USMRN6020T10AO-10R0 10Ω MICROWAVE 10 MILS ALUMINA THIN FILM LOG RESISTOR NETWORK SERIES Mini-Systems Inc. MSMT116AT-xxxxx-F/J-G/GB Microwave thin film chip resistors on 10 mils Alumina Al2O3 20 x 60 mils for microwave applications manufactured by US MicrowavesMini-Systems Inc. MSMT116AT-xxxxx-F/J-G/GB,Alumina,Al2O3,thin film chip resistors,microwave,chip resistors,thin film resistors,terminations, dividers, attenuators,microwave resistors,microwave terminations,microwave dividers,microwave attenuators,microwave chip resistors,microwave chip terminations,microwave chip dividers,microwave chip attenuators
USMRN6020T10AO-10R0 10Ω MICROWAVE 10 MILS ALUMINA THIN FILM LOG RESISTOR NETWORK SERIES Mini-Systems Inc.
MSMT116AT-xxxxx-F/J-G/GB Microwave thin film chip resistors on 10 mils Alumina Al2O3 20 x 60 mils for microwave
applications manufactured by US MicrowavesMini-Systems Inc. MSMT116AT-xxxxx-F/J-G/GB,Alumina,Al2O3,thin film chip
resistors,microwave,chip resistors,thin film resistors,terminations, dividers, attenuators,microwave
resistors,microwave terminations,microwave dividers,microwave attenuators,microwave chip resistors,microwave chip
terminations,microwave chip dividers,microwave chip attenuators US MICROWAVES 10Ω MICROWAVE 10 MILS ALUMINA THIN FILM
LOG RESISTOR NETWORK SERIES 1% Tolerance Advanced Microwave Components USMRN6020T10AO-10R0-1% FEATURES APPLICATIONS
MULTIPAD / MULTITAP RESISTOR Wide resistance range 1R=1 to 32,000 Ω, and 1% tolerance Good TCR tracking Low capacitance
value Available in die form High stability ΔR/R=0.5% (1000hrs., 70°C, 100% power) High temperatire exposure, high
termal shock resistance Biasing discrete transistors circuits Feedback resistors for amplifiers Chip & wire hybrid
circuits Surface mount circuits 10Ω MICROWAVE 10 MILS ALUMINA THIN FILM LOG RESISTOR NETWORK SERIES
USMRN6020T10AO-10R0-1% PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE USMRN6020T10AO-1% 10 mils Alumina (Al2O3) series
of microwave thin film LOG Resistor Network are designed to be used in microwave hybrid circuits for biasing of active
components. These devices can be used over the full military temperature range -55°C to +150°C. Quality and workmanship
is per MIL-S-883. Level B. Devices are 100% tested, visual inspected and packaged in waffle packs. US Microwaves
employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1Ω/sq to
10,000Ω/sq. Resistors from 0.1Ω to x 100,000Ω; range are available. The resistive material is high stability Tantalum
Nitride with low temperature coefficient of resistance, ≤75ppm/°C typical. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN
FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film
technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization
and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the
preferred solution for all applications that require low noise, long term stability and excellent performance at very
high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive
films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and
are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured
using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER
VALUE UNITS Tolerance 1 % Resistance value 1R 10.00 Ω TCR, -55 to +125 °C typ.75 ppm/°C Capacitance min. 0.19 max. 0.24
pF Operating Voltage,-55 to +150°C, 240Ω resistor 31.14 Vdc Power Rating (per resistor) @70°C (Derate linearly to zero
@150°C) 96.99 mW Power Rating (total) @70°C (Derate linearly to zero @150°C) 575 mW Insulation Resistance @25°C 3E-12 Ω
Noise -20 dB Frequency 3dB 66.31 GHz ONLY Proper die handling equipment and procedures should be employed. Stresses
beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION SUBSTRATE
THICKNESS [mils] DIE SIZE LxW [mils] Alumina (Al2O3) 10±1 60x20±2 RESISTOR BONDING PADS BACKSIDE METAL The resistive
material is high stability Tantalum Nitride with low temperature coefficient of resistance, <75ppm/°C typical. For
Rsq<10Ω/sq and Rsq>500Ω/sq, the resistive material is proprietary. The bonding pads of the resistors are 3µm thick,
99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. The
backside of the die is metallized with TiW/Au which is compatible with most die attaching methods. Other metallizations
are available upon special request. All US Microwaves products are available in die form. Typical delivery for die
products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock.
Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and
shipped in waffle packs (WP). MULTIPAD / MULTITAP RESISTOR DIE LAYOUT / MECHANICAL SPECIFICATIONS 10Ω MICROWAVE 10 MILS
ALUMINA THIN FILM LOG RESISTOR NETWORK SERIES USMRN6020T10AO-10R0-1% Nsq = 4.8 [ R = 0.2Rsq + 0.2Rsq + 0.4Rsq + 1Rsq +
1Rsq + 2Rsq + = 4.8Rsq ] MULTIPAD / MULTITAP RESISTOR CHIP MOUNT 10Ω MICROWAVE 10 MILS ALUMINA THIN FILM LOG RESISTOR
NETWORK SERIES USMRN6020T10AO-10R0-1% thin film chip resistor mount MULTIPAD / MULTITAP RESISTOR ASSEMBLY PROCESS -
SHORT APPLICATION NOTE Thin film chip resistors are designed for critical designs where space is at premium. The thin
film chip resistors can be die attached to the PCB or to a base plate using AuSn or AuGe preforms. Since the thin film
chip resistors do not have terminals, they have to be attached using gold wire via gap welding after the backside is
soldered in place. Backside metallization for thin film chip resistors is Ti/Pt/Au which is also compatible with Sn
solder. For the more common SnPb, a Ti/Ni/Au backside metallization should be requested. Note: Layout for resistor
might differ for 1% tolerance due to laser trim requirements. STANDARD PRODUCTS ORDERING INFORMATION USM P/N WAFFLE
PACK 1R [Ω] MIN. QTY U/P [$] USMRN6020T10AO-10R0-1% -WP 10.00 1000 RFQ Products sold for space, military or medical
applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be
established on a case by case basis. For any special applications, die level KGD qualification requirements, different
packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING:
Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt
is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US
Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery
for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain
items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire
applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can
be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be
supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for
customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY!
US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities
are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no
responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which
may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without
prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are
intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or
nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support
PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 ©1990- US MICROWAVES All rights reserved. No material from this site
may be used or reproduced without permission.
|