SMP1340 PIN diode, USM SMP1340 single PIN diode, Fast Switching Speed, Low Capacitance,Plastic Packaged single PIN Diode, manufactured by US Microwaves

SKYWORKS SMP1340 PIN diode same as USM SMP1340 PIN diode, Fast Switching Speed, Low Capacitance,Plastic Packaged single PIN Diode, manufactured by US Microwaves FEATURES APPLICATIONS DIODE Designed for fast-speed wireless switch applications Short carrier lifetime 1.0 W resistance, 0.3 pF capacitance Available lead (Pb)-free and RoHS-compliant MSL-1 @ 250 °C per JEDEC J-STD-020 Available in tape and reel packaging High-volume switch applications from 10 MHz to beyond 2 GHz. PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The USMSMP1340 series of plastic packaged, surface mountable PIN diodes is designed for high-volume switch applications from 10 MHz to beyond 2 GHz. The short carrier lifetime of typically 100 ns, combined with its thin I region width of nominally 7 µm, results in a fast-speed RF switching PIN diode. The RF performance of the USMSMP1340 series is assured by virtue of its low capacitance (0.3 pF) and low resistance (1.0 Wat 10 mA). TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. MAXIMUM RATINGS (@ 25 °C) PARAMETER SYMBOL USMSMP1340 UNITS DC Reverse Breakdown Voltage@10µA VB 50 V Operating and Storage Junction Temperature (Reverse Voltage applied) Top,Tstg -65 to +150 °C Power dissipation @ 25 °C lead temperature PD 250 mW Performance is guaranteed only under the conditions listed in the specifications table and is not guaranteed under the full range(s) described by the Absolute Maximum specifications. Exceeding any of the absolute maximum/minimum specifications may result in permanent damage to the device and will void the warranty. Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. ELECTRICAL SPECIFICATIONS (@ 25 °C) PARAMETER SYMBOL USMSMP1340 UNITS Reverse Current @50V VB 10 µA Series resistance@1mA,f=100MHz RS typ.1.7 W Series resistance@5mA,f=100MHz RS typ.1 max.2 W Series resistance@10mA,f=100MHz RS typ.0.85 W Carrier lifetime@10mA TI typ.100 ns Total capacitance@5V,1MHz Cj typ.0.21 pF Forward voltage@10mA VF typ.0.85 V I region width typ.7 µm GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal Si - Silicon 5±1 ±3 min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier. Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). DIE LAYOUT - MECHANICAL SPECIFICATIONS STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS PRICE LIST USM PART # ORDER QUANTITY SOD323 U/P($) SC79 U/P($) USMSMP1340 100pc -SOD323 -SC79 USMSMP1340 1,000pc -SOD323 -SC79 USMSMP1340 5,000pc -SOD323 -SC79 List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail USMSR220-WP USMSR230-WP USMSR240-WP USMSR250-WP USMSR260-WP ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.



US MICROWAVES Advanced Microwave Components		Fast Switching Speed, Low Capacitance, Plastic Packaged Single PIN Diode USMSMP1340

FEATURES

APPLICATIONS

DIODE

Designed for fast-speed wireless switch applications
Short carrier lifetime
1.0 W resistance, 0.3 pF capacitance
Available lead (Pb)-free and RoHS-compliant MSL-1 @ 250 °C per JEDEC J-STD-020
Available in tape and reel packaging

High-volume switch applications
from 10 MHz to beyond 2 GHz.

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE

The USMSMP1340 series of plastic packaged, surface mountable PIN diodes is designed for high-volume switch applications from 10 MHz to beyond 2 GHz. The short carrier lifetime of typically 100 ns, combined with its thin I region width of nominally 7 µm, results in a fast-speed RF switching PIN diode. The RF performance of the USMSMP1340 series is assured by virtue of its low capacitance (0.3 pF) and low resistance (1.0 Wat 10 mA).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING

All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

MAXIMUM RATINGS (@ 25 °C)
PARAMETER	SYMBOL	USMSMP1340	UNITS
DC Reverse Breakdown Voltage@10µA	V_B	50	V
Operating and Storage Junction Temperature (Reverse Voltage applied)	Top,Tstg	-65 to +150	°C
Power dissipation @ 25 °C lead temperature	P_D	250	mW
ESD human body model		Class 1B
Performance is guaranteed only under the conditions listed in the specifications table and is not guaranteed under the full range(s) described by the Absolute Maximum specifications. Exceeding any of the absolute maximum/minimum specifications may result in permanent damage to the device and will void the warranty.
Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times.

ELECTRICAL SPECIFICATIONS (@ 25 °C)
PARAMETER	SYMBOL	USMSMP1340	UNITS
Reverse Current @50V	V_B	10	µA
Series resistance@1mA,f=100MHz	R_S	typ.1.7	W
Series resistance@5mA,f=100MHz	R_S	typ.1 max.2	W
Series resistance@10mA,f=100MHz	R_S	typ.0.85	W
Carrier lifetime@10mA	TI	typ.100	ns
Total capacitance@5V,1MHz	C_j	typ.0.21	pF
Forward voltage@10mA	V_F	typ.0.85	V
I region width		typ.7	µm

GENERAL DIE INFORMATION
Substrate	Thickness (mils)	Die size (mils)	Bonding pads	Backside metal
Si - Silicon	5±1	a x b ±3	min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier.	Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

DIE LAYOUT - MECHANICAL SPECIFICATIONS

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART #	ORDER QUANTITY	SOD323	U/P($)	SC79	U/P($)
USMSMP1340	100pc	-SOD323		-SC79
USMSMP1340	1,000pc	-SOD323		-SC79
USMSMP1340	5,000pc	-SOD323		-SC79
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. For standard products available from stock, there is a minimum line item order of $320.00. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US Microwaves at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

Last updated: July 01, 2009
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