HSKALNI20xxxyyy Aluminum Nitride thermal management, therma plane, Laser diode submounts AlN - 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks - High heat transfer rate, High thermal conductivity Aluminum Nitride heat sinks and stand offs manufactured by US Microwaves HSKALNI20xxxyyy,thermal management,therma plane,Laser diode submounts,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers HSKALNI20xxxyyy Aluminum Nitride thermal management, therma plane, Laser diode submounts AlN - 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks - High heat transfer rate, High thermal conductivity Aluminum Nitride heat sinks and stand offs manufactured by US Microwaves HSKALNI20xxxyyy,thermal management,therma plane,Laser diode submounts,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers US MICROWAVES 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks Advanced Microwave Components HSKALNI20xxxyyy FEATURES APPLICATIONS AlN Isolated Heat Sink High heat transfer rate High thermal conductivity Very good thermal contact Very good thermal shock resistance Microwave hybrid circuits Mount for GaAs microwave active devices Solid state RF power amplifiers 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks HSKALNI20xxxyyy HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The HSKALNI20xxxyyy series of microwave 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink ELECTRICAL/MECHANICAL CHARACTERISTICS LENGTH [mils] WIDTH [mils] PARAMETER SYMBOL VALUE UNITS - - Thickness T 20 mils 10 10 Thermal Resistance Rth 46.32 K/W Thermal Conductivity k 2.16E-02 W/K Capacitance C 0.01 pF 20 10 Thermal Resistance Rth 23.16 K/W Thermal Conductivity k 4.32E-02 W/K Capacitance C 0.02 pF 30 10 Thermal Resistance Rth 15.44 K/W Thermal Conductivity k 6.48E-02 W/K Capacitance C 0.029 pF 20 20 Thermal Resistance Rth 11.58 K/W Thermal Conductivity k 8.64E-02 W/K Capacitance C 0.039 pF 40 20 Thermal Resistance Rth 5.79 K/W Thermal Conductivity k 1.73E-01 W/K Capacitance C 0.078 pF 60 20 Thermal Resistance Rth 3.86 K/W Thermal Conductivity k 2.59E-01 W/K Capacitance C 0.117 pF 30 30 Thermal Resistance Rth 5.15 K/W Thermal Conductivity k 1.94E-01 W/K Capacitance C 0.088 pF 60 30 Thermal Resistance Rth 2.57 K/W Thermal Conductivity k 3.89E-01 W/K Capacitance C 0.176 pF 120 30 Thermal Resistance Rth 1.29 K/W Thermal Conductivity k 7.75E-01 W/K Capacitance C 0.352 pF 40 40 Thermal Resistance Rth 2.89 K/W Thermal Conductivity k 3.46E-01 W/K Capacitance C 0.157 pF 80 40 Thermal Resistance Rth 1.45 K/W Thermal Conductivity k 6.90E-01 W/K Capacitance C 0.313 pF 120 40 Thermal Resistance Rth 0.96 K/W Thermal Conductivity k 1.04E+00 W/K Capacitance C 0.47 pF 160 40 Thermal Resistance Rth 0.72 K/W Thermal Conductivity k 1.39E+00 W/K Capacitance C 0.626 pF 50 50 Thermal Resistance Rth 1.85 K/W Thermal Conductivity k 5.41E-01 W/K Capacitance C 0.245 pF 80 50 Thermal Resistance Rth 1.16 K/W Thermal Conductivity k 8.62E-01 W/K Capacitance C 0.391 pF 100 50 Thermal Resistance Rth 0.93 K/W Thermal Conductivity k 1.08E+00 W/K Capacitance C 0.489 pF 120 60 Thermal Resistance Rth 0.64 K/W Thermal Conductivity k 1.56E+00 W/K Capacitance C 0.704 pF 200 100 Thermal Resistance Rth 0.23 K/W Thermal Conductivity k 4.35E+00 W/K Capacitance C 1.957 pF 180 120 Thermal Resistance Rth 0.21 K/W Thermal Conductivity k 4.76E+00 W/K Capacitance C 2.113 pF 240 120 Thermal Resistance Rth 0.16 K/W Thermal Conductivity k 6.25E+00 W/K Capacitance C 2.818 pF 250 120 Thermal Resistance Rth 0.15 K/W Thermal Conductivity k 6.67E+00 W/K Capacitance C 2.935 pF 290 170 Thermal Resistance Rth 0.09 K/W Thermal Conductivity k 1.11E+01 W/K Capacitance C 4.823 pF 230 180 Thermal Resistance Rth 0.11 K/W Thermal Conductivity k 9.09E+00 W/K Capacitance C 4.05 pF 220 250 Thermal Resistance Rth 0.08 K/W Thermal Conductivity k 1.25E+01 W/K Capacitance C 5.381 pF 250 250 Thermal Resistance Rth 0.07 K/W Thermal Conductivity k 1.43E+01 W/K Capacitance C 6.114 pF 370 250 Thermal Resistance Rth 0.05 K/W Thermal Conductivity k 2.00E+01 W/K Capacitance C 9.049 pF ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Case style AlN [Aluminum Nitride] 20±0.5 xxxxyyy±2 Frontside metal Backside metal The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. L x W mils, 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks HSKALNI20xxxyyy All US Microwaves Aluminum Nitride Isolated Heat Sink products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). Aluminum Nitride Isolated Heat Sink STANDARD PRODUCTS ORDERING INFORMATION 20 mils Aluminum Nitride Isolated Heat Sink STANDARD PRODUCTS [BD0 TiW/Au] LENGTH [mils] WIDTH [mils] US MICROWAVES PART NUMBER WAFFLE PACKS MINIM ORDER QTY U/P [$] ORDER RFQ 10 10 HSKALNI20010010-BD0 -WP 241 $1.328 ORDER 20 10 HSKALNI20020010-BD0 -WP 220 $1.455 ORDER 30 10 HSKALNI20030010-BD0 -WP 203 $1.576 ORDER 20 20 HSKALNI20020020-BD0 -WP 196 $1.633 ORDER 40 20 HSKALNI20040020-BD0 -WP 161 $1.988 ORDER 60 20 HSKALNI20060020-BD0 -WP 137 $2.336 ORDER 30 30 HSKALNI20030030-BD0 -WP 157 $2.038 ORDER 60 30 HSKALNI20060030-BD0 -WP 118 $2.712 ORDER 120 30 HSKALNI20120030-BD0 -WP 79 $4.051 ORDER 40 40 HSKALNI20040040-BD0 -WP 126 $2.540 ORDER 80 40 HSKALNI20080040-BD0 -WP 88 $3.636 ORDER 120 40 HSKALNI20120040-BD0 -WP 67 $4.776 ORDER 160 40 HSKALNI20160040-BD0 -WP 55 $5.818 ORDER 50 50 HSKALNI20050050-BD0 -WP RFQ 80 50 HSKALNI20080050-BD0 -WP RFQ 100 50 HSKALNI20100050-BD0 -WP RFQ 120 60 HSKALNI20120060-BD0 -WP RFQ 200 100 HSKALNI20200100-BD0 -WP RFQ 180 120 HSKALNI20180120-BD0 -WP RFQ 240 120 HSKALNI20240120-BD0 -WP RFQ 250 120 HSKALNI20250120-BD0 -WP RFQ 290 170 HSKALNI20290170-BD0 -WP RFQ 230 180 HSKALNI20230180-BD0 -WP RFQ 220 250 HSKALNI20220250-BD0 -WP RFQ 250 250 HSKALNI20250250-BD0 -WP RFQ 370 250 HSKALNI20370250-BD0 -WP RFQ HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink: Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Aluminum Nitride Isolated Heat Sink may be ordered on line HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks AlN SHIPPING/PACKAGING: All 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks SAMPLES: Samples of 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales

 
 
US MICROWAVES   20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks
Advanced Microwave Components   HSKALNI20xxxyyy
 
 

FEATURES
APPLICATIONS
AlN Isolated Heat Sink
High heat transfer rate
High thermal conductivity
Very good thermal contact
Very good thermal shock resistance
Microwave hybrid circuits
Mount for GaAs microwave active devices
Solid state RF power amplifiers
20 mils thick gold coated thin film Aluminum Nitride Isolated  heat sinks HSKALNI20xxxyyy

HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink
PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The HSKALNI20xxxyyy series of microwave 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55C to +125C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.

HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink
ELECTRICAL/MECHANICAL CHARACTERISTICS
LENGTH [mils] WIDTH [mils] PARAMETER SYMBOL VALUE UNITS
- - Thickness T 20 mils
10 10 Thermal Resistance Rth 46.32 K/W
Thermal Conductivity k 2.16E-02 W/K
Capacitance C 0.01 pF
20 10 Thermal Resistance Rth 23.16 K/W
Thermal Conductivity k 4.32E-02 W/K
Capacitance C 0.02 pF
30 10 Thermal Resistance Rth 15.44 K/W
Thermal Conductivity k 6.48E-02 W/K
Capacitance C 0.029 pF
20 20 Thermal Resistance Rth 11.58 K/W
Thermal Conductivity k 8.64E-02 W/K
Capacitance C 0.039 pF
40 20 Thermal Resistance Rth 5.79 K/W
Thermal Conductivity k 1.73E-01 W/K
Capacitance C 0.078 pF
60 20 Thermal Resistance Rth 3.86 K/W
Thermal Conductivity k 2.59E-01 W/K
Capacitance C 0.117 pF
30 30 Thermal Resistance Rth 5.15 K/W
Thermal Conductivity k 1.94E-01 W/K
Capacitance C 0.088 pF
60 30 Thermal Resistance Rth 2.57 K/W
Thermal Conductivity k 3.89E-01 W/K
Capacitance C 0.176 pF
120 30 Thermal Resistance Rth 1.29 K/W
Thermal Conductivity k 7.75E-01 W/K
Capacitance C 0.352 pF
40 40 Thermal Resistance Rth 2.89 K/W
Thermal Conductivity k 3.46E-01 W/K
Capacitance C 0.157 pF
80 40 Thermal Resistance Rth 1.45 K/W
Thermal Conductivity k 6.90E-01 W/K
Capacitance C 0.313 pF
120 40 Thermal Resistance Rth 0.96 K/W
Thermal Conductivity k 1.04E+00 W/K
Capacitance C 0.47 pF
160 40 Thermal Resistance Rth 0.72 K/W
Thermal Conductivity k 1.39E+00 W/K
Capacitance C 0.626 pF
50 50 Thermal Resistance Rth 1.85 K/W
Thermal Conductivity k 5.41E-01 W/K
Capacitance C 0.245 pF
80 50 Thermal Resistance Rth 1.16 K/W
Thermal Conductivity k 8.62E-01 W/K
Capacitance C 0.391 pF
100 50 Thermal Resistance Rth 0.93 K/W
Thermal Conductivity k 1.08E+00 W/K
Capacitance C 0.489 pF
120 60 Thermal Resistance Rth 0.64 K/W
Thermal Conductivity k 1.56E+00 W/K
Capacitance C 0.704 pF
200 100 Thermal Resistance Rth 0.23 K/W
Thermal Conductivity k 4.35E+00 W/K
Capacitance C 1.957 pF
180 120 Thermal Resistance Rth 0.21 K/W
Thermal Conductivity k 4.76E+00 W/K
Capacitance C 2.113 pF
240 120 Thermal Resistance Rth 0.16 K/W
Thermal Conductivity k 6.25E+00 W/K
Capacitance C 2.818 pF
250 120 Thermal Resistance Rth 0.15 K/W
Thermal Conductivity k 6.67E+00 W/K
Capacitance C 2.935 pF
290 170 Thermal Resistance Rth 0.09 K/W
Thermal Conductivity k 1.11E+01 W/K
Capacitance C 4.823 pF
230 180 Thermal Resistance Rth 0.11 K/W
Thermal Conductivity k 9.09E+00 W/K
Capacitance C 4.05 pF
220 250 Thermal Resistance Rth 0.08 K/W
Thermal Conductivity k 1.25E+01 W/K
Capacitance C 5.381 pF
250 250 Thermal Resistance Rth 0.07 K/W
Thermal Conductivity k 1.43E+01 W/K
Capacitance C 6.114 pF
370 250 Thermal Resistance Rth 0.05 K/W
Thermal Conductivity k 2.00E+01 W/K
Capacitance C 9.049 pF
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink
GENERAL DIE INFORMATION
Substrate Thickness [mils] Size [mils] Case style
AlN [Aluminum Nitride] 20±0.5 xxxxyyy±2  
Frontside metal Backside metal
The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders.
L x W mils, 20 mils thick gold coated thin film Aluminum Nitride Isolated  heat sinks HSKALNI20xxxyyy
All US Microwaves Aluminum Nitride Isolated Heat Sink products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).

Aluminum Nitride Isolated Heat Sink STANDARD PRODUCTS ORDERING INFORMATION

20 mils Aluminum Nitride Isolated Heat Sink STANDARD PRODUCTS [BD0 TiW/Au]
LENGTH
[mils]
WIDTH
[mils]
US MICROWAVES
PART NUMBER
WAFFLE
PACKS
MINIM ORDER
QTY
U/P
[$]
ORDER
RFQ
10 10 HSKALNI20010010-BD0 -WP 241 $1.328 ORDER
20 10 HSKALNI20020010-BD0 -WP 220 $1.455 ORDER
30 10 HSKALNI20030010-BD0 -WP 203 $1.576 ORDER
20 20 HSKALNI20020020-BD0 -WP 196 $1.633 ORDER
40 20 HSKALNI20040020-BD0 -WP 161 $1.988 ORDER
60 20 HSKALNI20060020-BD0 -WP 137 $2.336 ORDER
30 30 HSKALNI20030030-BD0 -WP 157 $2.038 ORDER
60 30 HSKALNI20060030-BD0 -WP 118 $2.712 ORDER
120 30 HSKALNI20120030-BD0 -WP 79 $4.051 ORDER
40 40 HSKALNI20040040-BD0 -WP 126 $2.540 ORDER
80 40 HSKALNI20080040-BD0 -WP 88 $3.636 ORDER
120 40 HSKALNI20120040-BD0 -WP 67 $4.776 ORDER
160 40 HSKALNI20160040-BD0 -WP 55 $5.818 ORDER
50 50 HSKALNI20050050-BD0 -WP     RFQ
80 50 HSKALNI20080050-BD0 -WP     RFQ
100 50 HSKALNI20100050-BD0 -WP     RFQ
120 60 HSKALNI20120060-BD0 -WP     RFQ
200 100 HSKALNI20200100-BD0 -WP     RFQ
180 120 HSKALNI20180120-BD0 -WP     RFQ
240 120 HSKALNI20240120-BD0 -WP     RFQ
250 120 HSKALNI20250120-BD0 -WP     RFQ
290 170 HSKALNI20290170-BD0 -WP     RFQ
230 180 HSKALNI20230180-BD0 -WP     RFQ
220 250 HSKALNI20220250-BD0 -WP     RFQ
250 250 HSKALNI20250250-BD0 -WP     RFQ
370 250 HSKALNI20370250-BD0 -WP     RFQ
HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink: List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

STANDARD PRODUCTS AVAILABLE FROM STOCK - ORDERING INFORMATION
USM P/NMIN QTYU/PORDER/RFQSTOCK QTYU/PORDER/RFQ
No part available from stock

HSKALNI20xxxyyy Aluminum Nitride Isolated Heat Sink INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Aluminum Nitride Isolated Heat Sink may be ordered on line HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks AlN products packaged in waffle packs is 2-4 weeks ARO. For custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, heat sink devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples of 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all 20 mils thick gold coated thin film Aluminum Nitride Isolated heat sinks standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.


Last updated: September 24, 2010
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