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Varactor diode, tuning diode: USMSMV1410-07 Common Cathode Varactor (Tuning) Diode 22pF same as kNOX SMV1410-10 kNOX SMV1410-10 manufactured by US Microwaves - Gold chip technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US Microwaves
Varactor diode, tuning diode: USMSMV1410-07 Common Cathode Varactor (Tuning) Diode 22pF same as kNOX SMV1410-10 kNOX SMV1410-10 manufactured by US Microwaves - Gold chip technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US Microwaves. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire.
Varactor diode, tuning diode: USMSMV1410-07 Common Cathode Varactor (Tuning) Diode 22pF same as kNOX
SMV1410-10 kNOX SMV1410-10 manufactured by US Microwaves - Gold chip technology for known good varactor diode die,
varactor diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated
circuits and advanced microwave components manufactured by US Microwaves Varactor diode, tuning diode: USMSMV1410-07
Common Cathode Varactor (Tuning) Diode 22pF same as kNOX SMV1410-10 kNOX SMV1410-10 manufactured by US Microwaves -
Gold chip technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer
foundry for discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US
Microwaves. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for
system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via
flip chip or chip and wire. US MICROWAVES Common Cathode Varactor (Tuning) Diode 22pF Advanced Microwave Components
USMSMV1410-07 - FLIP CHIP FEATURES APPLICATIONS VARACTOR DIODE - FLIP CHIP Gold metallization RoHS compliant, Lead Free
High reliability flip chip Unique new design Compatible with both chip and wire, flip chip and surface mount assembly.
Chip on Board, System in package SIP Hybrid Circuits Parametric amplifiers, Parametric Oscillators Voltage-controlled
oscillators, PLL circuits Frequency synthesizers USMSMV1410-07 SMV1410-10 Common Cathode Varactor (Tuning) Diode 22pF
VARACTOR DIODES - PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE Varicap Diode, Varactor Diode, Variable Capacitance
Diode or Tuning Diode is a type of diode which has a variable capacitance that is a function of the voltage impressed
on its terminals. Varactors are operated reverse-biased so no current flows, but since the thickness of the depletion
zone varies with the applied bias voltage, the capacitance of the diode can be made to vary. Generally, the depletion
region thickness is proportional to the square root of the applied voltage; and capacitance is inversely proportional
to the depletion region thickness. Thus, the capacitance is inversely proportional to the square root of applied
voltage. All diodes exhibit this phenomenon to some degree, but specially made varactor diodes exploit the effect to
boost the capacitance and variability range achieved - most diode fabrication attempts to achieve the opposite.
Varactors are principally used as a voltage-controlled capacitor, rather than as rectifiers. They are commonly used in
parametric amplifiers, parametric oscillators and voltage-controlled oscillators as part of phase-locked loops and
frequency synthesizers. Flip Chip Varactor diode series are available in die form in four different pad compositions:
-FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications
and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on
Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si,
GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and
SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and
less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental
conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot
withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in
bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the
atmosphere. US Microwaves has reengineered industry standard products and now offers known good die for bare die
applications with gold interconnection and well-engineered materials that further enhance the die reliability. US
Microwaves also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high
reliability SIP solution for medical, military and space applications. DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using US Microwaves in house high reliability semiconductor manufacturing
processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction
passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS
capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete
semiconductors on same chip to obtain standard and custom complex discrete device solutions. All thin film microwave
products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self
passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve
excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications
that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs
proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from
1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid
and multi chip module applications. All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade
mark of Semiconix Corporation. Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit
Forward current IF 150 mA Operating temperature range Top -55 to +125 °C Storage temperature Tstg -65 °C o t +150 °C
°C Electrical Characteristics at TA= 25°C, unless otherwise specified Name Symbol Test Conditions Value Unit Min.
Typ. Max Reverse Breakdown Voltage V(BR)R IR=10 µA 12 V Reverse current IR1 VR=10 V 100 nA Diode capacitance CT1 VR=2
V f=1MHz 17 27 pF Capacitance ratio CT1/CT10 VR=1 V, VR=10 V,f=1MHz 9.5 Figure of merit Q1 VR=2.0 Vdc ,f=50 MHz 200
CROSS REFERENCE PARTS: kNOX SMV1410-10 GENERAL DIE INFORMATION Substrate Thickness [mils] Size mm [mils] Bonding pads
dimensions per drawing Backside Silicon 10±2 0402-3L 1.02x0.51 [40x20] Type Pad metal Thickness Assembly -FC TiW/Au
4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1
Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process:
-FC -GB -GT -AN USMSMV1410-07 kNOX SMV1410-10 kNOX SMV1410-10 Common Cathode Varactor (Tuning) Diode 22pF USMSMV1410-07
kNOX SMV1410-10 kNOX SMV1410-10 Common Cathode Varactor (Tuning) Diode 22pF wire bonding USMSMV1410-07 kNOX SMV1410-10
kNOX SMV1410-10 Common Cathode Varactor (Tuning) Diode 22pFthermosonic USMSMV1410-07 kNOX SMV1410-10 kNOX SMV1410-10
Common Cathode Varactor (Tuning) Diode 22pFthermal USMSMV1410-07 kNOX SMV1410-10 kNOX SMV1410-10 Common Cathode
Varactor (Tuning) Diode 22pFsolder reflow USMSMV1410-07 kNOX SMV1410-10 kNOX SMV1410-10 Common Cathode Varactor
(Tuning) Diode 22pF SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE US Microwaves flip chip components are
designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an
assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly
process. US Microwaves Flip Chip -FC series can be also used for thermosonic wire bonding. US Microwaves Gold Bump -GB
series are flip chips that are thermosonically attached to a circuit. US Microwaves Gold Tin -GT series are flip chips
with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a
substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate.
Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn
process. US Microwaves -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a
simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads;
-align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in
certain applications. US Microwaves Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP
designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount
components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip
chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. US Microwaves Flip
Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as
surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME
MIN QUANTITY U/P($) Flip chip USMSMV1410-07-FC -WP 10000 -FF 45000 Flip chip USMSMV1410-07-FC -WP 50000 -FF 225000 Gold
Bump USMSMV1410-07-GB -WP 10000 -FF 45000 Gold Bump USMSMV1410-07-GB -WP 50000 -FF 225000 Gold-Tin USMSMV1410-07-GT -WP
10000 -FF 45000 Gold-Tin USMSMV1410-07-GT -WP 50000 -FF 225000 Gold/Nickel USMSMV1410-07-AN -WP 10000 -FF 45000
Gold/Nickel USMSMV1410-07-AN -WP 50000 -FF 225000 LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO.
For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - US Microwaves
guarantees continuous supply and availability of any of its standard products provided minimum order quantities are
met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum
order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high
volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD
requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are
available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - US Microwaves accepts only orders placed on line by registered customers. On line orders are verified,
accepted and acknowledged by US Microwaves sales department in writing. Accepted orders are non cancelable binding
contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high
volume and pick and place applications, dice are also shipped on film frame -FF. Products sold for space, military or
medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be
established on a case by case basis. For any special applications, die level KGD qualification requirements, different
packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post"
target="new"> INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line HERE. A copy of the
order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have
to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable
binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom
designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle
packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary.
For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded
film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification
of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability
of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this
information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any
infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise
the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should
not be used within support systems which are intended for surgical implants into the body, to support or sustain life,
in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S.
Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US
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