SMS3922 SURFACE MOUNT GENERAL PURPOSE SCHOTTKY DIODE manufactured by US MICROWAVES

SKYWORKS SMS3922 same as USM SMS3922 SURFACE MOUNT GENERAL PURPOSE SCHOTTKY DIODES FEATURES APPLICATIONS SCHOTTKY DIODE Tight parameter distribution Low power loss, high efficiency Designed for high-volume commercial applications In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The USM SMS39XX series of 8, 20 and 70 V rated low-cost plastic packaged Schottky diodes are designed for general-purpose use in RF applicationsas detectors, mixers and switches and in digital pulse forming applications. All diodes are fully characterized including SPICE model parameters and deliver tight parameter distribution, minimizing performancevariability. They are available in SC-70, SC-79, SOD-323,SOT-23, SOT-143 and LGA packages. Wiring configurations include TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. MAXIMUM RATINGS (@ 25 °C) PARAMETER SYMBOL USMSMS3922 UNITS Peak Repetitive Reverse Voltage VB 8 V Forward current - steady state IF 50 mA Forward current - 1 ms pulse IF 1 A Power dissipation PD 75 mW Operating and Storage Junction Temperature (Reverse Voltage applied) Top,Tstg -65 to +150 °C Soldering temperature +250 for 5 sec °C Junction temperature TJ +150 °C ESD human body model Class 1B Performance is guaranteed only under the conditions listed in the specifications table and is not guaranteed under the full range(s) described by the Absolute Maximum specifications. Exceeding any of the absolute maximum/minimum specifications may result in permanent damage to the device and will void the warranty. Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. ELECTRICAL SPECIFICATIONS (@ 25 °C) PARAMETER SYMBOL USMSMS3922 UNITS Reverse Voltage VB 8 V Reverse current at V=1V IR max.100 nA Forward voltage at IF=1mA VF min.280 ,max.340 mV Forward voltage at IF=10mA VF max.450 mV Total capacitance at 0V CT min.0.63, max.1.03 pF GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal Si - Silicon 10±1 ±3 min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). DIE LAYOUT - MECHANICAL SPECIFICATIONS STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS CODES USM PART # SC79 SOD323 SOT23 USMSMS3922 USMSMS3922-SC79 USMSMS3922-SOD323 USMSMS3922-SOT23 STANDARD PRODUCTS PRICE LIST USM PART # ORDER QUANTITY SC79 U/P($) SOD323 U/P($) SOT23 U/P($) USMSMS3922 100pc -SC79 -SOD323 -SOT23 USMSMS3922 1,000pc -SC79 -SOD323 -SOT23 USMSMS3922 5,000pc -SC79 -SOD323 -SOT23 List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail USMSR220-WP USMSR230-WP USMSR240-WP USMSR250-WP USMSR260-WP ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.



US MICROWAVES Advanced Microwave Components		SURFACE MOUNT GENERAL PURPOSE SCHOTTKY DIODES USM SMS3922

FEATURES

APPLICATIONS

SCHOTTKY DIODE

Tight parameter distribution
Low power loss, high efficiency

Designed for high-volume commercial applications
In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE

The USM SMS39XX series of 8, 20 and 70 V rated low-cost plastic packaged Schottky diodes are designed for general-purpose use in RF applicationsas detectors, mixers and switches and in digital pulse forming applications. All diodes are fully characterized including SPICE model parameters and deliver tight parameter distribution, minimizing performancevariability. They are available in SC-70, SC-79, SOD-323,SOT-23, SOT-143 and LGA packages. Wiring configurations include

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING

All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

MAXIMUM RATINGS (@ 25 °C)
PARAMETER	SYMBOL	USMSMS3922	UNITS
Peak Repetitive Reverse Voltage	V_B	8	V
Forward current - steady state	I_F	50	mA
Forward current - 1 ms pulse	I_F	1	A
Power dissipation	P_D	75	mW
Operating and Storage Junction Temperature (Reverse Voltage applied)	Top,Tstg	-65 to +150	°C
Soldering temperature		+250 for 5 sec	°C
Junction temperature	T_J	+150	°C
ESD human body model		Class 1B
Performance is guaranteed only under the conditions listed in the specifications table and is not guaranteed under the full range(s) described by the Absolute Maximum specifications. Exceeding any of the absolute maximum/minimum specifications may result in permanent damage to the device and will void the warranty. Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times.

ELECTRICAL SPECIFICATIONS (@ 25 °C)
PARAMETER	SYMBOL	USMSMS3922	UNITS
Reverse Voltage	V_B	8	V
Reverse current at V=1V	I_R	max.100	nA
Forward voltage at I_F=1mA	V_F	min.280 ,max.340	mV
Forward voltage at I_F=10mA	V_F	max.450	mV
Total capacitance at 0V	C_T	min.0.63, max.1.03	pF

GENERAL DIE INFORMATION
Substrate	Thickness (mils)	Die size (mils)	Bonding pads	Backside metal
Si - Silicon	10±1	a x b ±3	min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier	Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

DIE LAYOUT - MECHANICAL SPECIFICATIONS

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS CODES
USM PART #	SC79	SOD323	SOT23
USMSMS3922	USMSMS3922-SC79	USMSMS3922-SOD323	USMSMS3922-SOT23

STANDARD PRODUCTS PRICE LIST
USM PART #	ORDER QUANTITY	SC79	U/P($)	SOD323	U/P($)	SOT23	U/P($)	WAFFLE PACKS	U/P($)
USMSMS3922	100pc	-SC79		-SOD323		-SOT23		-WP
USMSMS3922	1,000pc	-SC79		-SOD323		-SOT23		-WP
USMSMS3922	5,000pc	-SC79		-SOD323		-SOT23		-WP
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

Last updated: July 01, 2009
US MICROWAVES \| Tel:408-758-8690 Fax: 408-986-8027 \| USMICROWAVES