USM SD1460 FM BROADCAST APPLICATIONS RF & MICROWAVE TRANSISTOR - 28 V gold metallized epitaxial silicon NPN planar transistor designed for VHF FM broadcast transmitters

USM SD1460 FM BROADCAST APPLICATIONS RF MICROWAVE TRANSISTOR - 28 V gold metallized epitaxial silicon NPN planar transistor designed for VHF FM broadcast transmitters 108 MHz 28 Volts Efficiency 75% Common emitter Gold metallization POUT=150W min with 9.2 dB gain For microwave power amplification. PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The USM SD1143 is a 28 V gold metallized epitaxial silicon NPN planar transistor designed for VHF FM broadcast transmitters. This device utilizes diffused emitter resistors to achieve infinite VSWR at rated operating conditions. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1O/sq to 10,000O/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VCBO Collector-Base Voltage 60 V VCEO Collector-Emitter Voltage 25 V VCES Collector-Emitter Voltage 60 V VEBO Emitter-Base Voltage 4.0 V IC Device Current 16 A PDISS Power Dissipation 230 W TJ Junction Temperature +200 °C TSTG Storage Temperature - 65 to +150 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. ELECTRICAL CHARACTERISTICS STATIC Symbol Test Conditions Value Unit Min. Typ. Max. BVCBO IC = 100mA IE = 0mA 60 V BVCER IC = 100mA RBE = 10O 55 V BVCEO IC = 100mA IB = 0mA 25 V BVEBO IE = 20mA IC = 0mA 4.0 V hFE VCE = 5V IC = 1A 20 150 DYNAMIC Symbol Test Conditions Value Unit Min. Typ. Max. POUT f = 108 MHz PIN = 18 W VCE = 28 V 150 W GP f = 108 MHz PIN = 18 W VCE = 28 V 9.2 dB hc f = 108 MHz PIN = 18 W VCE = 28 V 70 % COB f = 1 MHz VCB = 28 V 150 pF GENERAL DIE INFORMATION Substrate Thickness [mils] Die Size [mils] Bonding Pads Backside metal Silicon 6±0.5 140 x 140 ± 1 min 3 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). DIE LAYOUT STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS PRICE LIST USM PART # Waffle Packs MINIMUM ORDER QUANTITY U/P($) USM SD1460 -WP 100pc $ List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.



US MICROWAVES		FM BROADCAST APPLICATIONS RF & MICROWAVE TRANSISTOR
Advanced Microwave Components		USM SD1460

FEATURES

APPLICATIONS

TRANSISTOR DICE

108 MHz
28 Volts
Efficiency 75%
Common emitter
Gold metallization
POUT=150W min with 9.2 dB gain

For microwave power amplification.

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE

The USM SD1143 is a 28 V gold metallized epitaxial silicon NPN planar transistor designed for VHF FM broadcast transmitters. This device utilizes diffused emitter resistors to achieve infinite VSWR at rated operating conditions.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING

All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

ABSOLUTE MAXIMUM RATINGS
Symbol	Parameter	Value	Unit
VCBO	Collector-Base Voltage	60	V
VCEO	Collector-Emitter Voltage	25	V
VCES	Collector-Emitter Voltage	60	V
VEBO	Emitter-Base Voltage	4.0	V
IC	Device Current	16	A
PDISS	Power Dissipation	230	W
TJ	Junction Temperature	+200	°C
TSTG	Storage Temperature	- 65 to +150	°C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.

ELECTRICAL CHARACTERISTICS
STATIC
Symbol	Test Conditions		Value		Unit
Symbol	Test Conditions	Min.	Typ.	Max.	Unit
BVCBO	IC = 100mA IE = 0mA	60			V
BVCER	IC = 100mA RBE = 10Ω	55			V
BVCEO	IC = 100mA IB = 0mA	25			V
BVEBO	IE = 20mA IC = 0mA	4.0			V
hFE	VCE = 5V IC = 1A	20		150
DYNAMIC
Symbol	Test Conditions		Value		Unit
Symbol	Test Conditions	Min.	Typ.	Max.	Unit
POUT	f = 108 MHz PIN = 18 W VCE = 28 V	150			W
GP	f = 108 MHz PIN = 18 W VCE = 28 V	9.2			dB
hc	f = 108 MHz PIN = 18 W VCE = 28 V	70			%
COB	f = 1 MHz VCB = 28 V			150	pF

GENERAL DIE INFORMATION
Substrate	Thickness [mils]	Die Size [mils]	Bonding Pads	Backside metal
Silicon	6±0.5	140 x 140 ±1	min 3 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier	Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

DIE LAYOUT

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART #	Waffle Packs	MINIMUM ORDER QUANTITY	U/P($)
USM SD1460	-WP	100pc	$
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

Last updated: August 03, 2009
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