| HSKALNI05120040 Aluminum Nitride thermal management, therma plane, Laser diode submounts AlN - 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin - High heat transfer rate, High thermal conductivity Aluminum Nitride Gold Tin heat sink submounts and stand offs manufactured by US Microwaves HSKALNI05120040,thermal management, therma plane, Laser diode submounts,Gold Tin,Heat sink, submounts, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers HSKALNI05120040 Aluminum Nitride thermal management, therma plane, Laser diode submounts AlN - 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin - High heat transfer rate, High thermal conductivity Aluminum Nitride Gold Tin heat sink submounts and stand offs manufactured by US Microwaves HSKALNI05120040,thermal management, therma plane, Laser diode submounts,Gold Tin,Heat sink, submounts, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers US MICROWAVES 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin Advanced Microwave Components HSKALNI05120040 FEATURES APPLICATIONS AlN Isolated Heat Sink Submount High heat transfer rate High thermal conductivity Very good thermal contact Very good thermal shock resistance Microwave hybrid circuits Mount for GaAs microwave active devices Solid state RF power amplifiers 120x40 mils, 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin HSKALNI05120040 HSKALNI05120040 Aluminum Nitride Isolated Gold Tin Heat Sink Submounts PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The HSKALNI05120040 series of microwave 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING HSKALNI05120040 Aluminum Nitride Isolated Gold Tin Heat Sink Submounts ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER SYMBOL VALUE UNITS Length L 120 mils Width W 40 mils Thickness T 5 mils Thermal Resistance Rth 0.24 K/W Thermal Conductivity k 4.17E+00 W/K Capacitance C 1.878 pF ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. HSKALNI05120040 Aluminum Nitride Isolated Gold Tin Heat Sink Submounts GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Case style AlN [Aluminum Nitride] 5±0.5 120x40±2 Frontside metal Backside metal The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. 120x40 mils, 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin HSKALNI05120040 All US Microwaves Aluminum Nitride Isolated Gold Tin Heat Sink Submount products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). Aluminum Nitride Isolated Gold Tin Heat Sink Submounts STANDARD PRODUCTS ORDERING INFORMATION Aluminum Nitride Isolated Gold Tin Heat Sink Submounts STANDARD PRODUCTS T L W METAL DIE ATTACH US MICROWAVES PART NUMBER WAFFLE PACKS MIN. QTY U/P [$] ORDER [mils] 5 120 40 TiW/Au AuSi, AuGe, epoxy HSKALNI05120040-BD0 -WP 268 $4.776 ORDER Ti/Pd/Au AuSn, AuGe HSKALNI05120040-BD1 -WP RFQ Ti/Pt/Au AuSn, AuGe HSKALNI05120040-BD2 -WP RFQ Ti/Ni/Au Soft Solder SAC HSKALNI05120040-BD3 -WP RFQ Ti/Pt/AuSn AuSn eutectic HSKALNI05120040-BD4 -WP RFQ Ti/Ni/Sn Soft Solder SAC HSKALNI05120040-BD5 -WP RFQ 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin HSKALNI05120040: Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. HSKALNI05120040 Aluminum Nitride Isolated Gold Tin Heat Sink Submounts INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Aluminum Nitride Isolated gold tin heat sink submounts may be ordered on line HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin SHIPPING/PACKAGING: All 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin SAMPLES: Samples of 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales |
| US MICROWAVES | 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin | |
| Advanced Microwave Components | HSKALNI05120040 | |
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FEATURES
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APPLICATIONS
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AlN Isolated Heat Sink Submount
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| HSKALNI05120040 Aluminum Nitride Isolated Gold Tin Heat Sink Submounts |
| PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE |
| The HSKALNI05120040 series of microwave 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs. |
| TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING |
| All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. |
| HSKALNI05120040 Aluminum Nitride Isolated Gold Tin Heat Sink Submounts | |||
| ELECTRICAL/MECHANICAL CHARACTERISTICS | |||
| PARAMETER | SYMBOL | VALUE | UNITS |
| Length | L | 120 | mils |
| Width | W | 40 | mils |
| Thickness | T | 5 | mils |
| Thermal Resistance | Rth | 0.24 | K/W |
| Thermal Conductivity | k | 4.17E+00 | W/K |
| Capacitance | C | 1.878 | pF |
| ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. | |||
| HSKALNI05120040 Aluminum Nitride Isolated Gold Tin Heat Sink Submounts | ||||
| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness [mils] | Size [mils] | Case style | |
| AlN [Aluminum Nitride] | 5±0.5 | 120x40±2 | ||
| Frontside metal | Backside metal | |||
| The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. | The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. | |||
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| All US Microwaves Aluminum Nitride Isolated Gold Tin Heat Sink Submount products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). | ||||
| Aluminum Nitride Isolated Gold Tin Heat Sink Submounts STANDARD PRODUCTS ORDERING INFORMATION |
| Aluminum Nitride Isolated Gold Tin Heat Sink Submounts STANDARD PRODUCTS | |||||||||
| T | L | W | METAL | DIE ATTACH | US MICROWAVES PART NUMBER |
WAFFLE PACKS |
MIN. QTY |
U/P [$] |
ORDER |
| [mils] | |||||||||
| 5 | 120 | 40 | TiW/Au | AuSi, AuGe, epoxy | HSKALNI05120040-BD0 | -WP | 268 | $4.776 | ORDER |
| Ti/Pd/Au | AuSn, AuGe | HSKALNI05120040-BD1 | -WP | RFQ | |||||
| Ti/Pt/Au | AuSn, AuGe | HSKALNI05120040-BD2 | -WP | RFQ | |||||
| Ti/Ni/Au | Soft Solder SAC | HSKALNI05120040-BD3 | -WP | RFQ | |||||
| Ti/Pt/AuSn | AuSn eutectic | HSKALNI05120040-BD4 | -WP | RFQ | |||||
| Ti/Ni/Sn | Soft Solder SAC | HSKALNI05120040-BD5 | -WP | RFQ | |||||
| 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin HSKALNI05120040: List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. | |||||||||
| Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. | |||||||||
| STANDARD PRODUCTS AVAILABLE FROM STOCK - ORDERING INFORMATION | ||||||
| USM P/N | MIN QTY | U/P | ORDER/RFQ | STOCK QTY | U/P | ORDER/RFQ |
| No part available from stock | ||||||
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ORDERING: Aluminum Nitride Isolated gold tin heat sink submounts may be ordered on line
HERE.
A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin products packaged in waffle packs is 2-4 weeks ARO. For custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, heat sink devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples of 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all 5 mils Aluminum Nitride Isolated submounts and heat sinks gold tin standard products provided minimum order quantities are met. |
| U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
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| Last updated: September 24, 2010 | |
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