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Varactor diode, tuning diode: USMMV2112 Single Varactor (Tuning) Diode 10mA same as kNOX MV2112, Motorola MV2112 kNOX MV2112 manufactured by US Microwaves - Gold chip technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US Microwaves
Varactor diode, tuning diode: USMMV2112 Single Varactor (Tuning) Diode 10mA same as kNOX MV2112, Motorola MV2112 kNOX MV2112 manufactured by US Microwaves - Gold chip technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US Microwaves. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire.
Varactor diode, tuning diode: USMMV2112 Single Varactor (Tuning) Diode 10mA same as kNOX MV2112, Motorola
MV2112 kNOX MV2112 manufactured by US Microwaves - Gold chip technology for known good varactor diode die, varactor
diode flip chip, varactor diode bare die, wafer foundry for discrete semiconductors, microwave integrated circuits and
advanced microwave components manufactured by US Microwaves Varactor diode, tuning diode: USMMV2112 Single Varactor
(Tuning) Diode 10mA same as kNOX MV2112, Motorola MV2112 kNOX MV2112 manufactured by US Microwaves - Gold chip
technology for known good varactor diode die, varactor diode flip chip, varactor diode bare die, wafer foundry for
discrete semiconductors, microwave integrated circuits and advanced microwave components manufactured by US Microwaves.
Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in
package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip
or chip and wire. US MICROWAVES Single Varactor (Tuning) Diode 10mA Advanced Microwave Components USMMV2112 - BARE DIE
FEATURES APPLICATIONS VARACTOR DIODE - BARE DIE Gold metallization RoHS compliant, Lead Free High reliability bare die
Compatible with chip and wire assemblies Available with top cathode or top anode Chip on Board, System in package SIP
Hybrid Circuits Parametric amplifiers, Parametric Oscillators Voltage-controlled oscillators, PLL circuits Frequency
synthesizers USMMV2112 MV2112 Single Varactor (Tuning) Diode 10mA VARACTOR DIODES - PRODUCT DESCRIPTION AND SHORT
APPLICATION NOTE Varicap Diode, Varactor Diode, Variable Capacitance Diode or Tuning Diode is a type of diode which has
a variable capacitance that is a function of the voltage impressed on its terminals. Varactors are operated
reverse-biased so no current flows, but since the thickness of the depletion zone varies with the applied bias voltage,
the capacitance of the diode can be made to vary. Generally, the depletion region thickness is proportional to the
square root of the applied voltage; and capacitance is inversely proportional to the depletion region thickness. Thus,
the capacitance is inversely proportional to the square root of applied voltage. All diodes exhibit this phenomenon to
some degree, but specially made varactor diodes exploit the effect to boost the capacitance and variability range
achieved - most diode fabrication attempts to achieve the opposite. Varactors are principally used as a
voltage-controlled capacitor, rather than as rectifiers. They are commonly used in parametric amplifiers, parametric
oscillators and voltage-controlled oscillators as part of phase-locked loops and frequency synthesizers. Single
Varactor Diodes BD series are available in die form in two configurations, Top Cathode XXXX-BD or Top Anode XXXXA-BD.
In die form, these products are ideal for high reliability hybrid circuits and multi chip module applications. Common
Cathode or Common Anode Varactor Diodes BD series are available in die form in single configuration: Common Cathode in
TOP ANODE configuration and Common Anode in TOP CATHODE configuration. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE
- SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare
die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC
(System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to
redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to
withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no
longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor
devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to
moisture and corrosive components of the atmosphere. US Microwaves has reengineered industry standard products and now
offers known good die for bare die applications with gold interconnection and well-engineered materials that further
enhance the die reliability. US Microwaves also offers Silicon Printed Circuit Board technology with integrated passive
components as a complete high reliability SIP solution for medical, military and space applications. DISCRETE
SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using US Microwaves in house high
reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion
implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for
best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily
integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including
ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS
capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution
for all applications that require low noise, long term stability and excellent performance at very high frequencies. US
Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet
resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for
high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured using GOLD CHIP
TECHNOLOGY™ a trade mark of Semiconix Corporation. Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit Operating temperature range Top -65 to + 175° C °C Storage temperature Tstg -65 to +
200° C °C Electrical Characteristics at TA= 25°C, unless otherwise specified Name Symbol Test Conditions Value Unit
Min. Typ. Max Reverse Breakdown Voltage V(BR)R IR=10 µA 30 V Reverse current IR1 VR=25 V 20 nA Reverse current IR2
VR=25 V,Ta=150 C 20 mA Diode capacitance CT1 VR=4 V f=1MHz 56 pF Capacitance ratio CT2/CT30 VR=2 V, VR=30 V,f=1MHz 2.6
Figure of merit Q1 VR=4.0 Vdc ,f=1 MHz 150 CROSS REFERENCE PARTS: kNOX MV2112, Motorola MV2112 GENERAL DIE INFORMATION
Substrate Thickness [mils] Die size [mils] Bonding pads Backside metallization Silicon 6±1 10x20±2 Pad metal is
TiW/Au, 4µm±1 thick, 99.99% electroplated gold with TiW barrier. Custom metallization available upon request. P/N
Metal Die attach process -BD0 Au/Si Au/Si eutectic -BD1 Ti/Pd/Au AuSn,AuGe -BD2 Ti/Pt/Au AuSn,AuGe -BD3 Ti/Ni/Au Soft
Solder SAC -BD4 Ti/Pt/AuSn AuSn eutectic LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select → TOP CATHODE TOP ANODE
TOP CATHODE USMMV2112 kNOX MV2112, Motorola MV2112 kNOX MV2112 Single Varactor (Tuning) Diode 10mATOP ANODE USMMV2112
kNOX MV2112, Motorola MV2112 kNOX MV2112 Single Varactor (Tuning) Diode 10mA cathode USMMV2112 kNOX MV2112, Motorola
MV2112 kNOX MV2112 Single Varactor (Tuning) Diode 10mAanode USMMV2112 kNOX MV2112, Motorola MV2112 kNOX MV2112 Single
Varactor (Tuning) Diode 10mA USMMV2112 kNOX MV2112, Motorola MV2112 kNOX MV2112 Single Varactor (Tuning) Diode 10mA
SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE US Microwaves standard bare die components are designed for
thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au
are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au,
Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be
used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple
plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and
RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to
220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle
and are conducive to increased contact resistance and or bond failure. STANDARD PRODUCTS ORDERING INFORMATION VERSION
SMS P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Top cathode USMMV2112-BD -WP 10000 -FF 45000 Top
cathode USMMV2112-BD -WP 50000 -FF 225000 Top anode USMMV2112A-BD -WP 10000 -FF 45000 Top anode USMMV2112A-BD -WP 50000
-FF 225000 LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for
an update on minim orders and lead times. CONTINOUS SUPPLY - US Microwaves guarantees continuous supply and
availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom
products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100%
functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place
applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or
custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have
issued firm orders pending qualification of product in a particular application. ORDERING - US Microwaves accepts only
orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by US Microwaves
sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional
tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice
are also shipped on film frame -FF. Products sold for space, military or medical applications, element evaluation
and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For
any special applications, die level KGD qualification requirements, different packaging or custom configurations,
contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE US
Microwaves P/N Quantity E-mail ORDERING: Order on line HERE. A copy of the order along with an order confirmation
receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and
acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY:
Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks
ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and
wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc,
devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices
may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are
available only for customers that have issued firm orders pending qualification of product in a particular application.
GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided
minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as
possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of
third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its
product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within
support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space
equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home
Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 ©1990- US MICROWAVES All rights reserved. No
material from this site may be used or reproduced without permission.
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