q. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. The BCC series of binary chip capacitors are manufactured on silicon substrate and designed to satisfy the requirements of prototype development and circuit trimming in hybrid packages through selective wire-bonding. BCC20LL 4 Bit Series has Pads bonding pads allowing the user to select specified increments and a wide range of values. The desired capacitance value is obtained by bonding gold wires to the appropriate pads. This binary chip capacitor can also be used as a single capacitor with maximum value C=C1+C2+C3+C4. Custom designs are available upon request.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
US Microwaves employs proprietary state-of-the-art LPCVD, PECVD and vacuum deposition technologies for deposition of a wide range of dielectric materials to satisfy every chip capacitor application. High quality dielectrics are deposited using proprietary technologies which makes it possible to pack very high capacitance values onto a quite small area. The dielectric materials are high stability, high Q, low temperature coefficients TCC, low voltage coefficients, low leakage and high breakdown voltages. For special applications, U.S. Microwaves employs a proprietary trimming technique that allows production of capacitors with tolerances as low as 1% for C>10pF.
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.


ELECTRICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Operating frequency > 50 GHz
Capacitance values 1 to 50 pF
Series Resistance (@18GHz) <0.05 W
Current Leakage <1 nA
Insulation resistance (IR) -1012 min. at 25 °C W
Temperature coefficient (TC) 0±20 PPM/°C
Thermal Conductivity 1.2 °C/cm/W
Rated Voltage: min 50 V
Standard tolerances ±20, ±10, ±5, ±1 %
Operating Temperature Range -50 to 125 °C


GENERAL DIE INFORMATION
Die size
[mils]
Thickness
[mils]
Bonding pads Substrate / Dielectric Backside metal
20 x 20±2 5±1 min 3.5x3.5mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Si3N4 Silicon Nitride, SiO2 Quartz: The dielectrics are thermally grown silicon dioxide SiO2 and LPCVD, PECVD silicon nitride Si3N4. Capacitors are available with single or dual dielectrics. The backside of the capacitor die is metallized with Ti/Pt/Au, which is compatible with most die attaching methods, including conductive epoxy, AuSn, AuGe. Other metallizations are available upon special request for Au:Si eutectic die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

DIE LAYOUT - MECHANICAL SPECIFICATIONS
 

STANDARD PRODUCTS ORDERING INFORMATION
USM Part #CodeC(pF) Pad#12C(pF) Pad#24C(pF) Pad#38C(pF) Pad#415C(pF) TOTAL
BCC20LL-0.188/1.5000.1880.3750.7500.15002.800
BCC20LL-0.250/2.0000.2500.5000.10000.20003.750
BCC20LL-0.375/3.0000.3750.7501.5003.0005.625
BCC20LL-0.500/4.0000.5001.0002.0004.0007.500
BCC20LL-0.675/5.4000.6751.3502.7005.40010.125
BCC20LL-1.000/8.0001.0002.0004.0008.00015.000
BCC20LL-1.500/12.0001.5003.0006.00012.00022.500

STANDARD PRODUCTS PRICE LIST
TOLERANCEMINIMUM ORDERU/P($)>1KU/P($)>5KU/P($)>10KU/P($)>50KU/P($)>100K
20%$320/150pc$1$0.90$0.8$0.75$0.50
10%$480/125pc$1.5$1.35$1.2$1.125$0.75
5%$640/100pc$2.5$2.25$2.0$1.875$1.25
1%$1280/100pc$5.0$4.50$4.0$3.75$2.50
Lab Kits: 20% Lab Kit: Customer can choose up to 4 different values, same die size. Maxim 100 pc in a kit. Cost is $480.00. 10% Lab Kit: Customer can choose up to 4 different values, same die size. Maxim 100 pc in a kit. Cost is $640.00.
List prices are for standard products, available from stock and for standard [±20%] tolerance. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Tolerance Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 01, 2009
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