| 800 mA LOW DROPOUT POSITIVE VOLTAGE REGULATORUSM LT 1117 FEATURES APPLICATIONS VOLTAGE REGULATOR Adjustable or fixed output Output current of 800mA Low dropout 700mV at 800mA output current 0.015% line regulation 0.01% load regulation 100% thermal limit burn-in Fast transient response Remote sense In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The USM LT 1117 series of positive adjustable and fixed regulators are designed to provide 800mA with higher efficiency than currently available devices. All internal circuitry is designed to operate down to 700 mV input to output differential and the dropout voltage is fully specified as a function of load current. Dropout voltage of the device is 100mV at light loads and rising to 700mV at maximum output current . A second low current input is required to achieve this dropout. The LT1117 can also be used as a single supply device (3 pin version). On-chip trimming adjust the reference voltage is 1%. IC SCHEMATIC DIAGRAM MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Power Dissipation PD internally limited W Input Voltage VIN VPOWER VCONTROL 7 13 V Operating Junction Temperature Range Control section Power transistor Tj 0 to 125 0 to 150 °C Storage temperature Tstg -65 to 150 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTIC (Note1) ILOAD=0mA and TJ=25°C unless otherwise specified PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Reference Voltage * VCONTROL=2.75V, VPOWER=2V, ILOAD=10mA VCONTROL=2.75to 12V, VPOWER=3.3 to 5.5V, ILOAD=10 mA to 800mA 1.238 1.230 1.250 1.250 1.262 1.270 V Line regulation * ILOAD=10mA,(1.5V+VOUT)<VCONTROL<12V, 0.8<(VPOWER-VOUT)<5.5V - 0.04 0.20 % Load Regulation * VCONTROL=VOUT+2.5V,VPOWER=VOUT+0.8V, ILOAD=10mA to 800mA - 0.08 0.4 % Minimum Load Current (Note3) * VCONTROL=5V, VPOWER=3.3V,VADJ=0V - 1.7 5 mA Control Pin Current * VCONTROL=VOUT+2.5V,VPOWER=VOUT+0.8V, ILOAD=10mA to 800mA - 10 20 mA Adjust Pin Current * VCONTROL=2.75V, VPOWER=2.05V,ILOAD=10mA - 50 120 µA Current Limit * (VIN-VOUT)=3V 800 1100 - mA Ripple Rejection VCONTROL=VPOWER=VOUT+2.5V, VRIPPLE=1VP-P, ILOAD=400mA 60 75 - dB Thermal Regulation TA=25°C, 30ms pulse - 0.003 - %/W Control Input (Note4) (VCONTROL-VOUT) * VPOWER=VOUT+0.8V, ILOAD=10mA VPOWER=VOUT+0.8V,ILOAD=800mA - 1.00 1.15 1.15 1.30 V Power Input (VPOWER-VOUT) * VCONTROL=VOUT+2.5V,ILOAD=800mA - 0.55 0.70 V The * denotes the specifications which apply over the full temperature range. (NOTE 1) Unless otherwise specified VOUT=VSENSE, VADJ=0V. (NOTE 2) For adjustable device the minimum load current is the minimum current required to maintain regulation. (NOTE 3) The control pin current is the drive current required for the output transistor. This current will track output current with a ratio of about 1:100. (NOTE 4) The dropout voltage for the LT1117 is caused by either minimum control voltage or minimum power voltage.The specifications represent the minimum input/output voltage required to maintain 1% regulation. GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) [mm] Bonding pads Backside metal Silicon 10±1 (78.740x70.078) [2.0x1.78] min 5.512x5.512 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1µm Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) Y(mm) 1 OUTPUT 3.937 0.100 62.630 1.540 2 OUTPUT 69.291 1.760 62.630 1.540 3 VPOWER 36.614 0.930 52.165 1.325 4 VCONTROL 36.614 0.930 43.110 1.095 5 SENSE 3.937 0.100 23.819 0.605 6 ADJUST 3.937 0.100 3.937 0.100 STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USM LT1117 100pc -WP $3.20 List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
| US MICROWAVES Advanced Microwave Components |
800
mA LOW DROPOUT POSITIVE VOLTAGE REGULATOR USM LT 1117 |
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| PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE |
|
The USM LT 1117 series of positive
adjustable and fixed regulators are designed to provide 800mA with higher efficiency than currently available devices. All
internal circuitry is designed to operate down to 700 mV input to output differential and the dropout voltage is fully specified
as a function of load current. Dropout voltage of the device is 100mV at light loads and rising to 700mV at maximum output
current . A second low current input is required to achieve this dropout. The LT1117 can also be used as a single supply device
(3 pin version). On-chip trimming adjust the reference voltage is 1%. |
| IC SCHEMATIC DIAGRAM |
 |
| MAXIMUM RATINGS | |||
| PARAMETER | SYMBOL | VALUE | UNITS |
| Power Dissipation | PD | internally limited | W |
| Input Voltage | VIN VPOWER VCONTROL |
7 13 |
V |
| Operating Junction Temperature Range Control section Power transistor |
Tj | 0 to 125 0 to 150 |
°C |
| Storage temperature | Tstg | -65 to 150 | °C |
| ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. | |||
| ELECTRICAL CHARACTERISTIC | |||||
| (Note1) ILOAD=0mA and TJ=25°C unless otherwise specified | |||||
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNITS |
| Reference Voltage * | VCONTROL=2.75V, VPOWER=2V, ILOAD=10mA VCONTROL=2.75to 12V, VPOWER=3.3 to 5.5V, ILOAD=10 mA to 800mA |
1.238 1.230 |
1.250 1.250 |
1.262 1.270 |
V |
| Line regulation * | ILOAD=10mA,(1.5V+VOUT)<VCONTROL<12V, 0.8<(VPOWER-VOUT)<5.5V | - | 0.04 | 0.20 | % |
| Load Regulation * | VCONTROL=VOUT+2.5V,VPOWER=VOUT+0.8V, ILOAD=10mA to 800mA | - | 0.08 | 0.4 | % |
| Minimum Load Current (Note3) * | VCONTROL=5V, VPOWER=3.3V,VADJ=0V | - | 1.7 | 5 | mA |
| Control Pin Current * | VCONTROL=VOUT+2.5V,VPOWER=VOUT+0.8V, ILOAD=10mA to 800mA | - | 10 | 20 | mA |
| Adjust Pin Current * | VCONTROL=2.75V, VPOWER=2.05V,ILOAD=10mA | - | 50 | 120 | µA |
| Current Limit * | (VIN-VOUT)=3V | 800 | 1100 | - | mA |
| Ripple Rejection | VCONTROL=VPOWER=VOUT+2.5V, VRIPPLE=1VP-P, ILOAD=400mA | 60 | 75 | - | dB |
| Thermal Regulation | TA=25°C, 30ms pulse | - | 0.003 | - | %/W |
| Control Input (Note4) (VCONTROL-VOUT) * | VPOWER=VOUT+0.8V, ILOAD=10mA VPOWER=VOUT+0.8V,ILOAD=800mA |
- | 1.00 1.15 |
1.15 1.30 |
V |
| Power Input (VPOWER-VOUT) * | VCONTROL=VOUT+2.5V,ILOAD=800mA | - | 0.55 | 0.70 | V |
| The * denotes the specifications which apply over the full temperature range. | |||||
| (NOTE 1) Unless otherwise specified VOUT=VSENSE, VADJ=0V. | |||||
| (NOTE 2) For adjustable device the minimum load current is the minimum current required to maintain regulation. | |||||
| (NOTE 3) The control pin current is the drive current required for the output transistor. This current will track output current with a ratio of about 1:100. | |||||
| (NOTE 4) The dropout voltage for the LT1117 is caused by either minimum control voltage or minimum power voltage.The specifications represent the minimum input/output voltage required to maintain 1% regulation. | |||||
| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) [mm] | Bonding pads | Backside metal |
| Silicon | 10±1 | (78.740x70.078) [2.0x1.78] |
min 5.512x5.512 mils, 1µm thick, aluminium | Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. |
| All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). | ||||
| TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING |
|
These integrated Circuits are manufactured with medium voltage junction isolated
bipolar process. junction isolated bipolar processes allow integration of high
performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors
and precision thin film resistors. The bond pad metallization is standard 1µm
Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it
compatible with AuSi or AuGe die attach. All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. |
| DIE LAYOUT - MECHANICAL SPECIFICATIONS | ||||||
| PAD # | FUNCTION | X(mils) | X(mm) | Y(mils) | Y(mm) |  |
| 1 | OUTPUT | 3.937 | 0.100 | 62.630 | 1.540 | |
| 2 | OUTPUT | 69.291 | 1.760 | 62.630 | 1.540 | |
| 3 | VPOWER | 36.614 | 0.930 | 52.165 | 1.325 | |
| 4 | VCONTROL | 36.614 | 0.930 | 43.110 | 1.095 | |
| 5 | SENSE | 3.937 | 0.100 | 23.819 | 0.605 | |
| 6 | ADJUST | 3.937 | 0.100 | 3.937 | 0.100 | |
| STANDARD PRODUCTS ORDERING INFORMATION |
| STANDARD PRODUCTS PRICE LIST | |||
| USM PART # | MINIMUM ORDER QUANTITY | Waffle Packs | U/P($) |
| USM LT1117 | 100pc | -WP | $3.20 |
| List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. | |||
| Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. | |||
| ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. |
| U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
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| Last updated: July 01, 2009 | |
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