LP2951-5 equivalent die to USMLP2951-5 low dropout positive voltage regulator for hybrid circuits and microwave power amplifiers known good die LM series from US Microwaves

The USM LP2951-5.0 series are micropower voltage regulators with very low quiescent current (75µA typ.) and very low drop out voltage (typ.40 mV at light loads and 380 mV at 100mA). They are ideally suited for use in battery-powered systems. Furthermore, the quiescent current of the LP2951 increases only slightly in drop out, prolonging battery life. The 8-lead LP2951 is available in die form. One such feature is an error flag output which warns of a low output voltage, often due to falling batteries on the input. It may be used for a power-on reset. A second feature is the logic-compatible shut down in put which enables the regulator to be switched on and off. Also, the part may be pin-strapped for a 5V,3V,or 3.3V output (depending on the version), or programmed from 1.24V to 29V with an external pair of resistors. Careful design of the LP2951 has minimized all contributions to the error budget. This includes a tight initial tolerance (0.5% typ.), extremely good load and line regulation (0.05% typ.)and a very low output voltage temperature coefficient, making the part useful as a low-power voltage reference.



US MICROWAVES Advanced Microwave Components		100mA Low Dropout Voltage Regulators USM LP2951-5.0

FEATURES

APPLICATIONS

LDO VOLTAGE REGULATOR

High accuracy output voltage

Guaranted 100mA output

Very low quiescent current

Low dropout voltage

Extremely tight load and line regulation

Very low temperature coefficient

Needs only 1µF for stability; Error Flag warms of output dropout

Logic-Controlled electronic shutdown

Output programmable from 1.24 to 29V.

In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE

IC SCHEMATIC DIAGRAM

MAXIMUM RATINGS
PARAMETER	SYMBOL	VALUE	UNITS
Power disipation		Internal limited
Storage temperature Range		-65 to +150	°C
Operating Junction Temperature Range	T_J	-55 to +150	°C
Output Voltage	V_OUT	5.0	V
Input Supply Voltage		-0.3 to +30	V
Feedback Input Voltage		-1.5 to +30	V
Shutdown Input Voltage		-0.3 to+30V	V
Error Comparator Output		-0.3 to +30	V
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTIC
(T_a=25°C, V_IN=15V, unless otherwise specified)
PARAMETER	TEST CONDITIONS	MIN	TYP	MAX	UNITS
Output Voltage	25°C<T_j<85°C Full Operating Temperature	0.985 \|Vo\| 0.98 \|Vo\|	Vo	1.015 \|Vo\| 1.02 \|Vo\|	V
Output Voltage	100µA<I_L<100mA, T_J<T_JMAX	0.976 \|Vo	Vo	1.024 \|Vo\|	V
Output Voltage	Note1		50	150	ppm/°C
Line Regulation(Note3)	V_O+1V<Vm<30V(Note4)		0.04	5.075	%
Load Regulation (Note3)	100µA<I_L<100mA		0.1	0.3	%
Dropout Voltage (Note 3)	I_L=100µA I_L=100mA		50 380	80 450	mV
Ground Current	I_L=100µA I_L=100mA		75 8	120 12	µA mA
Dropout Ground Current	V_in=V0-0.5V I_L=100µA		110	170	µA
Current Limit	V_out=0		160	200	mA
Thermal Regulation			0.05	0.2	%/W
Output Noise, 10Hz to 100 kHz	C_L=1µF C_L=200µF C_L=3.3µF (Bypass=0.01µF pins 7 to 1)		430 160 100		µVrms
Reference Voltage		1.21	1.235	1.26	V
Reference Voltage	Over Temperature (Note6)	1.185		1.285	V
Feedback pin Bias Current			20	40	µA
Reference Voltage Temperature Coefficient			5		ppm/°C
Feedback Pin Bias Current Temperature Coefficient			0.1		µA/°C
ERROR COMPARATOR
Output Leakage Current	V_V		0.01	1.0	µA
Output Low Voltage	V_in=4.5V,I_OL=400µA		150	250	mV
Upper Threshold Voltage	(Note 8)	40	60		mV
Lower Threshold Voltage	(Note 8)		75	95	mV
Hysteresis	(Note 8)		15		mV
SHUTDOWN INPUT
Input logic Voltage	Low (Regulator ON) High (Regulator OFF)	2	1.3	0.7	V
Shut down Pin Input Current	V_S=2.4V V_S=30V		30 450	50 600	µA
Regulator Output Current in Shutdown	(Note9) V_out=5.0V		3	10	µA

(NOTE 1) Output or reference voltage temperature coefficients defined as the worst case voltage change divided by the total temperature range.
(NOTE 2) Unless otherwise specified all limits guaranteed for T_J=25°C, V_in=V₀+1V, I_L=100µA and C_L=1µF. Additional conditions for the 8-pin versions are feedback tied to - XX V tap and output tied to output Sense (V_out=XX V) and Vshutdown<0.8V
(NOTE 3) Regulations is measured at constant junction temperature,using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specification for thermal regulation.
(NOTE 4) Line regulation for LP2951 -XX is tested at 150°C for I_L=1mA. For I_L=100µA and T_J=125°C, line regulation is guranteed by design 0.2%. See typical performance characteristics for temperature and load current.
(NOTE 5) Dropout voltage is defined as the input to differential at which the output voltage drops 100mV below its nominal value measured at 1V differential. At very low values of programmed output voltage, the minimum input supply voltage off 2V (2.3V over temperature )must be taken into account.
(NOTE 6) V_ref<V_out<V_in-1V, 2.3V<V_in<30V, 100µA<I_L<100mA,T_J<T_JMAX
(NOTE 7) Output or reference voltage temperature coeffecient is defined as the worst case voltage change divided by the total temperature range
(NOTE 8) Comparator thresholds are expressed in terms of voltage differential at the feedback terminal below the nominal reference voltage measured at V₀+1V input. To express these thresholds in therms of output voltage change, multiply by the error amplifier gain = V_out/V_ref=(R1 +R2)/R2. For example at a programmed output is guaranteed to go low when the output drops by 95mVx5V/1.235V = 384mV. Thresholds remain constant as a percent of Vout as Vout is varied, with the dropout warning occuring at typically 5% below nominal, 7,5% guaranteed.
(NOTE 9) Vshutdown>2V, V_in<30V, V_out=0, Feedback pin tied to - XX V Tap

GENERAL DIE INFORMATION
Substrate	Thickness (mils)	Die size (mils) [mm]	Bonding pads	Backside metal
Silicon	10±1	(80.7x45.276) [2.05x1.15]	min 4x4 mils, 1µm thick, aluminium	Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING

These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1µm Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD #	FUNCTION	X(mils)	X(mm)	Y(mils)	Y(mm)
1	OUTPUT	17.323	0.440	4.331	0.110
2	SENSE	31.890	0.810	4.331	0.110
3	SHUTDOWN	49.213	1.250	4.331	0.110
4	GROUND	73.425	1.865	4.331	0.110
5	ERROR	73.425	1.865	37.402	0.950
6	XX V TAP	36.811	0.935	37.402	0.950
7	FEEDBACK	28.937	0.735	37.402	0.950
8	INPUT	17.323	0.440	37.402	0.950

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART #	MINIMUM ORDER QUANTITY	Waffle Packs	U/P($)
USM LP2951-5.0	100pc	-WP	$3.20
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

Last updated: July 01, 2009
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