Varactor diode, tuning diode: USMZV832 Single Varactor (Tuning) Diode 22pF same as ZETEX ZV832BV2TA ZETEX ZV832BV2TA manufactured by US Microwaves - Gold chip technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US Microwaves Varactor diode, tuning diode: USMZV832 Single Varactor (Tuning) Diode 22pF same as ZETEX ZV832BV2TA ZETEX ZV832BV2TA manufactured by US Microwaves - Gold chip technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US Microwaves. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. Varactor diode, tuning diode: USMZV832 Single Varactor (Tuning) Diode 22pF same as ZETEX ZV832BV2TA ZETEX ZV832BV2TA manufactured by US Microwaves - Gold chip technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US Microwaves Varactor diode, tuning diode: USMZV832 Single Varactor (Tuning) Diode 22pF same as ZETEX ZV832BV2TA ZETEX ZV832BV2TA manufactured by US Microwaves - Gold chip technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US Microwaves. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. US MICROWAVES Single Varactor (Tuning) Diode 22pF Advanced Microwave Components USMZV832 - FLIP CHIP FEATURES APPLICATIONS VARACTOR DIODE - FLIP CHIP Gold metallization RoHS compliant, Lead Free High reliability flip chip Unique new design Compatible with both chip and wire, flip chip and surface mount assembly. Chip on Board, System in package SIP Hybrid Circuits Parametric amplifiers, Parametric Oscillators Voltage-controlled oscillators, PLL circuits Frequency synthesizers USMZV832 ZV832BV2TA Single Varactor (Tuning) Diode 22pF VARACTOR DIODES - PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE Varicap Diode, Varactor Diode, Variable Capacitance Diode or Tuning Diode is a type of diode which has a variable capacitance that is a function of the voltage impressed on its terminals. Varactors are operated reverse-biased so no current flows, but since the thickness of the depletion zone varies with the applied bias voltage, the capacitance of the diode can be made to vary. Generally, the depletion region thickness is proportional to the square root of the applied voltage; and capacitance is inversely proportional to the depletion region thickness. Thus, the capacitance is inversely proportional to the square root of applied voltage. All diodes exhibit this phenomenon to some degree, but specially made varactor diodes exploit the effect to boost the capacitance and variability range achieved - most diode fabrication attempts to achieve the opposite. Varactors are principally used as a voltage-controlled capacitor, rather than as rectifiers. They are commonly used in parametric amplifiers, parametric oscillators and voltage-controlled oscillators as part of phase-locked loops and frequency synthesizers. Flip Chip Varactor diode series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. US Microwaves has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. US Microwaves also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using US Microwaves in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 25 V Forward current IF 200 mA Operating temperature range Top -55 ... 150 °C Storage temperature Tstg -55 ... 150 °C Electrical Characteristics at TA= 25°C, unless otherwise specified Name Symbol Test Conditions Value Unit Min. Typ. Max Reverse Breakdown Voltage V(BR)R (IR=10m Adc) 25 Vdc Reverse current IR1 (VR=20 Vdc) 0.2 20 nA Diode capacitance CT1 VR=2V, f=1MHz 20.9 22 23.1 pF Capacitance ratio CT2/CT20 VR=2 V, VR=20 V, f=1 MHz 5 - 6.5 Figure of merit Q1 VR=3.0 Vdc ,f=50 MHz 200 CROSS REFERENCE PARTS: ZETEX ZV832BV2TA GENERAL DIE INFORMATION Substrate Thickness [mils] Size mm [mils] Bonding pads dimensions per drawing Backside Silicon 10±2 0402 1.02x0.51 [40x20] Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN USMZV832 ZETEX ZV832BV2TA ZETEX ZV832BV2TA Single Varactor (Tuning) Diode 22pF USMZV832 ZETEX ZV832BV2TA ZETEX ZV832BV2TA Single Varactor (Tuning) Diode 22pF wire bonding USMZV832 ZETEX ZV832BV2TA ZETEX ZV832BV2TA Single Varactor (Tuning) Diode 22pFthermosonic USMZV832 ZETEX ZV832BV2TA ZETEX ZV832BV2TA Single Varactor (Tuning) Diode 22pFthermal USMZV832 ZETEX ZV832BV2TA ZETEX ZV832BV2TA Single Varactor (Tuning) Diode 22pFsolder reflow USMZV832 ZETEX ZV832BV2TA ZETEX ZV832BV2TA Single Varactor (Tuning) Diode 22pF SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE US Microwaves flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. US Microwaves Flip Chip -FC series can be also used for thermosonic wire bonding. US Microwaves Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. US Microwaves Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. US Microwaves -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. US Microwaves Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. US Microwaves Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip USMZV832-FC -WP 10000 -FF 45000 Flip chip USMZV832-FC -WP 50000 -FF 225000 Gold Bump USMZV832-GB -WP 10000 -FF 45000 Gold Bump USMZV832-GB -WP 50000 -FF 225000 Gold-Tin USMZV832-GT -WP 10000 -FF 45000 Gold-Tin USMZV832-GT -WP 50000 -FF 225000 Gold/Nickel USMZV832-AN -WP 10000 -FF 45000 Gold/Nickel USMZV832-AN -WP 50000 -FF 225000 LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - US Microwaves guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - US Microwaves accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by US Microwaves sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 ©1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.

 
 
US MICROWAVES   Single Varactor (Tuning) Diode 22pF
Advanced Microwave Components   USMZV832 - FLIP CHIP
 
 

FEATURES
APPLICATIONS
VARACTOR DIODE - FLIP CHIP
Gold metallization
RoHS compliant, Lead Free
High reliability flip chip
Unique new design
Compatible with both chip and wire, flip chip and surface mount assembly.
Chip on Board, System in package SIP
Hybrid Circuits
Parametric amplifiers, Parametric Oscillators
Voltage-controlled oscillators, PLL circuits
Frequency synthesizers
 USMZV832 ZV832BV2TA Single Varactor (Tuning) Diode 22pF


VARACTOR DIODES - PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
Varicap Diode, Varactor Diode, Variable Capacitance Diode or Tuning Diode is a type of diode which has a variable capacitance that is a function of the voltage impressed on its terminals. Varactors are operated reverse-biased so no current flows, but since the thickness of the depletion zone varies with the applied bias voltage, the capacitance of the diode can be made to vary. Generally, the depletion region thickness is proportional to the square root of the applied voltage; and capacitance is inversely proportional to the depletion region thickness. Thus, the capacitance is inversely proportional to the square root of applied voltage.
All diodes exhibit this phenomenon to some degree, but specially made varactor diodes exploit the effect to boost the capacitance and variability range achieved - most diode fabrication attempts to achieve the opposite. Varactors are principally used as a voltage-controlled capacitor, rather than as rectifiers. They are commonly used in parametric amplifiers, parametric oscillators and voltage-controlled oscillators as part of phase-locked loops and frequency synthesizers.
Flip Chip Varactor diode series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. US Microwaves has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. US Microwaves also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications.

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using US Microwaves in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR 25 V
Forward current IF 200 mA
Operating temperature range Top -55 ... 150 °C
Storage temperature Tstg -55 ... 150 °C

Electrical Characteristics at TA= 25°C, unless otherwise specified
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Reverse Breakdown Voltage V(BR)R (IR=10m Adc) 25 Vdc
Reverse current IR1 (VR=20 Vdc) 0.2 20 nA
Diode capacitance CT1 VR=2V, f=1MHz 20.9 22 23.1 pF
Capacitance ratio CT2/CT20 VR=2 V, VR=20 V, f=1 MHz 5 - 6.5
Figure of merit Q1 VR=3.0 Vdc ,f=50 MHz 200
 
CROSS REFERENCE PARTS: ZETEX ZV832BV2TA

GENERAL DIE INFORMATION
Substrate Thickness
[mils]		 Size mm
[mils] 		Bonding pads dimensions per drawing Backside
Silicon 10±2 0402
1.02x0.51
[40x20]
TypePad metalThicknessAssembly
-FCTiW/Au4µm±1Wire bonding or Silver epoxy
-GBTiW/Au25µm±2.5Thermosonic
-GTTi/Pt/AuSn5µm±1Reflow
-ANNi/Au5µm±1Solder reflow
 Optional backside coating and/or marking.

LAYOUT / DIMENSIONS / PAD LOCATIONS
Click to select process: -FC -GB -GT -AN
USMZV832 ZETEX ZV832BV2TA ZETEX ZV832BV2TA Single Varactor (Tuning) Diode 22pF USMZV832 ZETEX ZV832BV2TA ZETEX ZV832BV2TA Single Varactor (Tuning) Diode 22pF
wire bonding USMZV832 ZETEX ZV832BV2TA ZETEX ZV832BV2TA Single Varactor (Tuning) Diode 22pF

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
US Microwaves flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. US Microwaves Flip Chip -FC series can be also used for thermosonic wire bonding. US Microwaves Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. US Microwaves Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process.
US Microwaves -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications.
US Microwaves Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc.
US Microwaves Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages.

STANDARD PRODUCTS ORDERING INFORMATION

VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($)
Flip chip USMZV832-FC -WP 10000 -FF 45000
Flip chip USMZV832-FC -WP 50000 -FF 225000
Gold Bump USMZV832-GB -WP 10000 -FF 45000
Gold Bump USMZV832-GB -WP 50000 -FF 225000
Gold-Tin USMZV832-GT -WP 10000 -FF 45000
Gold-Tin USMZV832-GT -WP 50000 -FF 225000
Gold/Nickel USMZV832-AN -WP 10000 -FF 45000
Gold/Nickel USMZV832-AN -WP 50000 -FF 225000

PRICES - Listed prices are only for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by US Microwaves at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - US Microwaves guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - US Microwaves accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by US Microwaves sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    

ORDERING: Order on line HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales

Last updated: July 06, 2009
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©1990-2024 US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.