| FEATURES |
| APPLICATIONS |
| CERAMIC STAND OFF |
| temperature range -55°C to +125°C |
| Quality and workmanship per MIL-S-883 Level B |
| Microwave & millimeter wave. |
| Standoffs - Ceramic Stand offs for microwave chip and wire hybrid circuits assembly. These stand offs are electrically isolated and can be used also as bonding islands and/or zero ohm jumpers.SFxxxx-10 series of microwave thin film ceramic stand offs is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs. |
| US MICROWAVES Advanced Microwave Components |
MICROWAVE THIN FILM CERAMIC STAND OFFS USM SFxxxx-10 |
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| PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE |
| The SFxxxx-10 series of microwave thin film ceramic stand offs is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883 Level B. Devices are 100% visual inspected and packaged in waffle packs. |
| TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING |
| All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. |
| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) | Frontside metal | Backside metal |
| Ceramic / Al2O3 99.6% | 10±1 | LL x WW±2 | The front side metallization is min 3µ thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. | Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. |
| All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). | ||||
| LAYOUT - MECHANICAL SPECIFICATIONS |
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| STANDARD PRODUCTS ORDERING INFORMATION |
| STANDARD PRODUCTS PRICE LIST | ||||||||
| USM Part # | L(mil) | W(mil) | MINIMUM ORDER | U/P($)>1K | U/P($)>5K | U/P($)>10K | U/P($)>50K | U/P($)>100K |
| USM SF1000-10 | 10 | 10 | $250 / 482 pc | $0.29 | $0.24 | $0.23 | $0.20 | $0.13 |
| USM SF1020-10 | 10 | 20 | $250 / 440 pc | $0.30 | $0.26 | $0.24 | $0.21 | $0.14 |
| USM SF1030-10 | 10 | 30 | $250 / 406 pc | $0.31 | $0.27 | $0.25 | $0.22 | $0.15 |
| USM SF2000-10 | 20 | 20 | $250 / 392 pc | $0.32 | $0.28 | $0.27 | $0.23 | $0.16 |
| USM SF2040-10 | 20 | 40 | $250 / 322 pc | $0.39 | $0.34 | $0.31 | $0.28 | $0.19 |
| USM SF2060-10 | 20 | 60 | $250 / 274 pc | $0.46 | $0.40 | $0.36 | $0.33 | $0.23 |
| USM SF3000-10 | 30 | 30 | $250 / 314 pc | $0.40 | $0.35 | $0.32 | $0.29 | $0.20 |
| USM SF3060-10 | 30 | 60 | $250 / 236 pc | $0.53 | $0.46 | $0.42 | $0.38 | $0.26 |
| USM SF30120-10 | 30 | 120 | $250 / 158 pc | $0.80 | $0.70 | $0.64 | $0.58 | $0.40 |
| USM SF4000-10 | 40 | 40 | $250 / 252 pc | $0.50 | $0.43 | $0.40 | $0.36 | $0.25 |
| USM SF4080-10 | 40 | 80 | $250 / 176 pc | $0.71 | $0.62 | $0.57 | $0.52 | $0.36 |
| USM SF40120-10 | 40 | 120 | $250 / 134 pc | $0.93 | $0.81 | $0.74 | $0.67 | $0.46 |
| USM SF40160-10 | 40 | 160 | $250 / 110 pc | $1.15 | $1.00 | $0.92 | $0.83 | $0.57 |
| List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. | ||||||||
| Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. | ||||||||
| ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. |
| U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
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| Last updated: July 01, 2009 | |
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