| xxxW, nnnGHz, ALUMINA Aluminum Oxide POWER CHIP terminationS USM RPTLLLWWWAO-xxxW-nnnGHz FEATURES High power dissipation while working up to 10GHz range frequencies Low insertion loss High reliability and ruggedness Small chip size with reduced stray capacitance per unit area. Low temperature coefficient and wide operating temperature range. APPLICATIONS Applications of Power chip terminations include microwave and RF high power terminations, resistive microwave power dividers, Wilkinson power dividers , power attenuators, microwave power amplifiers. PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE USM RPTLLLWWWAO-xxxW-nnnGHz flange less power chip terminations are designed to be used in chip and wire hybrid circuits as microwave and RF power terminations, power terminations, Wilkinson power dividers, power attenuators, microwave power amplifiers, etc. Flange less thin film power chip terminations and terminations have low temperature coefficients, low noise and increased long term stability compared to their thick film counterpart (see app note 110). In high power applications, temperature coefficient of resistance and long term stability have to be the best available. Suggestions on how to mount and use flange less power chip terminations are available in app note 111. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride terminations, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL CHARACTERISTICS Resistance range 10-100 W Maxim Power xxxW Maxim Capacitance yyypF 3dB frequency (defined for 50 W resistance) 64 GHz Temperature Coefficient -55C to 150C 100 ppm/deg C Tolerances available 1 % Operating Temperature range -65 to 200 deg C Working voltage (Vw) SQR(P*R) V Peak voltage at 25C, 5 sec 1.5 x (Vw) V Insulation resistance at 25 C 10E9 W ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION Substrate Alumina Al2O3 , Thickness (mils) 5.5±3,Die size (mils) LLL x WWW ±2 Bonding pads min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier, Backside metal Backside of the die is metallized with standard Ti/Pt/Au compatible with Au-Sn, Au-Ge or silver filled conductive epoxy. Custom metallization is available for special orders. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). |
| US MICROWAVES Advanced Microwave Components |
nW, x GHz, ALUMINA CUSTOM POWER CHIP TERMINATIONS USM RPTLLLWWWAO-nW-xGHz |
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| PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE |
| USM RPTLLLWWWAO-nW-xGHz power chip terminations are designed to be used in chip and wire hybrid circuits as power terminations, terminations Wilkinson power dividers, power amplifiers, etc. When used in high temperature applications, temperature coefficient of resistance has to be as small as possible. |
| TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING |
| All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. |
| ELECTRICAL CHARACTERISTICS | ||
| PARAMETER | VALUE | UNITS |
| Resistance | 10-100 | W |
| Maxim Power | P | W |
| Maxim Capacitance | C | pF |
| 3dB frequency (defined for R custom resistance) | F | GHz |
| Temperature Coefficient -55C to 150C | 100 | ppm/deg C |
| Tolerances available | 1 | % |
| Operating Temperature range | -65 to 200 | deg C |
| Working voltage (Vw) | V | V |
| Peak voltage at 25C, 5 sec | 1.5 x (Vw) | V |
| VSWR @ characteristic impedance Z=50W | max. 1.25 | V |
| Insulation resistance at 25 C | 1012 | W |
| ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. |
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| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) | Bonding pads | Backside metal |
| Alumina Al2O3 | T | L x W ±2 | min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier | Backside of the die is metallized with standard Ti/Pt/Au compatible with Au-Sn, Au-Ge or silver filled conductive epoxy. Custom metallization is available for special orders. |
| All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). | ||||
| DIE LAYOUT - MECHANICAL SPECIFICATIONS |
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| STANDARD PRODUCTS ORDERING INFORMATION |
| STANDARD PRODUCTS PRICE LIST | |||
| USM PART # | QUANTITY | Waffle Packs | U/P($) |
| USMRPTLLLWWWTTAO-P-R-TOL | 1,000pc | -WP | |
| USMRPTLLLWWWTTAO-P-R-TOL | 5,000pc | -WP | |
| List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. | |||
| Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. | |||
| ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. |
| U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
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| Last updated: July 01, 2009 | |
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