The USM LM2931 positive voltage regulator features a very low quiescent current of 1mA or less when supplying 10mA loads.This unique characteristic and the extremely low input-output differential required for proper regulation (0.2V for output currents of 10mA) make the LM2931 the ideal regulator for standby power systems. Applications include memory standby circuits, CMOS and other low power processor power supplies as well as systems demanding as much as100mA of output current. Designed originally for automotive applications, theLM2931 and all regulated circuitry are protected from reverse batter installations or 2 battery jumps. During line transients, such as a load dump (60V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shutdown to protect both internal circuits and the load. The LM2931 cannot be harmed by temporary mirror-image insertion. Familiar regulator features such as short circuit and thermal overload protection are also provided. The LM2931 family includes a fixed 5V output (±3.8% tolerance for A grade) or anadjustable output with ON/OFF pin.

 
 
US MICROWAVES
Advanced Microwave Components		   LOW DROPOUT REGULATORS
USM LM2931
 
 

FEATURES
APPLICATIONS
LDO VOLTAGE REGULATOR
Very low quiescent current
Output current in excess of 100mA
Input-output differential less than 0.6V
Reverse battery protection;
60V load dump protection
50V reverse transient protection
Short circuit protection
Internal thermal overload protection
Mirror-image insertion protection
In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS.

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The USM LM2931 positive voltage regulator features a very low quiescent current of 1mA or less when supplying 10mA loads.This unique characteristic and the extremely low input-output differential required for proper regulation (0.2V for output currents of 10mA) make the LM2931 the ideal regulator for standby power systems. Applications include memory standby circuits, CMOS and other low power processor power supplies as well as systems demanding as much as100mA of output current. Designed originally for automotive applications, theLM2931 and all regulated circuitry are protected from reverse batter installations or 2 battery jumps. During line transients, such as a load dump (60V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shutdown to protect both internal circuits and the load. The LM2931 cannot be harmed by temporary mirror-image insertion. Familiar regulator features such as short circuit and thermal overload protection are also provided.
The LM2931 family includes a fixed 5V output (±3.8% tolerance for A grade) or anadjustable output with ON/OFF pin.


IC SCHEMATIC DIAGRAM

MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNITS
Input Voltage
Operating Range
Overvoltage Protection		  VIN
26
50		 V
Internal Power Dissipation (Note2) PD Internally Limited W
Operating Ambient Temperature Range   -40 to 85 °C
Maximum Junction Temperature TJ 125 °C
Storage Temperature Range TSTG -65 to +150 °C
Lead Temperature (Soldering, 10 sec) TLEAD 230 °C
ESD Tolerance (Note4)   2000 V
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTIC
VIN=14V, IO=10mA,TJ=25°C,C2=100µF(unless otherwise specified)(Note2)
PARAMETER TEST CONDITIONS TYP LIMIT UNITS
OutputVoltage

4V=< VIN=< 26V, IO=100mA
-40°C=< TJ=< 125°C		 3.3



 3.465
3.135
3.630
2.970		 VMAX
VMIN
VMAX
VMIN
Line Regulation 4V=< VIN=< 26V 4 33 mVMAX
Load Regulation 5mA=< IO=< 100m 10 50 mVMAX
Output Impedance
 100mADC and 10mArms
100Hz - 10KHz 		200

   mOhms
Output Noise Voltage 10Hz-100kHz, COUT=100 µF 330   µVrms
Quiescent current

 IO=< 10mA, 4V=< VIN=< 26V
-40 °C=< TJ=< 125 °C
IO=100mA, VIN=14V, TJ=25°C		 0.4


 1.0


 mAMAX

mA
Long Term Stability   13   mV/1000h
Ripple Rejection fO=120H 80   dB
Dropout Voltage
 IO=10mA
IO=100mA		 0.05
0.30		 0.2
0.6		 VMAX
Maximum Operational Input Voltage   33 26 VMIN
Maximum Line Transient
 RL=500, VO=< 5.5V,
T=1ms,t=<100ms		 70
 50
 VMIN
Reverse Polarity Input Voltage, DC VO>=0.3V, RL=500 ohms 30 -15 VMIN
ReversePolarityInputVoltage,Transient T=1ms, t=<100ms,RL=500 ohms -80 -50 VMIN
ELECTRICAL CHARACTERISTIC
VIN=14V, IO=10mA,TJ=25°C,C2=100µF(unless otherwise specified)(Note2)
PARAMETER TEST CONDITIONS TYP LIMIT UNITS
OutputVoltage

6V=< VIN=<26V, IO=100mA
-40°C=<TJ=<125°C		 5



 5.25
4.75
5.5
4.5		 VMAX
VMIN
VMAX
VMIN
Line Regulation 9V=< VIN=<16V
6V=< VIN=< 26V		 2
4		 10
30		 mVMAX
Load Regulation 5mA=< IO=< 100m 14 50 mVMAX
Output Impedance
 100mADC and 10mArms
100Hz - 10KHz 		200

   mOhms
Quiescent Current

 IO=<10mA,6V=<VIN=<26V
40°C=< TJ=< 125°C
IO=100mA,VIN=14V,TJ=25°C		 0.4


 1.0

15
 mAMAX

mAMAX
Output Noise Voltage
Long Term Stability		 10Hz-100kHz,COUT=100µF
 500
20		   µVrms
mV/1000hr
Dropout Voltage
 IO=10mA
IO=100mA		 0.05
0.30		 0.2
0.6		 VMAX
Ripple Rejection  fO=120Hz 80   dBMIN
Maximum Operational Input Voltage   33 26 VMIN
Maximum Line Transient
 RL=500, VO=< 5.5V,
T=1ms,t=<100ms		 70
 50
 VMIN
Reverse Polarity Input Voltage, DC VO>=-0.3V, RL=500 ohms -30 -15 VMIN
ReversePolarityInputVoltage,Transient T=1ms, t=<100ms,RL=500 ohms -80 -50 VMIN
ELECTRICAL CHARACTERISTIC
VIN=14V, IO=10mA,TJ=25°C,C2=100µF(unless otherwise specified)(Note2)
PARAMETER TEST CONDITIONS TYP LIMIT UNITS
Reference Voltage

IO=<100mA, 40°C=<Tj=<125°C, R1=27k
Measured from VOUT toAdjust Pin		 1.20



 1.26
1.14
1.32
1.08		 VMAX
VMIN
VMAX
VMIN
Output Voltage Range     24 VMAX
Line Regulation VOUT + 0.6V=< VIN=< 26V 0.2 1.5 mV/VMAX
Load Regulation 5mA=< IO=<100mA 0.3 1 %MAX
Output Impedance 100mADC and 10mArms, 100Hz–10kHz   40 mW/V
Quiescent Current


IO=10mA
IO=100mA
Durring Shutdown RL=500W		 0.4
15
0.8		 1

1		 mAMAX
mA
mAMAX
Output Noise Voltage 10Hz–100kHz 100   µVrms/V
Long Term Stability   0.4   %/1000hr
Ripple Rejection fO=120Hz 0.02   %/V
Dropout Voltage
 IO=< 10mA
IO=100mA		 0.05
0.3		 0.2
0.6		 VMAX
VMAX
Maximum Operational Input Voltage   33 26 VMIN
Maximum Line Transient

IO=10mA, ReferenceVoltage=<1.5V
T=1ms, t=< 100ms		 70

 60

 VMIN
Reverseolarity Input Voltage, Transient T=1ms, t =< 100ms RL=500W -80 -50 VMIN

On/Off Threshold Voltage
On
Off

 VO= 3V
2.0
2.2
1.2
3.25
VMAX
VMIN
On/Off Threshold Current   20 50 µAMAX
 
(NOTE 1) Absolute Maximum Rating sindicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions.
(NOTE 2) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing isused.
(NOTE 3) All lmits are guaranteed for TJ=25°C (standard type face) or over the full operating junction temperature range of 40°C to +125°C (bold type face).
(NOTE 4)Human body model, 100pF discharged through 1.5k.

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) [mm] Bonding pads Backside metal
Silicon 10±1 (73.622x56.693) [1.87x1.44] min 4x4 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING
These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1µm Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD # FUNCTION X(mils) X(mm) Y(mils) Y(mm)
1 OUTPUT 4.331 0.110 3.740 0.095
2 INPUT 4.331 0.110 48.031 1.220
3 GND 37.598 0.955 20.669 0.525
4 SHUTDOWN 65.157 1.655 48.228 1.225
5 FEEDBACK 65.157 1.655 3.740 0.095
 
 

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($)
USM LM2931 100pc -WP $3.20
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 01, 2009
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