SPIRAL CHIP INDUCTORS LXTxx-yynH-20Q FEATURES Spiral chip inductors are available in 2 different die dimensions: For 1 turn to 21 turns series the die size is 0.050"x0.050"x0.020". For 1 turn to 5.5 turns the the spiral chip inductors are also available in die size of 0.030"x0.030"x0.020". The LXTxx-yynH-20Q spiral chip inductors are manufactured on quartz (SiO2), 20 mils thick. APPLICATIONS These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. Spiral Chip Inductors Lab kits are available from stock: L-Kit Application note: AN 102 PRODUCT DESCRIPTION The Lxx-yynH-20Q Series of spiral chip inductors are designed to be used in chip and wire hybrid circuits as RF choke in power supplies and microwave circuit resonant elements. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. U.S. Microwaves advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25µm, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. For lowest capacitance and higher self resonance, the Lxx-yynH-20Q spiral chip inductors are manufactured on 20 mil thick quartz (SiO2) substrates. Application note AN 102 describes the recommended assembly for best performance. MICROWAVE APPLIED THIN FILM PRODUCTS MANUFACTURING PROCESS DESCRIPTION All thin film microwave products are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. SUBSTRATE INFORMATION INDUCTOR SPECIFICATIONS Material SiO2 -Quartz Thickness 20±1 mil Die size 50x50±3 mils, 30x30±3 mils Current rating 100mA@70°CTolerance 20 % Capacitance <0.030pF CONDUCTORS The conductor and bonding pads are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. BACKSIDE METALS Backside of the die is NOT metallized. Standard TiW/Au or custom metallization is available for special orders. ELECTRICAL CHARACTERISTICS Inductance nnnH , Inductance Tolerance (Absolute) + 25°C ±20.0 % DC Resistance typ. 0.1W Current Rating: Max. 100mA@70°C Quality Factor Q @ 100MHz typ. 25.5 Series Self Resonance SRF typ. ff GHz Parallell Self Resonance PRF typ. ff GHz Operating Temperature Range - 55 to + 125°C Storage Temperature Range - 55 to + 125°C PRICES, DELIVERY & ORDERING INFORMATION PART# L01-01nH-20Q Minim Order 100pc U/P($) $4.80 All US Microwaves products are available in die form. Typical delivery for die products is 1-2 weeks ARO. For Custom designs, delivery is 2-3 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are shipped in waffle packs. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

 
 
US MICROWAVES
Advanced Microwave Components		   SPIRAL CHIP INDUCTORS
ENGINEERING DESIGN KIT

 SPIRAL IINDUCTOR LAB KITS FROM STOCK
 
 

USM Spiral Chip Inductor Lab Kits
FEATURED NEW PRODUCT CHIP SCALE SPIRAL CHIP INDUCTOR NOW AVAILABLE
US Microwaves recognizes the importance of Lab Kits of Spiral Chip Inductors for it's Customers. Since US Microwaves offers a wide range of models and inductance values it is practical for customers to choose which device is in a kit.
The following constrains do apply:
-Any kit may contain only one model type
-Maximum number of different inductance values in a kit is 4 (four).
-Minimum quantity in a kit is 100 pc.
Customers may select up to 4 different values, fill out desired quantities for each value and request instant quote.

Spiral chip inductors are available in 3 different die dimensions:
For 1 turn to 21 turns series the die size is 0.050"x0.050"x0.020".
For 1 turn to 12 turns the die size is 0.030"x0.030"x0.020".
For 1 turn to 6 turns the die size is 0.025"x0.025"x0.020".
Chip Scale spiral chip inductors have no parasitic inductance because there are no additional wire bonds.
-Simple mounting by thermo compression or with conductive epoxy.
-Transparent substrate allows flip chip mounting without specialized equipment.
-Compatible with various substrates.
Spiral chip inductors are manufactured on quartz (SiO2), 20 mils thick, for lowest capacitance and highest SRF and PRF.

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
High Q spiral chip inductors are designed to be used in chip and wire hybrid circuits as RF choke in power supplies and microwave circuit resonant elements. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. U.S. Microwaves advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25µm, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. For lowest capacitance and higher self resonance, all spiral chip inductors are manufactured on 20 mil thick quartz (SiO2) substrates. Application note AN 102 describes the recommended assembly for best performance. Further improvement in SRF and significant reduction of parasitics (inductance associated with the bonding wires is a major parasitic component) are achieved via 2 new improved technologies: -Gold stud bump flip chip technique and Chip Scale Packaged technique. Gold stud bumped devices can still be bonded to a gold conductor simply by applying ultrasonic energy and moderate heat. Conductive epoxy can also be used to bond gold studs to gold or other metal surfaces. Chip Scale packaged devices offer the advantage of being easily soldered along with other packaged devices on same printed circuit board (PCB).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.

LX5000Q20-XXX SPIRAL CHIP INDUCTORS SERIES LAB KIT INSTANT QUOTE
           
Spiral Chip Inductor P/N 1 Qty 1 Name
Spiral Chip Inductor P/N 2 Qty 2 Company
Spiral Chip Inductor P/N 3 Qty 3 E-mail
Spiral Chip Inductor P/N 4 Qty 4 Tel
 
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LX3000Q20-XXX SPIRAL CHIP INDUCTORS SERIES LAB KIT INSTANT QUOTE
           
Spiral Chip Inductor P/N 1 Qty 1 Name
Spiral Chip Inductor P/N 2 Qty 2 Company
Spiral Chip Inductor P/N 3 Qty 3 E-mail
Spiral Chip Inductor P/N 4 Qty 4 Tel
 
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LX3000NHQ20-XXX SPIRAL CHIP INDUCTORS SERIES LAB KIT INSTANT QUOTE
           
Spiral Chip Inductor P/N 1 Qty 1 Name
Spiral Chip Inductor P/N 2 Qty 2 Company
Spiral Chip Inductor P/N 3 Qty 3 E-mail
Spiral Chip Inductor P/N 4 Qty 4 Tel
 
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LXT5000Q20-XXX 1/4 TURN WIRE BOND TUNING SPIRAL CHIP INDUCTORS SERIES LAB KIT INSTANT QUOTE
           
Spiral Chip Inductor P/N 1 Qty 1 Name
Spiral Chip Inductor P/N 2 Qty 2 Company
Spiral Chip Inductor P/N 3 Qty 3 E-mail
Spiral Chip Inductor P/N 4 Qty 4 Tel
 
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LXT3000Q20-XXX 1/4 TURN WIRE BOND TUNING SPIRAL CHIP INDUCTORS SERIES LAB KIT INSTANT QUOTE
           
Spiral Chip Inductor P/N 1 Qty 1 Name
Spiral Chip Inductor P/N 2 Qty 2 Company
Spiral Chip Inductor P/N 3 Qty 3 E-mail
Spiral Chip Inductor P/N 4 Qty 4 Tel
 
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LX5035CSP-XXX SPIRAL CHIP INDUCTORS SERIES LAB KIT INSTANT QUOTE
           
Spiral Chip Inductor P/N 1 Qty 1 Name
Spiral Chip Inductor P/N 2 Qty 2 Company
Spiral Chip Inductor P/N 3 Qty 3 E-mail
Spiral Chip Inductor P/N 4 Qty 4 Tel
 
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ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 01, 2009
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