| VERY LOW DROPOUT VOLTAGE REGULATORS USM L4805 The USM L4805 series devices are voltage regulator with a very low voltage drop ( typically 0.4 V at fullrated current), output current up to 400mA, low current and comprehensive on-chip protection. The-quiescentse devices are protected against load dump and field decay transients of ±60V, polarity reversal and overheating. A foldback current limiter protects against load short circuits. Available in 5V, 8.5V 9.2V, 10V and 12V versions ( all ±4%, TI = 25°C ) the-quiescentse regulators are designed for automotive, industrial and consumer applications where low consumption is particularly important. Input/Output Typ. 0.4V 400mA Output Current Low Quiescent Current Reverse Polarity Protection Over Voltage Protection (±60V) Foldback Current Limiting Thermall Shutdown In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS DC Input Voltage +35 V DC Input Reverse Voltage -18 V Transient Input Overvoltages LoadDump: 5ms =< Trise =<10ms, tf Fall Time Constant = 100ms, Rsource =< 0.5 FieldDecay: 5ms =< Tfall =< 10ms,Rsource =< 10 tr Rise Time Constant = 33ms Junction and Storage Temperature Range -55 to +150 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTIC VI=14.4V;CO=100F;Tj=25°C unless otherwise specified. PARAMETER SYMBOL TEST CONDITIONS MIN TYP LIMIT UNITS Output Voltage VO IO=5mA to 400mA 4.8 5.0 5.2 V Operating Input Voltage VI 26 V Line Regulation DVO/VO VI=13 to 26V; IO=5mA 1 10 mV/V Load Regulation DVO/VO IO= 5 to 400mA* 3 15 mV/V Dropout Voltage VI-VO IL = 150mA IL = 400mA* 0.2 0.4 0.4 0.7 V QuiescentCurrent Iq IL = 0mA IL = 150mA IL = 400mA * 0.8 25 65 2 45 90 mA Temperature Output Voltage Drift DVO/DT*VO 0.1 mV/°C*V Supply Voltage Rejection SVR IO=350mA;f=320Hz; CO=100F;VI=VO+3V+2Vpp 60 dB Maximum Output Current IO 800 mA Output Short Circuit Current (fold back condition) ISC 350 500 mA ELECTRICAL CHARACTERISTIC VI=14.4V;CO=100F;Tj=-40to125°C (note1) unless otherwise specified. PARAMETER SYMBOL TEST CONDITIONS MIN TYP LIMIT UNITS Output Voltage VO IO=5mA to 400mA 4.70 5.0 5.30 V Operating Input Voltage VI Note 2 26 V Line Regulation DVO/VO VI=13 to 26V; IO=5mA 2 15 mV/V Load Regulation DVO/VO IO=5 to 400mA* 5 25 mV/V Dropout Voltage VI-VO IL = 150mA IL = 400mA* 0.25 QuiescentCurrent Iq IL = 0mA IL = 150mA IL = 400mA * Mximum Output Current IO 870 mA Output Short Circuit Current (fold back condition) ISC 230 mA (NOTE 1) This limits are guaranteed by design, correlation and statistical control on production samples ove rthe indicated temperature and supply voltage ranges. (NOTE 2) For a DC voltage 26V < 35V the device is not operating. |
| US MICROWAVES Advanced Microwave Components |
VERY LOW DROPOUT VOLTAGE REGULATORS USM L4805 |
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| PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE |
| The USM L4805 series devices are voltage regulator with a very low voltage drop ( typically 0.4 V at fullrated current), output current up to 400mA, low current and comprehensive on-chip protection. The-quiescentse devices are protected against load dump and field decay transients of ±60V, polarity reversal and overheating. A foldback current limiter protects against load short circuits. Available in 5V, 8.5V 9.2V, 10V and 12V versions ( all ±4%, TI = 25°C ) the-quiescentse regulators are designed for automotive, industrial and consumer applications where low consumption is particularly important. |
| IC SCHEMATIC DIAGRAM |
 |
| MAXIMUM RATINGS | ||
| PARAMETER | VALUE | UNITS |
| DC Input Voltage | +35 | V |
| DC Input Reverse Voltage | -18 | V |
| Transient Input Overvoltages LoadDump: 5ms =< Trise =<10ms, tf Fall Time Constant = 100ms, Rsource =< 0.5 FieldDecay: 5ms =< Tfall =< 10ms,Rsource =< 10 tr Rise Time Constant = 33ms |
60 -60 |
V V |
| Junction and Storage Temperature Range | -55 to +150 | °C |
| ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. | ||
| ELECTRICAL CHARACTERISTIC | ||||||
| VI=14.4V;CO=100F;Tj=25°C unless otherwise specified. | ||||||
| PARAMETER | SYMBOL | TEST CONDITIONS | MIN | TYP | LIMIT | UNITS |
| Output Voltage |
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IO=5mA to 400mA | 4.8 | 5.0 | 5.2 | V |
| Operating Input Voltage |
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26 | V | |||
| Line Regulation |
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VI=13 to 26V; IO=5mA | 1 | 10 | mV/V | |
| Load Regulation |
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IO= 5 to 400mA* | 3 | 15 | mV/V | |
| Dropout Voltage |
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IL = 150mA IL = 400mA* |
0.2 0.4 |
0.4 0.7 |
V | |
| QuiescentCurrent |
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IL = 0mA IL = 150mA IL = 400mA * |
0.8 25 65 |
2 45 90 |
mA mA mA |
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| Temperature Output Voltage Drift |
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0.1 | mV/°C*V | |||
| Supply Voltage Rejection |
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IO=350mA;f=320Hz; CO=100F;VI=VO+3V+2Vpp |
60 | dB | ||
| Maximum Output Current |
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800 | mA | |||
| Output Short Circuit Current (fold back condition) |
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350 | 500 | mA | ||
| ELECTRICAL CHARACTERISTIC | ||||||
| VI=14.4V;CO=100F;Tj=-40to125°C (note1) unless otherwise specified. | ||||||
| PARAMETER | SYMBOL | TEST CONDITIONS | MIN | TYP | LIMIT | UNITS |
| Output Voltage |
|
IO=5mA to 400mA | 4.70 | 5.0 | 5.30 | V |
| Operating Input Voltage |
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Note 2 | 26 | V | ||
| Line Regulation |
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VI=13 to 26V; IO=5mA | 2 | 15 | mV/V | |
| Load Regulation |
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IO=5 to 400mA* | 5 | 25 | mV/V | |
| Dropout Voltage |
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IL = 150mA IL = 400mA* |
0.25 0.5 |
0.5 0.9 |
V V |
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| QuiescentCurrent |
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IL = 0mA IL = 150mA IL = 400mA * |
1.2 40 80 |
3 70 140 |
mA mA mA |
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| Maximum Output Current |
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870 | mA | |||
| Output Short Circuit Current (fold back condition) |
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230 | mA | |||
| (NOTE 1) This limits are guaranteed by design, correlation and statistical control on production samples ove rthe indicated temperature and supply voltage ranges. | ||||||
| (NOTE 2) For a DC voltage 26V < 35V the device is not operating. | ||||||
| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) [mm] | Bonding pads | Backside metal |
| Silicon | 10±1 | (101.181x61.811) [2.57x1.57] |
min 7x7 mils, 1µm thick, aluminium | Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. |
| All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). | ||||
| TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING |
|
These integrated Circuits are manufactured with medium voltage junction isolated
bipolar process. junction isolated bipolar processes allow integration of high
performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors
and precision thin film resistors. The bond pad metallization is standard 1µm
Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it
compatible with AuSi or AuGe die attach. All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. |
| DIE LAYOUT - MECHANICAL SPECIFICATIONS | ||||||
| PAD # | FUNCTION | X(mils) | X(mm) | Y(mils) | Y(mm) |  |
| 1 | INPUT | 10.827 | 0.275 | 50.394 | 1.280 | |
| 2 | OUTPUT | 10.827 | 0.275 | 3.543 | 0.090 | |
| 3 | OUTPUT | 42.520 | 1.080 | 3.543 | 0.090 | |
| 4 | GND | 69.488 | 1.765 | 3.543 | 0.090 | |
| 5 | SHUTDOWN | 90.354 | 2.295 | 3.543 | 0.090 | |
| STANDARD PRODUCTS ORDERING INFORMATION |
| STANDARD PRODUCTS PRICE LIST | |||
| USM PART # | MINIMUM ORDER QUANTITY | Waffle Packs | U/P($) |
| USM L4805 | 100pc | -WP | $3.20 |
| List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. | |||
| Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. | |||
| ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. |
| U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
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| Last updated: July 01, 2009 | |
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