| QUAD SINGLE SUPPLY COMPARATORS USM LM339 FEATURES APPLICATIONS QUAD SINGLE SUPPLY COMPARATORS Wide single supply 2.0V to 36V Dual supplies:±1.0V to ±18V Very low supply current drain (0.4 mA) independent of supply voltage In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The USM LM339 series are dual independent precision voltage comparators capable of single or split power supply operation. These devices are designed to permit a common mode range–to–ground level with single supply operation. IC SCHEMATIC DIAGRAM MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Power Supply Voltages VCC +36 or 18 Vdc Input Differential Voltage Range VDIR 32 Vdc Input Common Mode Voltage Range VICMR -0.3 to VCC Vdc Output Short Circuit to Ground ISC Continuous Power dissipation TA = 25°C Derate Above 25°C PD 8.0 mW/°C Junction temperature TJ 150 °C Operating Ambient Temperature Range TA 0 to +70 °C Storage Temperature Range TSTG -65 to +150 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTIC VCC = +5.0 Vdc, TA = +25°C, unless otherwise specified PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS Input Offset Voltage (Note1) VIO ±2.0 ±5.0 mVdc Input Bias Current (Note1, Note 2) IIB 25 250 nA Input Offset Current (Note 1) IIO ±5.0 ±5.0 nA Input Common Mode Voltage Range VICMR VCC-1.5 V Supply Current RL=¥, RL=¥, VCC = 30 Vdc ICC - - 0.8 1.0 2.0 2.5 mA Voltage Gain RL >=15 k, VCC = 15 Vdc AVOL 50 200 V/mV Large Signal Response Time VI = TTL Logic Swing, Vref = 1.4 Vdc, VRL = 5.0 Vdc, RL = 5.1 kW - 300 ns Response Time (Note 6) VRL = 5.0 Vdc, RL = 5.1 kW - 1.3 µs Output Sink Current VI (-) >= +1.0 Vdc, VI(+) = 0,VO =< 1.5 Vdc ISINK 6.0 16 mA Saturation Voltage VI(-) >= +1.0 Vdc, VI(+) = 0, Isink =< 4.0 mA Vsat 130 400 mV Output Leakage Current VI(+) >= +1.0 Vdc, VI(-) = 0, VO = +5.0 Vdc IOL 0.1 nA (NOTE 1)At the output switch point, V O 1.4 Vdc, RS £ 100 5.0 Vdc £ VCC £ 30 Vdc, with the inputs over the full common mode range (0 Vdc to VCC –1.5 Vdc). (NOTE 2)The bias current flows out of the inputs due to the PNP input stage. This current is virtually constant, independent of the output state. GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) [mm] Bonding pads(mils) Backside metal Silicon 10±1 (61.024x62.992)[1.55x1.6] 4.724x4.724 Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1µm Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) Y(mm) 1 OUT#1 0.105 4.134 0.718 28.268 2 OUT#2 0.105 4.134 0.333 13.110 3 VCC 0.105 4.134 0.110 4.330 4 IN-#2 0.480 18.898 0.110 4.330 5 IN+#2 0.990 38.976 0.110 4.330 6 IN-#1 1.325 52.165 0.110 4.330 7 IN+#1 1.325 52.165 0.530 20.866 8 IN-#3 1.325 52.165 0.949 37.362 9 IN+#3 1.325 52.165 1.369 53.898 10 IN-#4 0.990 38.976 1.369 53.898 11 IN+#4 0.480 18.898 1.369 53.898 12 GND 0.105 4.134 1.369 53.898 13 OUT#4 0.105 4.134 1.118 44.016 14 OUT#3 0.105 4.134 0.928 36.535 STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USMLM339 100pc -WP $3.20 List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
| US MICROWAVES Advanced Microwave Components |
QUAD SINGLE SUPPLY COMPARATORS USM LM339 |
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| PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE |
|
The USM LM339 series are dual independent precision
voltage comparators capable of single or split power supply operation. These devices
are designed to permit a common mode range–to–ground level with single supply
operation. |
| IC SCHEMATIC DIAGRAM |
 |
| MAXIMUM RATINGS | |||
| PARAMETER | SYMBOL | VALUE | UNITS |
| Power Supply Voltages | VCC | +36 or 18 | Vdc |
| Input Differential Voltage Range | VDIR | 32 | Vdc |
| Input Common Mode Voltage Range | VICMR | -0.3 to VCC | Vdc |
| Output Short Circuit to Ground | ISC | Continuous | |
| Power
dissipation TA = 25°C Derate Above 25°C |
PD |
8.0 |
mW/°C |
| Junction temperature | TJ | 150 | °C |
| Operating Ambient Temperature Range | TA | 0 to +70 | °C |
| Storage Temperature Range | TSTG | -65 to +150 | °C |
| ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. | |||
| ELECTRICAL CHARACTERISTIC | ||||||
| VCC = +5.0 Vdc, TA = +25°C, unless otherwise specified | ||||||
| PARAMETER | TEST CONDITIONS | SYMBOL | MIN | TYP | MAX | UNITS |
| Input Offset Voltage (Note1) | VIO | ±2.0 | ±5.0 | mVdc | ||
| Input Bias Current (Note1, Note 2) | IIB | 25 | 250 | nA | ||
| Input Offset Current (Note 1) | IIO | ±5.0 | ±5.0 | nA | ||
| Input Common Mode Voltage Range | VICMR | VCC-1.5 | V | |||
| Supply Current | RL=¥, RL=¥, VCC = 30 Vdc |
ICC | - - |
0.8 1.0 |
2.0 2.5 |
mA |
| Voltage Gain | RL >=15 k, VCC = 15 Vdc | AVOL | 50 | 200 | V/mV | |
| Large Signal Response Time | VI = TTL Logic Swing, Vref = 1.4 Vdc, VRL = 5.0 Vdc, RL = 5.1 kW | - | 300 | ns | ||
| Response Time (Note 6) | VRL = 5.0 Vdc, RL = 5.1 kW | - | 1.3 | µs | ||
| Output Sink Current | VI (-) >= +1.0 Vdc, VI(+) = 0,VO =< 1.5 Vdc | ISINK | 6.0 | 16 | mA | |
| Saturation Voltage | VI(-) >= +1.0 Vdc, VI(+) = 0, Isink =< 4.0 mA | Vsat | 130 | 400 | mV | |
| Output Leakage Current | VI(+) >= +1.0 Vdc, VI(-) = 0, VO = +5.0 Vdc | IOL | 0.1 | nA | ||
| (NOTE 1)At the output switch point, V O 1.4 Vdc, RS £ 100 5.0 Vdc £ VCC £ 30 Vdc, with the inputs over the full common mode range (0 Vdc to VCC 1.5 Vdc). | ||||||
| (NOTE 2)The bias current flows out of the inputs due to the PNP input stage. This current is virtually constant, independent of the output state. | ||||||
| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) [mm] | Bonding pads | Backside metal |
| Silicon | 10±1 | (61.024x62.992)[1.55x1.6] | 4.724x4.724 | Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. |
| All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). | ||||
| TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING |
|
These integrated Circuits are manufactured with medium voltage junction isolated
bipolar process. junction isolated bipolar processes allow integration of high
performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors
and precision thin film resistors. The bond pad metallization is standard 1µm
Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it
compatible with AuSi or AuGe die attach. All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. |
| DIE LAYOUT - MECHANICAL SPECIFICATIONS | ||||||
| PAD # | FUNCTION | X(mils) | X(mm) | Y(mils) | Y(mm) |  |
| 1 | OUT#1 | 0.105 | 4.134 | 0.718 | 28.268 | |
| 2 | OUT#2 | 0.105 | 4.134 | 0.333 | 13.110 | |
| 3 | VCC | 0.105 | 4.134 | 0.110 | 4.330 | |
| 4 | IN-#2 | 0.480 | 18.898 | 0.110 | 4.330 | |
| 5 | IN+#2 | 0.990 | 38.976 | 0.110 | 4.330 | |
| 6 | IN-#1 | 1.325 | 52.165 | 0.110 | 4.330 | |
| 7 | IN+#1 | 1.325 | 52.165 | 0.530 | 20.866 | |
| 8 | IN-#3 | 1.325 | 52.165 | 0.949 | 37.362 | |
| 9 | IN+#3 | 1.325 | 52.165 | 1.369 | 53.898 | |
| 10 | IN-#4 | 0.990 | 38.976 | 1.369 | 53.898 | |
| 11 | IN+#4 | 0.480 | 18.898 | 1.369 | 53.898 | |
| 12 | GND | 0.105 | 4.134 | 1.369 | 53.898 | |
| 13 | OUT#4 | 0.105 | 4.134 | 1.118 | 44.016 | |
| 14 | OUT#3 | 0.105 | 4.134 | 0.928 | 36.535 | |
| STANDARD PRODUCTS ORDERING INFORMATION |
| STANDARD PRODUCTS PRICE LIST | |||
| USM PART # | MINIMUM ORDER QUANTITY | Waffle Packs | U/P($) |
| USMLM339 | 100pc | -WP | $3.20 |
| List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. | |||
| Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. | |||
| ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. |
| U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
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| Last updated: July 01, 2009 | |
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