| HSKSII20xxxyyy Silicon thermal management, therma plane, Laser diode submounts Si - 20 mils thick gold coated thin film Silicon Isolated heat sinks - High heat transfer rate, High thermal conductivity Silicon heat sinks and stand offs manufactured by US Microwaves HSKSII20xxxyyy,thermal management,therma plane,Laser diode submounts,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers HSKSII20xxxyyy Silicon thermal management, therma plane, Laser diode submounts Si - 20 mils thick gold coated thin film Silicon Isolated heat sinks - High heat transfer rate, High thermal conductivity Silicon heat sinks and stand offs manufactured by US Microwaves HSKSII20xxxyyy,thermal management,therma plane,Laser diode submounts,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers US MICROWAVES 20 mils thick gold coated thin film Silicon Isolated heat sinks Advanced Microwave Components HSKSII20xxxyyy FEATURES APPLICATIONS Si Isolated Heat Sink High heat transfer rate High thermal conductivity Very good thermal contact Very good thermal shock resistance Microwave hybrid circuits Mount for GaAs microwave active devices Solid state RF power amplifiers 20 mils thick gold coated thin film Silicon Isolated heat sinks HSKSII20xxxyyy HSKSII20xxxyyy Silicon Isolated Heat Sink PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The HSKSII20xxxyyy series of microwave 20 mils thick gold coated thin film Silicon Isolated heat sinks TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING HSKSII20xxxyyy Silicon Isolated Heat Sink ELECTRICAL/MECHANICAL CHARACTERISTICS LENGTH [mils] WIDTH [mils] PARAMETER SYMBOL VALUE UNITS - - Thickness T 20 mils 10 10 Thermal Resistance Rth 52.49 K/W Thermal Conductivity k 1.91E-02 W/K Capacitance C 0.013 pF 20 10 Thermal Resistance Rth 26.25 K/W Thermal Conductivity k 3.81E-02 W/K Capacitance C 0.027 pF 30 10 Thermal Resistance Rth 17.5 K/W Thermal Conductivity k 5.71E-02 W/K Capacitance C 0.04 pF 20 20 Thermal Resistance Rth 13.12 K/W Thermal Conductivity k 7.62E-02 W/K Capacitance C 0.054 pF 40 20 Thermal Resistance Rth 6.56 K/W Thermal Conductivity k 1.52E-01 W/K Capacitance C 0.108 pF 60 20 Thermal Resistance Rth 4.37 K/W Thermal Conductivity k 2.29E-01 W/K Capacitance C 0.162 pF 30 30 Thermal Resistance Rth 5.83 K/W Thermal Conductivity k 1.72E-01 W/K Capacitance C 0.121 pF 60 30 Thermal Resistance Rth 2.92 K/W Thermal Conductivity k 3.42E-01 W/K Capacitance C 0.243 pF 120 30 Thermal Resistance Rth 1.46 K/W Thermal Conductivity k 6.85E-01 W/K Capacitance C 0.486 pF 40 40 Thermal Resistance Rth 3.28 K/W Thermal Conductivity k 3.05E-01 W/K Capacitance C 0.216 pF 80 40 Thermal Resistance Rth 1.64 K/W Thermal Conductivity k 6.10E-01 W/K Capacitance C 0.432 pF 120 40 Thermal Resistance Rth 1.09 K/W Thermal Conductivity k 9.17E-01 W/K Capacitance C 0.648 pF 160 40 Thermal Resistance Rth 0.82 K/W Thermal Conductivity k 1.22E+00 W/K Capacitance C 0.864 pF 50 50 Thermal Resistance Rth 2.1 K/W Thermal Conductivity k 4.76E-01 W/K Capacitance C 0.337 pF 80 50 Thermal Resistance Rth 1.31 K/W Thermal Conductivity k 7.63E-01 W/K Capacitance C 0.54 pF 100 50 Thermal Resistance Rth 1.05 K/W Thermal Conductivity k 9.52E-01 W/K Capacitance C 0.675 pF 120 60 Thermal Resistance Rth 0.73 K/W Thermal Conductivity k 1.37E+00 W/K Capacitance C 0.972 pF 200 100 Thermal Resistance Rth 0.26 K/W Thermal Conductivity k 3.85E+00 W/K Capacitance C 2.699 pF 180 120 Thermal Resistance Rth 0.24 K/W Thermal Conductivity k 4.17E+00 W/K Capacitance C 2.915 pF 240 120 Thermal Resistance Rth 0.18 K/W Thermal Conductivity k 5.56E+00 W/K Capacitance C 3.886 pF 250 120 Thermal Resistance Rth 0.17 K/W Thermal Conductivity k 5.88E+00 W/K Capacitance C 4.048 pF 290 170 Thermal Resistance Rth 0.11 K/W Thermal Conductivity k 9.09E+00 W/K Capacitance C 6.652 pF 230 180 Thermal Resistance Rth 0.13 K/W Thermal Conductivity k 7.69E+00 W/K Capacitance C 5.586 pF 220 250 Thermal Resistance Rth 0.1 K/W Thermal Conductivity k 1.00E+01 W/K Capacitance C 7.422 pF 250 250 Thermal Resistance Rth 0.08 K/W Thermal Conductivity k 1.25E+01 W/K Capacitance C 8.434 pF 370 250 Thermal Resistance Rth 0.06 K/W Thermal Conductivity k 1.67E+01 W/K Capacitance C 12.482 pF ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. HSKSII20xxxyyy Silicon Isolated Heat Sink GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Case style Si [Silicon] 20±0.5 xxxxyyy±2 Frontside metal Backside metal The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. L x W mils, 20 mils thick gold coated thin film Silicon Isolated heat sinks HSKSII20xxxyyy All US Microwaves Silicon Isolated Heat Sink products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). Silicon Isolated Heat Sink STANDARD PRODUCTS ORDERING INFORMATION 20 mils Silicon Isolated Heat Sink STANDARD PRODUCTS [BD0 TiW/Au] LENGTH [mils] WIDTH [mils] US MICROWAVES PART NUMBER WAFFLE PACKS MINIM ORDER QTY U/P [$] ORDER RFQ 10 10 HSKSII20010010-BD0 -WP 241 $1.328 ORDER 20 10 HSKSII20020010-BD0 -WP 220 $1.455 ORDER 30 10 HSKSII20030010-BD0 -WP 203 $1.576 ORDER 20 20 HSKSII20020020-BD0 -WP 196 $1.633 ORDER 40 20 HSKSII20040020-BD0 -WP 161 $1.988 ORDER 60 20 HSKSII20060020-BD0 -WP 137 $2.336 ORDER 30 30 HSKSII20030030-BD0 -WP 157 $2.038 ORDER 60 30 HSKSII20060030-BD0 -WP 118 $2.712 ORDER 120 30 HSKSII20120030-BD0 -WP 79 $4.051 ORDER 40 40 HSKSII20040040-BD0 -WP 126 $2.540 ORDER 80 40 HSKSII20080040-BD0 -WP 88 $3.636 ORDER 120 40 HSKSII20120040-BD0 -WP 67 $4.776 ORDER 160 40 HSKSII20160040-BD0 -WP 55 $5.818 ORDER 50 50 HSKSII20050050-BD0 -WP RFQ 80 50 HSKSII20080050-BD0 -WP RFQ 100 50 HSKSII20100050-BD0 -WP RFQ 120 60 HSKSII20120060-BD0 -WP RFQ 200 100 HSKSII20200100-BD0 -WP RFQ 180 120 HSKSII20180120-BD0 -WP RFQ 240 120 HSKSII20240120-BD0 -WP RFQ 250 120 HSKSII20250120-BD0 -WP RFQ 290 170 HSKSII20290170-BD0 -WP RFQ 230 180 HSKSII20230180-BD0 -WP RFQ 220 250 HSKSII20220250-BD0 -WP RFQ 250 250 HSKSII20250250-BD0 -WP RFQ 370 250 HSKSII20370250-BD0 -WP RFQ HSKSII20xxxyyy Silicon Isolated Heat Sink: Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. HSKSII20xxxyyy Silicon Isolated Heat Sink INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Silicon Isolated Heat Sink may be ordered on line HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for 20 mils thick gold coated thin film Silicon Isolated heat sinks Si SHIPPING/PACKAGING: All 20 mils thick gold coated thin film Silicon Isolated heat sinks SAMPLES: Samples of 20 mils thick gold coated thin film Silicon Isolated heat sinks GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all 20 mils thick gold coated thin film Silicon Isolated heat sinks standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales |
| US MICROWAVES | 20 mils thick gold coated thin film Silicon Isolated heat sinks | |
| Advanced Microwave Components | HSKSII20xxxyyy | |
|
FEATURES
|
APPLICATIONS
|
Si Isolated Heat Sink
|
||||||||||||
|
|
|
| HSKSII20xxxyyy Silicon Isolated Heat Sink |
| PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE |
| The HSKSII20xxxyyy series of microwave 20 mils thick gold coated thin film Silicon Isolated heat sinks is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs. |
| TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING |
| All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. |
| HSKSII20xxxyyy Silicon Isolated Heat Sink | |||||
| ELECTRICAL/MECHANICAL CHARACTERISTICS | |||||
| LENGTH [mils] | WIDTH [mils] | PARAMETER | SYMBOL | VALUE | UNITS |
| - | - | Thickness | T | 20 | mils |
| 10 | 10 | Thermal Resistance | Rth | 52.49 | K/W |
| Thermal Conductivity | k | 1.91E-02 | W/K | ||
| Capacitance | C | 0.013 | pF | ||
| 20 | 10 | Thermal Resistance | Rth | 26.25 | K/W |
| Thermal Conductivity | k | 3.81E-02 | W/K | ||
| Capacitance | C | 0.027 | pF | ||
| 30 | 10 | Thermal Resistance | Rth | 17.5 | K/W |
| Thermal Conductivity | k | 5.71E-02 | W/K | ||
| Capacitance | C | 0.04 | pF | ||
| 20 | 20 | Thermal Resistance | Rth | 13.12 | K/W |
| Thermal Conductivity | k | 7.62E-02 | W/K | ||
| Capacitance | C | 0.054 | pF | ||
| 40 | 20 | Thermal Resistance | Rth | 6.56 | K/W |
| Thermal Conductivity | k | 1.52E-01 | W/K | ||
| Capacitance | C | 0.108 | pF | ||
| 60 | 20 | Thermal Resistance | Rth | 4.37 | K/W |
| Thermal Conductivity | k | 2.29E-01 | W/K | ||
| Capacitance | C | 0.162 | pF | ||
| 30 | 30 | Thermal Resistance | Rth | 5.83 | K/W |
| Thermal Conductivity | k | 1.72E-01 | W/K | ||
| Capacitance | C | 0.121 | pF | ||
| 60 | 30 | Thermal Resistance | Rth | 2.92 | K/W |
| Thermal Conductivity | k | 3.42E-01 | W/K | ||
| Capacitance | C | 0.243 | pF | ||
| 120 | 30 | Thermal Resistance | Rth | 1.46 | K/W |
| Thermal Conductivity | k | 6.85E-01 | W/K | ||
| Capacitance | C | 0.486 | pF | ||
| 40 | 40 | Thermal Resistance | Rth | 3.28 | K/W |
| Thermal Conductivity | k | 3.05E-01 | W/K | ||
| Capacitance | C | 0.216 | pF | ||
| 80 | 40 | Thermal Resistance | Rth | 1.64 | K/W |
| Thermal Conductivity | k | 6.10E-01 | W/K | ||
| Capacitance | C | 0.432 | pF | ||
| 120 | 40 | Thermal Resistance | Rth | 1.09 | K/W |
| Thermal Conductivity | k | 9.17E-01 | W/K | ||
| Capacitance | C | 0.648 | pF | ||
| 160 | 40 | Thermal Resistance | Rth | 0.82 | K/W |
| Thermal Conductivity | k | 1.22E+00 | W/K | ||
| Capacitance | C | 0.864 | pF | ||
| 50 | 50 | Thermal Resistance | Rth | 2.1 | K/W |
| Thermal Conductivity | k | 4.76E-01 | W/K | ||
| Capacitance | C | 0.337 | pF | ||
| 80 | 50 | Thermal Resistance | Rth | 1.31 | K/W |
| Thermal Conductivity | k | 7.63E-01 | W/K | ||
| Capacitance | C | 0.54 | pF | ||
| 100 | 50 | Thermal Resistance | Rth | 1.05 | K/W |
| Thermal Conductivity | k | 9.52E-01 | W/K | ||
| Capacitance | C | 0.675 | pF | ||
| 120 | 60 | Thermal Resistance | Rth | 0.73 | K/W |
| Thermal Conductivity | k | 1.37E+00 | W/K | ||
| Capacitance | C | 0.972 | pF | ||
| 200 | 100 | Thermal Resistance | Rth | 0.26 | K/W |
| Thermal Conductivity | k | 3.85E+00 | W/K | ||
| Capacitance | C | 2.699 | pF | ||
| 180 | 120 | Thermal Resistance | Rth | 0.24 | K/W |
| Thermal Conductivity | k | 4.17E+00 | W/K | ||
| Capacitance | C | 2.915 | pF | ||
| 240 | 120 | Thermal Resistance | Rth | 0.18 | K/W |
| Thermal Conductivity | k | 5.56E+00 | W/K | ||
| Capacitance | C | 3.886 | pF | ||
| 250 | 120 | Thermal Resistance | Rth | 0.17 | K/W |
| Thermal Conductivity | k | 5.88E+00 | W/K | ||
| Capacitance | C | 4.048 | pF | ||
| 290 | 170 | Thermal Resistance | Rth | 0.11 | K/W |
| Thermal Conductivity | k | 9.09E+00 | W/K | ||
| Capacitance | C | 6.652 | pF | ||
| 230 | 180 | Thermal Resistance | Rth | 0.13 | K/W |
| Thermal Conductivity | k | 7.69E+00 | W/K | ||
| Capacitance | C | 5.586 | pF | ||
| 220 | 250 | Thermal Resistance | Rth | 0.1 | K/W |
| Thermal Conductivity | k | 1.00E+01 | W/K | ||
| Capacitance | C | 7.422 | pF | ||
| 250 | 250 | Thermal Resistance | Rth | 0.08 | K/W |
| Thermal Conductivity | k | 1.25E+01 | W/K | ||
| Capacitance | C | 8.434 | pF | ||
| 370 | 250 | Thermal Resistance | Rth | 0.06 | K/W |
| Thermal Conductivity | k | 1.67E+01 | W/K | ||
| Capacitance | C | 12.482 | pF | ||
| ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. | |||||
| HSKSII20xxxyyy Silicon Isolated Heat Sink | |||
| GENERAL DIE INFORMATION | |||
| Substrate | Thickness [mils] | Size [mils] | Case style |
| Si [Silicon] | 20±0.5 | xxxxyyy±2 | |
| Frontside metal | Backside metal | ||
| The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. | The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. | ||
|
|
|||
| All US Microwaves Silicon Isolated Heat Sink products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). | |||
| Silicon Isolated Heat Sink STANDARD PRODUCTS ORDERING INFORMATION |
| 20 mils Silicon Isolated Heat Sink STANDARD PRODUCTS [BD0 TiW/Au] | ||||||
| LENGTH [mils] |
WIDTH [mils] |
US MICROWAVES PART NUMBER |
WAFFLE PACKS |
MINIM ORDER QTY |
U/P [$] |
ORDER RFQ |
| 10 | 10 | HSKSII20010010-BD0 | -WP | 241 | $1.328 | ORDER |
| 20 | 10 | HSKSII20020010-BD0 | -WP | 220 | $1.455 | ORDER |
| 30 | 10 | HSKSII20030010-BD0 | -WP | 203 | $1.576 | ORDER |
| 20 | 20 | HSKSII20020020-BD0 | -WP | 196 | $1.633 | ORDER |
| 40 | 20 | HSKSII20040020-BD0 | -WP | 161 | $1.988 | ORDER |
| 60 | 20 | HSKSII20060020-BD0 | -WP | 137 | $2.336 | ORDER |
| 30 | 30 | HSKSII20030030-BD0 | -WP | 157 | $2.038 | ORDER |
| 60 | 30 | HSKSII20060030-BD0 | -WP | 118 | $2.712 | ORDER |
| 120 | 30 | HSKSII20120030-BD0 | -WP | 79 | $4.051 | ORDER |
| 40 | 40 | HSKSII20040040-BD0 | -WP | 126 | $2.540 | ORDER |
| 80 | 40 | HSKSII20080040-BD0 | -WP | 88 | $3.636 | ORDER |
| 120 | 40 | HSKSII20120040-BD0 | -WP | 67 | $4.776 | ORDER |
| 160 | 40 | HSKSII20160040-BD0 | -WP | 55 | $5.818 | ORDER |
| 50 | 50 | HSKSII20050050-BD0 | -WP | RFQ | ||
| 80 | 50 | HSKSII20080050-BD0 | -WP | RFQ | ||
| 100 | 50 | HSKSII20100050-BD0 | -WP | RFQ | ||
| 120 | 60 | HSKSII20120060-BD0 | -WP | RFQ | ||
| 200 | 100 | HSKSII20200100-BD0 | -WP | RFQ | ||
| 180 | 120 | HSKSII20180120-BD0 | -WP | RFQ | ||
| 240 | 120 | HSKSII20240120-BD0 | -WP | RFQ | ||
| 250 | 120 | HSKSII20250120-BD0 | -WP | RFQ | ||
| 290 | 170 | HSKSII20290170-BD0 | -WP | RFQ | ||
| 230 | 180 | HSKSII20230180-BD0 | -WP | RFQ | ||
| 220 | 250 | HSKSII20220250-BD0 | -WP | RFQ | ||
| 250 | 250 | HSKSII20250250-BD0 | -WP | RFQ | ||
| 370 | 250 | HSKSII20370250-BD0 | -WP | RFQ | ||
| HSKSII20xxxyyy Silicon Isolated Heat Sink: List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. | ||||||
| Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. | ||||||
| STANDARD PRODUCTS AVAILABLE FROM STOCK - ORDERING INFORMATION | ||||||
| USM P/N | MIN QTY | U/P | ORDER/RFQ | STOCK QTY | U/P | ORDER/RFQ |
| No part available from stock | ||||||
|
ORDERING: Silicon Isolated Heat Sink may be ordered on line
HERE.
A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for 20 mils thick gold coated thin film Silicon Isolated heat sinks Si products packaged in waffle packs is 2-4 weeks ARO. For custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All 20 mils thick gold coated thin film Silicon Isolated heat sinks devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, heat sink devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples of 20 mils thick gold coated thin film Silicon Isolated heat sinks are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all 20 mils thick gold coated thin film Silicon Isolated heat sinks standard products provided minimum order quantities are met. |
| U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
| Home | Product Tree | Tech. Support | Request Quote | Inventory | Place Order | Contact sales |
| Last updated: September 24, 2010 | |
| US MICROWAVES | Tel:408-758-8690 Fax: 408-986-8027 | USMICROWAVES |
| ©1990-2024 US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission. |