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USMRE2040A-9R10-1% 1% 9.1Ω MICROWAVE CERAMIC SUBSTRATE THIN FILM RESISTORS Microwave thin film chip resistors on Ceramic Al2O3 20 x 40 mils for microwave applications manufactured by US Microwaves
USMRE2040A-9R10-1% 1% 9.1Ω MICROWAVE CERAMIC SUBSTRATE THIN FILM RESISTORS Microwave thin film chip resistors on Ceramic Al2O3 20 x 40 mils for microwave applications manufactured by US Microwaves US MICROWAVES 9.1Ω MICROWAVE CERAMIC SUBSTRATE THIN FILM RESISTORS 1% Tolerance Advanced Microwave Components USMRE2040A-9R10-1% FEATURES APPLICATIONS CERAMIC THIN FILM RESISTORS Wide resistance range 6.67Ω to 66667Ω Good TCR tracking Low capacitance value Available in die form and shipped in waffle packs Available as 1% resistor tolerance Available as 10% resistor tolerance ONLY for R≤1Ω Biasing discrete transistors circuits Feedback resistors for amplifiers Chip & wire hybrid circuits Surface mount circuits 9.1Ω MICROWAVE CERAMIC SUBSTRATE THIN FILM RESISTORS USMRE2040A-9R10-1% PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE USMRE2040A-9R10-1%, Ceramic (Al2O3) series of microwave thin film resistors is designed to be used in microwave hybrid circuits for biasing of active components. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% tested, visual inspected and packaged in waffle packs. US Microwaves employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 Ω/sq to 10,000Ω/sq. Resistors from 0.1Ω to x MΩ range are available. The resistive material is high stability Tantalum Nitride with low temperature coefficient of resistance, <75ppm/°C typical. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER VALUE UNITS Tolerance 1 % Resistance value 9.10 Ω TCR, -55 to +125 °C typ.75 ppm/°C Capacitance, maximum 0.077 pF Operating Voltage,-55 to +125 °C, 50W resistor 43.1 Vdc Power Rating (per resistor) @70°C (Derate linearly to zero @150°C) 18.61 mW Insulation Resistance @25°C 3E-12 Ω ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION SUBSTRATE THICKNESS [mils] DIE SIZE LxW [mils] Ceramic (Al2O3) 10±1 40x20±2 RESISTOR BONDING PADS BACKSIDE METAL The resistive material is high stability Tantalum Nitride with low temperature coefficient of resistance, <75ppm/°C typical. For Rsq<10Ω/sq and Rsq>500Ω/sq, the resistive material is proprietary. The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. The backside of the die is metallized with TiW/Au which is compatible with most die attaching methods. Other metallizations are available upon special request. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). CERAMIC THIN FILM RESISTORS DIE LAYOUT / MECHANICAL SPECIFICATIONS 9.1Ω MICROWAVE CERAMIC SUBSTRATE THIN FILM RESISTORS USMRE2040A-9R10-1% Nsq = 6.66666666666667 CERAMIC THIN FILM RESISTORS CHIP MOUNT 9.1Ω MICROWAVE CERAMIC SUBSTRATE THIN FILM RESISTORS USMRE2040A-9R10-1% thin film chip resistor mount CERAMIC THIN FILM RESISTORS ASSEMBLY PROCESS - SHORT APPLICATION NOTE Thin film chip resistors are designed for critical designs where space is at premium. The thin film chip resistors can be die attached to the PCB or to a base plate using AuSn or AuGe preforms. Since the thin film chip resistors do not have terminals, they have to be attached using gold wire via gap welding after the backside is soldered in place. Backside metallization for thin film chip resistors is Ti/Pt/Au which is also compatible with Sn solder. For the more common SnPb, a Ti/Ni/Au backside metallization should be requested. Note: Layout for resistor might differ for 1% tolerance due to laser trim requirements. STANDARD PRODUCTS ORDERING INFORMATION USM P/N WAFFLE PACK R [Ω] MIN. QTY U/P [$] USMRE2040A-9R10-1% -WP 9.10 1000 RFQ Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 ©1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.
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