| KOVAR
CARRIERS-GOLD PLATED KOVAR CARRIERS; USM RFCXXXX-TT3 MODEL A; Kovar carriers are used for ceramic substrates die attach where
good thermal conductivity and low expansion coefficient are desirable.; Kovar carriers for microwave hybrid circuits. Kovar
carriers are gold plated using a proprietary process for high temperature gold germanium and gold tin preform die attach.
Kovar has a low expansion coefficient which allows ceramic substrates to be die attached with minimal stress.; US MICROWAVES
manunufacturer of high reliability microwave integrated circuits MIC technology. US Microwave offers a multitude of applied
thin film products and microwave semiconductor devices: manufactures and supplies high quality standard microwave thin film
circuits and microwave devices using advanced technical ceramics and semiconductor materials; Products include RF micro devices
for hybrid chip and wire applications; microwave thin film circuits, custom manufacturing from customer's data, spiral chip
inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap
thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS
capacitors, ceramic capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes, varactor diodes and zero bias diodes,
RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe. SEMICONIX Designs and manufactures
standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high
performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor
components are designed and manufactured for space, medical, telecommunications and military applications only. Company's
technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic
applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog
devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number
of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes,
phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far
less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components:
photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington,
high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes,
TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET
s and MOSFETs, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions:HTE Labs Provides Wafer Foundry, R&D support
and Specialty Wafer Fab Processing to customers from semiconductors and microelectronics industry. Wafer foundry includes
the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support
is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology
(TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies
and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like
SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi,
diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching,
silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process,
sputter depositions of thin film resistors: SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside
sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs
and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial
controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and
schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is suppling integrated termination,
filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances.
Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and
are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices
- Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures
and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip
and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors
- ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film
resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors,
ceramic capacitors, Schottky,PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS
and T MOSFET s, MMIC - RF IC s silicon and SiGe. |
