US Microwaves - Advanced Microwave Components - MILITARY AND INDUSTRY STANDARDS LINKS AND DOWNLOADS DoD=Department of Defense,MIL-STD-883 download and MIL-PRF-38534E download IPC=Association Connecting Electronics Industries JEDEC=Joint Electron Device Engineering Council DoD MIL-STD-883G 1001 Barometric pressure, reduced (altitude operation) DoD MIL-STD-883G 1002 Immersion DoD MIL-STD-883G 1003 Insulation resistance DoD MIL-STD-883G 1004.7 Moisture resistance DoD MIL-STD-883G 1005.8 Steady state life DoD MIL-STD-883G 1006 Intermittent life DoD MIL-STD-883G 1007 Agree life DoD MIL-STD-883G 1008.2 Stabilization bake DoD MIL-STD-883G 1009.8 Salt atmosphere (corrosion) DoD MIL-STD-883G 1010.7 Temperature cycling DoD MIL-STD-883G 1011.9 Thermal shock DoD MIL-STD-883G 1012.1 Thermal characteristics DoD MIL-STD-883G 1013 Dew point DoD MIL-STD-883G 1014.1 Seal DoD MIL-STD-883G 1015.9 Burn-in test DoD MIL-STD-883G 1016 Life/reliability characterization tests DoD MIL-STD-883G 1017.2 Neutron irradiation DoD MIL-STD-883G 1015.2 Internal water-vapor content DoD MIL-STD-883G 1019.4 Ionizing radiation (total dose) test procedure DoD MIL-STD-883G 1020.1 Dose rate induced latchup test procedure DoD MIL-STD-883G 1021.2 Dose rate upset testing of digital microcircuits DoD MIL-STD-883G 1022 Mosfet threshold voltage DoD MIL-STD-883G 1023.2 Dose rate response of linear microcircuits DoD MIL-STD-883G 1030.1 Preseal burn-in DoD MIL-STD-883G 1031 Thin film corrosion test DoD MIL-STD-883G 1032.1 Package induced soft error test procedure (due to alpha particles) DoD MIL-STD-883G 1033 Endurance life test DoD MIL-STD-883G 1034 Die penetrant test (for plastic devices) DoD MIL-STD-883G 2001.2 Constant acceleration DoD MIL-STD-883G 2002.3 Mechanical shock DoD MIL-STD-883G 2003.7 Solderability DoD MIL-STD-883G 2004.5 Lead integrity DoD MIL-STD-883G 2005.2 Vibration fatigue DoD MIL-STD-883G 2006.1 Vibration noise DoD MIL-STD-883G 2007.2 Vibration, variable frequency DoD MIL-STD-883G 2008.1 Visual and mechanical DoD MIL-STD-883G 2009.9 External visual DoD MIL-STD-883G 2010.10 Internal visual (monolithic) DoD MIL-STD-883G 2011.7 Bond strength (destructive bond pull test) DoD MIL-STD-883G 2012.7 Radiography DoD MIL-STD-883G 2013.1 Internal visual inspection for DPA DoD MIL-STD-883G 2014 Internal visual and mechanical DoD MIL-STD-883G 2015.11 Resistance to solvents DoD MIL-STD-883G 2016 Physical dimensions DoD MIL-STD-883G 2017.7 Internal visual (hybrid) DoD MIL-STD-883G 2015.3 Scanning electron microscope (SEM) inspection of metallization DoD MIL-STD-883G 2019.5 Die shear strength DoD MIL-STD-883G 2020.7 Particle impact noise detection test DoD MIL-STD-883G 2021.3 Glassivation layer integrity DoD MIL-STD-883G 2022.2 Wetting balance solderability DoD MIL-STD-883G 2023.5 Nondestructive bond pull DoD MIL-STD-883G 2024.2 Lid torque for glass-frit-sealed packages DoD MIL-STD-883G 2025.4 Adhesion of lead finish DoD MIL-STD-883G 2026 Random vibration DoD MIL-STD-883G 2027.2 Substrate attach strength DoD MIL-STD-883G 2028.4 Pin grid package destructive lead pull test DoD MIL-STD-883G 2029 Ceramic chip carrier bond strength DoD MIL-STD-883G 2030 Ultrasonic inspection of die attach DoD MIL-STD-883G 2031.1 Flip chip pull-off test DoD MIL-STD-883G 2032.1 Visual inspection of passive elements DoD MIL-STD-883G 2035 Ultrasonic inspection of TAB bonds DoD MIL-STD-883G 3001.1 Drive source, dynamic DoD MIL-STD-883G 3002.1 Load conditions DoD MIL-STD-883G 3003.1 Delay measurements DoD MIL-STD-883G 3004.1 Transition time measurements DoD MIL-STD-883G 3005.1 Power supply current DoD MIL-STD-883G 3006.1 High level output voltage DoD MIL-STD-883G 3007.1 Low level output voltage DoD MIL-STD-883G 3008.1 Breakdown voltage, input or output DoD MIL-STD-883G 3009.1 Input current, low level DoD MIL-STD-883G 3010.1 Input current, high level DoD MIL-STD-883G 3011.1 Output short circuit current DoD MIL-STD-883G 3012.1 Terminal capacitance DoD MIL-STD-883G 3013.1 Noise margin measurements for digital microelectronic devices DoD MIL-STD-883G 3014 Functional testing DoD MIL-STD-883G 3015.7 Electrostatic discharge sensitivity classification DoD MIL-STD-883G 3016 Activation time verification DoD MIL-STD-883G 3017 Microelectronics package digital signal transmission DoD MIL-STD-883G 3015 Crosstalk measurements for digital microelectronic device packages DoD MIL-STD-883G 3019.1 Ground and power supply impedance measurements for digital microelectronics device packages DoD MIL-STD-883G 3020 High impedance (off-state) low-level output leakage current DoD MIL-STD-883G 3021 High impedance (off-state) high-level output leakage current DoD MIL-STD-883G 3022 Input clamp voltage DoD MIL-STD-883G 3023 Static latch-up measurements for digital CMOS microelectronic devices DoD MIL-STD-883G 3024 Simultaneous switching noise measurements for digital microelectronic devices DoD MIL-STD-883G 4001.1 Input offset voltage and current and bias current DoD MIL-STD-883G 4002.1 Phase margin and slew rate measurements DoD MIL-STD-883G 4003.1 Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio DoD MIL-STD-883G 4004.1 Open loop performance DoD MIL-STD-883G 4005.1 Output performance DoD MIL-STD-883G 4006.1 Power gain and noise figure DoD MIL-STD-883G 4007 Automatic gain control range DoD MIL-STD-883G 5001 Parameter mean value control DoD MIL-STD-883G 5002.1 Parameter distribution control DoD MIL-STD-883G 5003 Failure analysis procedures for microcircuits DoD MIL-STD-883G 5004.10 Screening procedures DoD MIL-STD-883G 5005.13 Qualification and quality conformance procedures DoD MIL-STD-883G 5006 Limit testing DoD MIL-STD-883G 5007.6 Wafer lot acceptance DoD MIL-STD-883G 5008.8 Test procedures for hybrid and multichip microcircuits DoD MIL-STD-883G 5009.1 Destructive physical analysis DoD MIL-STD-883G 5010.3 Test procedures for custom monolithic microcircuits DoD MIL-STD-883G 5011.4 Evaluation and acceptance procedures for polymeric adhesives. DoD MIL-STD-883G 5012.1 Fault coverage measurement for digital microcircuits. DoD MIL-STD-883G 5013 Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers. IPC TM-650 2.1.1D Microsectioning - 3/98 IPC TM-650 2.1.1.1 Microsectioning, Ceramic Substrate - 12/87 IPC TM-650 2.1.1.2 Microsectioning - Semi or Automatic Technique Microsection Equipment (Alternate) - 7/93 IPC TM-650 2.1.2A Pinhole Evaluation, Dye Penetration Method - 3/76 IPC TM-650 2.1.3A Plated-Through Hole Structure Evaluation - 8/76 IPC TM-650 2.1.5A Surface Examination, Unclad and Metal Clad Material - 12/82 IPC TM-650 2.1.6B Thickness of Glass Fabric - 12/94 IPC TM-650 2.1.6.1 Weight of Fabric Reinforcements - 12/94 IPC TM-650 2.1.7C Thread Count of Glass Fabric - 12/94 IPC TM-650 2.1.7.1 Thread Count, Organic Fibers - 12/87 IPC TM-650 2.1.8B Workmanship - 12/94 IPC TM-650 2.1.9 Surface Scratch Examination Metal Clad Foil - 5/86 IPC TM-650 2.1.10A Visual Inspection for Undissolved Dicyandiamide - 12/94 IPC TM-650 2.1.13A Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98 IPC TM-650 2.2.1A Mechanical Dimensional Verification - 8/97 IPC TM-650 2.2.2B Optical Dimensional Verification - 8/97 IPC TM-650 2.2.4C Dimensional Stability, Flexible Dielectric Materials - 5/98 IPC TM-650 2.2.5A Dimensional Inspections Using Mircosections - 8/97 IPC TM-650 2.2.6A Hole Size Measurement, Drilled - 8/97 IPC TM-650 2.2.7A Hole Size Measurement, Plated - 5/86 IPC TM-650 2.2.8 Location of Holes - 4/73 IPC TM-650 2.2.10A Hole Location and Conductor Location - 12/83 IPC TM-650 2.2.12A Thickness of Copper by Weight- 3/76 IPC TM-650 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated - 9/87 IPC TM-650 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers - 7/89 IPC TM-650 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers - 7/89 IPC TM-650 2.2.13.1A Thickness, Plating in Holes, Microhm Method - 1/83 IPC TM-650 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95 IPC TM-650 2.2.14.1 Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95 IPC TM-650 2.2.14.2 Solder Powder Particle Size Distribution - Optical Image Analyzer Method--1/95 IPC TM-650 2.2.14.3 Determination of Maximum Solder Powder Particle Size - 1/95 IPC TM-650 2.2.15 Cable Dimensions (Flat Cable) - 6/79 IPC TM-650 2.2.16 Artwork Master Evaluation by Use of a Drilled Panel - 12/87 IPC TM-650 2.2.16.1 Artwork Master Evaluation by Overlay - 12/87 IPC TM-650 2.2.17 Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)- 3/90 IPC TM-650 2.2.15 Determination of Thickness of Laminates by Mechanical Measurement - 12/94 IPC TM-650 2.2.15.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94 IPC TM-650 2.2.19 Measuring Hole Pattern Location-12/87 IPC TM-650 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94 IPC TM-650 2.2.20 Solder Paste Metal Content by Weight - 1/95 IPC TM-650 2.2.21 Planarity of Dielectrics for High Density Interconnection (HDI) Microvia Technology - 11-98 IPC TM-650 2.3.1 Chemical Processing, Suitable Processing Material- 4/73 IPC TM-650 2.3.1.1B Chemical Cleaning of Metal Clad Laminates- 5/86 IPC TM-650 2.3.2F Chemical Resistance Of Flexible Printed Wiring Materials - 5/98 IPC TM-650 2.3.3A Chemical Resistance of Insulating Materials- 2/78 IPC TM-650 2.3.4B Chemical Resistance, Marking Paints and Inks - 8/97 IPC TM-650 2.3.4.2A Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure - 12/94 IPC TM-650 2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride- 5/86 IPC TM-650 2.3.5B Density, Insulating Material - 8/97 IPC TM-650 2.3.6A Etching, Ammonium Persulfate Method - 7/75 IPC TM-650 2.3.7A Etching, Ferric Chloride Method - 7/75 IPC TM-650 2.3.7.1A Cupric Chloride Etching Method - 12/94 IPC TM-650 2.3.7.2A Alkaline Etching Method - 12/94 IPC TM-650 2.3.8A Flammability, Flexible Insulating Materials- 12/82 IPC TM-650 2.3.8.1 Flammability of Flexible Printed Wiring- 12/88 IPC TM-650 2.3.9D Flammability of Prepreg and Thin Laminate - 8/97 IPC TM-650 2.3.10B Flammability of Laminate - 12/94 IPC TM-650 2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate- 8/98 IPC TM-650 2.3.11 Glass Fabric Construction- 4/73 IPC TM-650 2.3.13 Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods- 1/95 IPC TM-650 2.3.14 Print, Etch, and Plate Test- 4/73 IPC TM-650 2.3.15C Purity, Copper Foil or Plating - 8/97 IPC TM-650 2.3.16B Resin Content of Prepreg, by Burn-off - 12/94 IPC TM-650 2.3.16.1C Resin Content of Prepeg, by Treated Weight--12/94 IPC TM-650 2.3.16.2 Treated Weight of Prepreg - 12/94 IPC TM-650 2.3.17D Resin Flow Percent of Prepreg - 8/97 IPC TM-650 2.3.17.1B Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98 IPC TM-650 2.3.17.2B Resin Flow of "No Flow" Prepreg - 8/97 IPC TM-650 2.3.15A Gel Time, Prepreg Materials - 4/86 IPC TM-650 2.3.19C Volatile Content of Prepreg - 12/94 IPC TM-650 2.3.20 Plating Quality, Hull Cell Method - 8/97 IPC TM-650 2.3.22 Copper Protective Coating Quality - 2-78 IPC TM-650 2.3.23B Cure (Permanency) Thermally Cured Solder Mask - 2/88 IPC TM-650 2.3.23.1A Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88 IPC TM-650 2.3.24 Porosity of Gold Plating- 2/78 IPC TM-650 2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85 IPC TM-650 2.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) - 8/97 IPC TM-650 2.3.25B Detection and Measurement of Ionizable Surface Contaminants - 8/97 IPC TM-650 2.3.26A Ionizable Detection of Surface Contaminants (Dynamic Method) - 11/94 IPC TM-650 2.3.26.1 Ionizable Detection of Surface Contaminants (Static Method) - 11/94 IPC TM-650 2.3.26.2 Mobile Ion Content of Polymer Films - 7/95 IPC TM-650 2.3.27 Cleanliness Test - Residual Rosin - 1/95 IPC TM-650 2.3.27.1 Rosin Flux Residue Analysis-HPLC Method - 1/95 IPC TM-650 2.3.28 Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95 IPC TM-650 2.3.29 Flammability, Flexible Flat Cable- 11/88 IPC TM-650 2.3.30A Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81 IPC TM-650 2.3.31 Relative Degree of Cure of U.V. Curable Material - 2/88 IPC TM-650 2.3.32C Flux Induced Corrosion (Copper Mirror Method)- 1/95 IPC TM-650 2.3.33C Presence of Halides in Flux, Silver Chromate Method - 1/95 IPC TM-650 2.3.34B Solids Content, Flux - 1/95 IPC TM-650 2.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95 IPC TM-650 2.3.35B Halide Content, Quantitative (Chloride and Bromide)- 1/95 IPC TM-650 2.3.35.1 Fluorides by Spot Test, Fluxes - Qualitative - 1/95 IPC TM-650 2.3.35.2 Flouride Concentration, Fluxes - Quantitative--1/95 IPC TM-650 2.3.36 Acid Acceptance of Chlorinated Solvents- 10/85 IPC TM-650 2.3.37B Volatile Content of Adhesive Coated Dielectric Films - 5/98 IPC TM-650 2.3.38B Surface Organic Contaminant Detection Test - 8/97 IPC TM-650 2.3.39B Surface Organic Contaminant Identification Test (Infrared Analytical Method) - 8/97 IPC TM-650 2.3.40 Thermal Stability - 7/95 IPC TM-650 2.4.1D Adhesion, Tape Testing--8/97 IPC TM-650 2.4.1.1B Adhesion, Marking Paints and Inks--11/88 IPC TM-650 2.4.1.2 Adhesion of Conductors on Hybrid Substrates--12/87 IPC TM-650 2.4.1.3 Adhesion, Resistors (Hybrid Circuits)--12/87 IPC TM-650 2.4.1.4 Adhesion, Overglaze (Hybrid Circuits)--12/87 IPC TM-650 2.4.1.5A Determination of Heat Transfer--5/95 IPC TM-650 2.4.1.6 Adhesion, Polymer Coating--7/95 IPC TM-650 2.4.2A Ductility of Copper Foil--3/76 IPC TM-650 2.4.2.1D Flexural Fatigue and Ductility, Foil--3/91 IPC TM-650 2.4.3D Flexural Fatigue, Flexible Printed Wiring Materials--5/98 IPC TM-650 2.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91 IPC TM-650 2.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91 IPC TM-650 2.4.4B Flexural Strength of Laminates (at Ambient Temperature)--12/94 IPC TM-650 2.4.4.1A Flexural Strength of Laminates (at Elevated Temperature)--12/94 IPC TM-650 2.4.5 Folding Endurance, Flexible Printed Wiring Materials--4/73 IPC TM-650 2.4.6 Hot Oil--4/73 IPC TM-650 2.4.7A Machinability, Printed Wiring Materials--7/75 IPC TM-650 2.4.8C Peel Strength of Metallic Clad Laminates--12/94 IPC TM-650 2.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86 IPC TM-650 2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)--12/94 IPC TM-650 2.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)--12/94 IPC TM-650 2.4.8.4 Carrier Release, Thin Copper--1/90 IPC TM-650 2.4.9D Peel Strength, Flexible Dielectric Materials--10/88 IPC TM-650 2.4.9.1 Peel Strength of Flexible Circuits - 11/98 IPC TM-650 2.4.9.2 Bonding Process - 11/98 IPC TM-650 2.4.10 Plating Adhesion--4/73 IPC TM-650 2.4.11 Shear Strength Flexible Dielectric Materials--4/73 IPC TM-650 2.4.12A Solderability, Edge Dip Method--6/91 IPC TM-650 2.4.13F Solder Float Resistance Flexible Printed Wiring Materials--5/98 IPC TM-650 2.4.13.1 Thermal Stress of Laminates--12/94 IPC TM-650 2.4.14 Solderability of Metallic Surfaces--4/73 IPC TM-650 2.4.14.1 Solderability, Wave Solder Method--3/79 IPC TM-650 2.4.14.2 Liquid Flux Activity, Wetting Balance Method--1/95 IPC TM-650 2.4.15A Surface Finish, Metal Foil--3/76 IPC TM-650 2.4.16A Initiation Tear Strength, Flexible Insulating Materials--12/82 IPC TM-650 2.4.17 Tear Strength, Propagation--4/73 IPC TM-650 2.4.17.1A Propagation, Tear Strength, Flexible Insulating Materials--12/82 IPC TM-650 2.4.15B Tensile Strength and Elongation, Copper Foil--8/80 IPC TM-650 2.4.15.1 Tensile Strength and Elongation, In-House Plating--8/97 IPC TM-650 2.4.15.2 Hot Rupture Strength, Foil--7/89 IPC TM-650 2.4.15.3 Tensile Strength, Elongation, and Modulus--7/95 IPC TM-650 2.4.19C Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98 IPC TM-650 2.4.20 Terminal Bond Strength, Flexible Printed Wiring--4/73 IPC TM-650 2.4.21D Land Bond Strength, Unsupported Component Hole--8/97 IPC TM-650 2.4.21.1C Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91 IPC TM-650 2.4.22C Bow and Twist (Percentage)--6/99 IPC TM-650 2.4.22.1C Bow and Twist-Laminate--5/93 IPC TM-650 2.4.22.2 Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95 IPC TM-650 2.4.23 Soldering Resistance of Laminate Materials--3/79 IPC TM-650 2.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion by TMA--12/94 IPC TM-650 2.4.24.1 Time to Delamination (TMA Method)--12/94 IPC TM-650 2.4.24.2 Glass Transition Temperature of Organic Films - DMA Method--7/95 IPC TM-650 2.4.24.3 Glass Transition Temperature of Organic Films - TMA Method--7/95 IPC TM-650 2.4.24.4 Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method - 11/98 IPC TM-650 2.4.24.5 Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method -11/98 IPC TM-650 2.4.25C Glass Transition Temperature and Cure Factor by DSC--12/94 IPC TM-650 2.4.26 Tape Test for Additive Printed Boards--3/79 IPC TM-650 2.4.27.1B Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95 IPC TM-650 2.4.27.2A Solder Mask Abrasion (Pencil Method)--2/88 IPC TM-650 2.4.28B Adhesion, Solder Mask (Non-Melting Metals)--8/97 IPC TM-650 2.4.28.1B Adhesion, Solder Resist (Mask), Tape Test Method--8/97 IPC TM-650 2.4.29B Adhesion, Solder Mask, Flexible Circuit--2/88 IPC TM-650 2.4.30 Impact Resistance, Polymer Film--10/86 IPC TM-650 2.4.31A Folding, Flexible Flat Cable--4/86 IPC TM-650 2.4.32A Fold Temperature Testing, Flexible Flat Cable--4/86 IPC TM-650 2.4.33C Flexural Fatigue and Ductility, Flat Cable--3/91 IPC TM-650 2.4.34 Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to 1,600,000 Centipose)--1/95 IPC TM-650 2.4.34.1 Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose)--1/95 IPC TM-650 2.4.34.2 Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose)--1/95 IPC TM-650 2.4.34.3 Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose)--1/95 IPC TM-650 2.4.34.4 Paste Flux Viscosity - T-Bar Spindle Method--1/95 IPC TM-650 2.4.35 Solder Paste - Slump Test--1/95 IPC TM-650 2.4.36B Rework Simulation, Plated-Through Holes for Leaded Components--8/97 IPC TM-650 2.4.37A Evaluation of Hand Soldering Tools for Terminal Connections--7/91 IPC TM-650 2.4.37.1A Evaluation of Hand Soldering Tools for Printed Wiring Board Applications--7/91 IPC TM-650 2.4.37.2 Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93 IPC TM-650 2.4.38A Prepeg Scaled Flow Testing--6/91 IPC TM-650 2.4.39A Dimensional Stability, Glass Reinforced Thin Laminates--2/86 IPC TM-650 2.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87 IPC TM-650 2.4.41 Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86 IPC TM-650 2.4.41.1A Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method--8/97 IPC TM-650 2.4.41.2 Coefficient of Thermal Expansion - Strain Gage Method--8/97 IPC TM-650 2.4.41.3 In-Plane Coefficient of Thermal Expansion, Organic Films--7/95 IPC TM-650 2.4.41.4 Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95 IPC TM-650 2.4.42 Torsional Strength of Chip Adhesives--2/88 IPC TM-650 2.4.42.1 High Tempreature Mechanical Strength Retention of Adhesives--3/88 IPC TM-650 2.4.42.2 Die Shear Strength--2/98 IPC TM-650 2.4.42.3 Wire Bond Pull Strength--2/98 IPC TM-650 2.4.43 Solder Paste - Solder Ball Test--1/95 IPC TM-650 2.4.44 Solder Paste - Tack Test--3/98 IPC TM-650 2.4.45 Solder Paste - Wetting Test--1/95 IPC TM-650 2.4.46 Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms--1/95 IPC TM-650 2.4.47 Flux Residue Dryness--1/95 IPC TM-650 2.4.48 Spitting of Flux-Cored Wire Solder--1/95 IPC TM-650 2.4.49 Solder Pool Test--1/95 IPC TM-650 2.4.50 Thermal Conductivity, Polymer Films--7/95 IPC TM-650 2.4.51 Self Shimming Thermally Conductive Adhesives--1/95 IPC TM-650 2.5.1B Arc Resistance of Printed Wiring Materials--5/86 IPC TM-650 2.5.2A Capacitance of Insulating Materials--7/75 IPC TM-650 2.5.3B Current Breakdown, Plated Through Holes--8/97 IPC TM-650 2.5.4 Current Carrying Capacity, Multilayer Printed Wring--4/73 IPC TM-650 2.5.4.1A Conductor Temperature Rise Due to Current Changes in Conductors--8/97 IPC TM-650 2.5.5A Dielectric Constant of Printed Wiring Materials--7/75 IPC TM-650 2.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 100MHz (Contacting Electrode Systems)--5/86 IPC TM-650 2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method--12/87 IPC TM-650 2.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)--12/87 IPC TM-650 2.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method--10/85 IPC TM-650 2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band--3/98 IPC TM-650 2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ--3/98 IPC TM-650 2.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates--5/89 IPC TM-650 2.5.5.7 Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR--11/92 IPC TM-650 2.5.5.8 Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95 IPC TM-650 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98 IPC TM-650 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material--5/86 IPC TM-650 2.5.6.1A Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings--2/88 IPC TM-650 2.5.6.2A Electric Strength of Printed Wiring Material--8/97 IPC TM-650 2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength--10/86 IPC TM-650 2.5.7C Dielectric Withstanding Voltage, PWB--8/97 IPC TM-650 2.5.8A Dissipation Factor of Flexible Printed Wiring Material--7/75 IPC TM-650 2.5.10A Insulation Resistance, Multilayer Printed Wiring (Between Layers)--12/87 IPC TM-650 2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds--11/98 IPC TM-650 2.5.11 Insulation Resistance, Multilayer Printed Wiring (Within a Layer)--4/73 IPC TM-650 2.5.12 Interconnection Resistance, Multilayer Printed Wiring--4/73 IPC TM-650 2.5.13A Resistance of Copper Foil--3/76 IPC TM-650 2.5.14A Resistivity of Copper Foil--8/76 IPC TM-650 2.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86 IPC TM-650 2.5.16A Shorts, Internal on Multilayer Printed Wiring--11/88 IPC TM-650 2.5.17E Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98 IPC TM-650 2.5.17.1A Volume and Surface Resistivity of Dielectric Materials--12/94 IPC TM-650 2.5.17.2 Volume Resistivity of Conductive Resistance Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method--11/98 IPC TM-650 2.5.15B Characteristic Impedance Flat Cables (Unbalanced)--7/84 IPC TM-650 2.5.19A Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84 IPC TM-650 2.5.19.1A Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)--7/84 IPC TM-650 2.5.21A Digital Unbalanced Crosstalk, Flat Cable--3/84 IPC TM-650 2.5.24 Conductor Resistance, Flexible Flat Cable--6/79 IPC TM-650 2.5.25A Dielectric Withstand Voltage Flexible Fat Cable--11/85 IPC TM-650 2.5.26A Insulation Resistance Flexible Flat Cable--11/85 IPC TM-650 2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79 IPC TM-650 2.5.28A Q Resonance, Flexible Printed Wiring Materials--4/88 IPC TM-650 2.5.30 Balanced and Unbalanced Cable Attenuation Measurements--12/87 IPC TM-650 2.5.31 Current Leakage (Through Overglaze Films)--12/87 IPC TM-650 2.5.32 Resistance Test, Plated Through-Holes--12/87 IPC TM-650 2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools--11/98 IPC TM-650 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools (Ground Measurements)--11/98 IPC TM-650 2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools (Transient Measurements)--11/98 IPC TM-650 2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools (Current Leakage Measurements)--11/98 IPC TM-650 2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)--11/98 IPC TM-650 2.6.1E Fungus Resistance Printed Wiring Materials--8/97 IPC TM-650 2.6.2C Water Absorption, Flexible Printed Wiring--5/98 IPC TM-650 2.6.2.1A Water Absorption, Metal Clad Plastic Laminates--5/86 IPC TM-650 2.6.3E Moisture and Insulation Resistance, Printed Boards--8/97 IPC TM-650 2.6.3.1C Moisture and Insulation Resistance-Polymeric Solder Masks and Conformal Coatings--11/98 IPC TM-650 2.6.3.2B Moisture and Insulation Resistance, Flexible Base Dielectric--5/88 IPC TM-650 2.6.3.3A Surface Insulation Resistance, Fluxes--1/95 IPC TM-650 2.6.4A Outgassing, Printed Boards--8/97 IPC TM-650 2.6.5C Physical Shock, Multilayer Printed Wiring--8/97 IPC TM-650 2.6.6B Temperature Cycling, Printed Wiring Board--12/87 IPC TM-650 2.6.7A Thermal Shock and Continuity, Printed Board--8/97 IPC TM-650 2.6.7.1 Thermal Shock--Polymer Solder Mask Coatings--2/88 IPC TM-650 2.6.7.2A Thermal Shock, Continuity and Microsection, Printed Board--8/97 IPC TM-650 2.6.8D Thermal Stress, Plated Through-Holes--3/98 IPC TM-650 2.6.8.1 Thermal Stress, Laminate--9/91 IPC TM-650 2.6.9A Vibration, Rigid Printed Wiring--8/97 IPC TM-650 2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy--1/95 IPC TM-650 2.6.9.2 Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy--1/95 IPC TM-650 2.6.10A X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods--8/97 IPC TM-650 2.6.11B Hydrolytic Stability Solder Mask and/or Conformal Coating--11/88 IPC TM-650 2.6.12 Temperature Testing, Flexible Flat Cable--6/79 IPC TM-650 2.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring--10/85 IPC TM-650 2.6.14A Resistance to Electrochemical Migration, Polymer Solder Mask--8/87 IPC TM-650 2.6.15B Corrosion, Flux--1/95 IPC TM-650 2.6.16 Pressure Vessel Method for Glass Epoxy Laminate Integrity--7/85 IPC TM-650 2.6.16.1 Moisture Resistance of HDIS Under High Temperature and Pressure (Pressure Vessel)--8/98 IPC TM-650 2.6.17 Hydrolitic Stability, Flexible Printed Wiring Material--12/82 IPC TM-650 2.6.15A Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85 IPC TM-650 2.6.19 Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards--12/87 IPC TM-650 2.6.20A Assessment of Plastic Encapsulated Electronic Components for Susceptibility to Moisture/Reflow Induced Damage--1/95 IPC TM-650 2.6.21 Service Temperature of Flexible Printed Wiring--12/88 IPC TM-650 2.6.22 Superseded by J-STD-035 IPC TM-650 2.6.23 Test Procedure for Steam Ager Temperature Repeatability--7/93 JEDEC JESD-22 22-A100-A Cycled Temperature Humidity Bias Life Test JEDEC JESD-22 22-A101-B Steady State Temperature Humidity Bias Life Test JEDEC JESD-22 22-A102-B Accelerated Moisture Resistance - Unbiased Autoclave JEDEC JESD-22 22-A103-A High Temperature Storage Life JEDEC JESD-22 22-A104-A Temperature Cycling JEDEC JESD-22 22-A105-B Power and Temperature Cycling JEDEC JESD-22 22-A106-A Thermal Shock JEDEC JESD-22 22-A107-A Salt Atmosphere JEDEC JESD-22 22-A108-A Bias Life JEDEC JESD-22 22-A109 Hermeticity JEDEC JESD-22 22-A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST) JEDEC JESD-22 22-A112-A Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices JEDEC JESD-22 22-A113-B Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing JEDEC JESD-22 22-A114-A Electrostatic Discharge (ESD) Sensitivity Testing, Human Body Model (HBM) JEDEC JESD-22 22-A115-A Electrostatic Discharge (ESD) Sensitivity Testing, Machine Model (MM) JEDEC JESD-22 22-B100-A Physical Dimensions JEDEC JESD-22 22-B101 External Visual JEDEC JESD-22 22-B102-C Solderability JEDEC JESD-22 22-B103-A Vibration, Variable Frequency JEDEC JESD-22 22-B104-A Mechanical Shock JEDEC JESD-22 22-B105-A Lead Integrity JEDEC JESD-22 22-B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices JEDEC JESD-22 22-B107-A Marking Permanency JEDEC JESD-22 22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices JEDEC JESD-22 22-C100-A High Temperature Continuity JEDEC JESD-22 22-C101 Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components
 


US Microwaves
Advanced Microwave Components		 MILITARY AND INDUSTRY STANDARDS
LINKS AND DOWNLOADS
 

- Military & Industry Standard Documents -
  • DoD=Department of Defense,MIL-STD-883 download and MIL-PRF-38534E download (HTML)
  • IPC=Association Connecting Electronics Industries
  • JEDEC=Joint Electron Device Engineering Council
    • Authority Standard Test Method Title
    DoD MIL-STD-883G 1001 Barometric pressure, reduced (altitude operation)
    DoD MIL-STD-883G 1002 Immersion
    DoD MIL-STD-883G 1003 Insulation resistance
    DoD MIL-STD-883G 1004.7 Moisture resistance
    DoD MIL-STD-883G 1005.8 Steady state life
    DoD MIL-STD-883G 1006 Intermittent life
    DoD MIL-STD-883G 1007 Agree life
    DoD MIL-STD-883G 1008.2 Stabilization bake
    DoD MIL-STD-883G 1009.8 Salt atmosphere (corrosion)
    DoD MIL-STD-883G 1010.7 Temperature cycling
    DoD MIL-STD-883G 1011.9 Thermal shock
    DoD MIL-STD-883G 1012.1 Thermal characteristics
    DoD MIL-STD-883G 1013 Dew point
    DoD MIL-STD-883G 1014.1 Seal
    DoD MIL-STD-883G 1015.9 Burn-in test
    DoD MIL-STD-883G 1016 Life/reliability characterization tests
    DoD MIL-STD-883G 1017.2 Neutron irradiation
    DoD MIL-STD-883G 1015.2 Internal water-vapor content
    DoD MIL-STD-883G 1019.4 Ionizing radiation (total dose) test procedure
    DoD MIL-STD-883G 1020.1 Dose rate induced latchup test procedure
    DoD MIL-STD-883G 1021.2 Dose rate upset testing of digital microcircuits
    DoD MIL-STD-883G 1022 Mosfet threshold voltage
    DoD MIL-STD-883G 1023.2 Dose rate response of linear microcircuits
    DoD MIL-STD-883G 1030.1 Preseal burn-in
    DoD MIL-STD-883G 1031 Thin film corrosion test
    DoD MIL-STD-883G 1032.1 Package induced soft error test procedure (due to alpha particles)
    DoD MIL-STD-883G 1033 Endurance life test
    DoD MIL-STD-883G 1034 Die penetrant test (for plastic devices)
    DoD MIL-STD-883G 2001.2 Constant acceleration
    DoD MIL-STD-883G 2002.3 Mechanical shock
    DoD MIL-STD-883G 2003.7 Solderability
    DoD MIL-STD-883G 2004.5 Lead integrity
    DoD MIL-STD-883G 2005.2 Vibration fatigue
    DoD MIL-STD-883G 2006.1 Vibration noise
    DoD MIL-STD-883G 2007.2 Vibration, variable frequency
    DoD MIL-STD-883G 2008.1 Visual and mechanical
    DoD MIL-STD-883G 2009.9 External visual
    DoD MIL-STD-883G 2010.10 Internal visual (monolithic)
    DoD MIL-STD-883G 2011.7 Bond strength (destructive bond pull test)
    DoD MIL-STD-883G 2012.7 Radiography
    DoD MIL-STD-883G 2013.1 Internal visual inspection for DPA
    DoD MIL-STD-883G 2014 Internal visual and mechanical
    DoD MIL-STD-883G 2015.11 Resistance to solvents
    DoD MIL-STD-883G 2016 Physical dimensions
    DoD MIL-STD-883G 2017.7 Internal visual (hybrid)
    DoD MIL-STD-883G 2015.3 Scanning electron microscope (SEM) inspection of metallization
    DoD MIL-STD-883G 2019.5 Die shear strength
    DoD MIL-STD-883G 2020.7 Particle impact noise detection test
    DoD MIL-STD-883G 2021.3 Glassivation layer integrity
    DoD MIL-STD-883G 2022.2 Wetting balance solderability
    DoD MIL-STD-883G 2023.5 Nondestructive bond pull
    DoD MIL-STD-883G 2024.2 Lid torque for glass-frit-sealed packages
    DoD MIL-STD-883G 2025.4 Adhesion of lead finish
    DoD MIL-STD-883G 2026 Random vibration
    DoD MIL-STD-883G 2027.2 Substrate attach strength
    DoD MIL-STD-883G 2028.4 Pin grid package destructive lead pull test
    DoD MIL-STD-883G 2029 Ceramic chip carrier bond strength
    DoD MIL-STD-883G 2030 Ultrasonic inspection of die attach
    DoD MIL-STD-883G 2031.1 Flip chip pull-off test
    DoD MIL-STD-883G 2032.1 Visual inspection of passive elements
    DoD MIL-STD-883G 2035 Ultrasonic inspection of TAB bonds
    DoD MIL-STD-883G 3001.1 Drive source, dynamic
    DoD MIL-STD-883G 3002.1 Load conditions
    DoD MIL-STD-883G 3003.1 Delay measurements
    DoD MIL-STD-883G 3004.1 Transition time measurements
    DoD MIL-STD-883G 3005.1 Power supply current
    DoD MIL-STD-883G 3006.1 High level output voltage
    DoD MIL-STD-883G 3007.1 Low level output voltage
    DoD MIL-STD-883G 3008.1 Breakdown voltage, input or output
    DoD MIL-STD-883G 3009.1 Input current, low level
    DoD MIL-STD-883G 3010.1 Input current, high level
    DoD MIL-STD-883G 3011.1 Output short circuit current
    DoD MIL-STD-883G 3012.1 Terminal capacitance
    DoD MIL-STD-883G 3013.1 Noise margin measurements for digital microelectronic devices
    DoD MIL-STD-883G 3014 Functional testing
    DoD MIL-STD-883G 3015.7 Electrostatic discharge sensitivity classification
    DoD MIL-STD-883G 3016 Activation time verification
    DoD MIL-STD-883G 3017 Microelectronics package digital signal transmission
    DoD MIL-STD-883G 3015 Crosstalk measurements for digital microelectronic device packages
    DoD MIL-STD-883G 3019.1 Ground and power supply impedance measurements for digital microelectronics device packages
    DoD MIL-STD-883G 3020 High impedance (off-state) low-level output leakage current
    DoD MIL-STD-883G 3021 High impedance (off-state) high-level output leakage current
    DoD MIL-STD-883G 3022 Input clamp voltage
    DoD MIL-STD-883G 3023 Static latch-up measurements for digital CMOS microelectronic devices
    DoD MIL-STD-883G 3024 Simultaneous switching noise measurements for digital microelectronic devices
    DoD MIL-STD-883G 4001.1 Input offset voltage and current and bias current
    DoD MIL-STD-883G 4002.1 Phase margin and slew rate measurements
    DoD MIL-STD-883G 4003.1 Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio
    DoD MIL-STD-883G 4004.1 Open loop performance
    DoD MIL-STD-883G 4005.1 Output performance
    DoD MIL-STD-883G 4006.1 Power gain and noise figure
    DoD MIL-STD-883G 4007 Automatic gain control range
    DoD MIL-STD-883G 5001 Parameter mean value control
    DoD MIL-STD-883G 5002.1 Parameter distribution control
    DoD MIL-STD-883G 5003 Failure analysis procedures for microcircuits
    DoD MIL-STD-883G 5004.10 Screening procedures
    DoD MIL-STD-883G 5005.13 Qualification and quality conformance procedures
    DoD MIL-STD-883G 5006 Limit testing
    DoD MIL-STD-883G 5007.6 Wafer lot acceptance
    DoD MIL-STD-883G 5008.8 Test procedures for hybrid and multichip microcircuits
    DoD MIL-STD-883G 5009.1 Destructive physical analysis
    DoD MIL-STD-883G 5010.3 Test procedures for custom monolithic microcircuits
    DoD MIL-STD-883G 5011.4 Evaluation and acceptance procedures for polymeric adhesives.
    DoD MIL-STD-883G 5012.1 Fault coverage measurement for digital microcircuits.
    DoD MIL-STD-883G 5013 Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers.
    IPC TM-650 2.1.1D Microsectioning - 3/98
    IPC TM-650 2.1.1.1 Microsectioning, Ceramic Substrate - 12/87
    IPC TM-650 2.1.1.2 Microsectioning - Semi or Automatic Technique Microsection Equipment (Alternate) - 7/93
    IPC TM-650 2.1.2A Pinhole Evaluation, Dye Penetration Method - 3/76
    IPC TM-650 2.1.3A Plated-Through Hole Structure Evaluation - 8/76
    IPC TM-650 2.1.5A Surface Examination, Unclad and Metal Clad Material - 12/82
    IPC TM-650 2.1.6B Thickness of Glass Fabric - 12/94
    IPC TM-650 2.1.6.1 Weight of Fabric Reinforcements - 12/94
    IPC TM-650 2.1.7C Thread Count of Glass Fabric - 12/94
    IPC TM-650 2.1.7.1 Thread Count, Organic Fibers - 12/87
    IPC TM-650 2.1.8B Workmanship - 12/94
    IPC TM-650 2.1.9 Surface Scratch Examination Metal Clad Foil - 5/86
    IPC TM-650 2.1.10A Visual Inspection for Undissolved Dicyandiamide - 12/94
    IPC TM-650 2.1.13A Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98
    IPC TM-650 2.2.1A Mechanical Dimensional Verification - 8/97
    IPC TM-650 2.2.2B Optical Dimensional Verification - 8/97
    IPC TM-650 2.2.4C Dimensional Stability, Flexible Dielectric Materials - 5/98
    IPC TM-650 2.2.5A Dimensional Inspections Using Mircosections - 8/97
    IPC TM-650 2.2.6A Hole Size Measurement, Drilled - 8/97
    IPC TM-650 2.2.7A Hole Size Measurement, Plated - 5/86
    IPC TM-650 2.2.8 Location of Holes - 4/73
    IPC TM-650 2.2.10A Hole Location and Conductor Location - 12/83
    IPC TM-650 2.2.12A Thickness of Copper by Weight- 3/76
    IPC TM-650 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated - 9/87
    IPC TM-650 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers - 7/89
    IPC TM-650 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers - 7/89
    IPC TM-650 2.2.13.1A Thickness, Plating in Holes, Microhm Method - 1/83
    IPC TM-650 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95
    IPC TM-650 2.2.14.1 Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95
    IPC TM-650 2.2.14.2 Solder Powder Particle Size Distribution - Optical Image Analyzer Method--1/95
    IPC TM-650 2.2.14.3 Determination of Maximum Solder Powder Particle Size - 1/95
    IPC TM-650 2.2.15 Cable Dimensions (Flat Cable) - 6/79
    IPC TM-650 2.2.16 Artwork Master Evaluation by Use of a Drilled Panel - 12/87
    IPC TM-650 2.2.16.1 Artwork Master Evaluation by Overlay - 12/87
    IPC TM-650 2.2.17 Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)- 3/90
    IPC TM-650 2.2.15 Determination of Thickness of Laminates by Mechanical Measurement - 12/94
    IPC TM-650 2.2.15.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94
    IPC TM-650 2.2.19 Measuring Hole Pattern Location-12/87
    IPC TM-650 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94
    IPC TM-650 2.2.20 Solder Paste Metal Content by Weight - 1/95
    IPC TM-650 2.2.21 Planarity of Dielectrics for High Density Interconnection (HDI) Microvia Technology - 11-98
    IPC TM-650 2.3.1 Chemical Processing, Suitable Processing Material- 4/73
    IPC TM-650 2.3.1.1B Chemical Cleaning of Metal Clad Laminates- 5/86
    IPC TM-650 2.3.2F Chemical Resistance Of Flexible Printed Wiring Materials - 5/98
    IPC TM-650 2.3.3A Chemical Resistance of Insulating Materials- 2/78
    IPC TM-650 2.3.4B Chemical Resistance, Marking Paints and Inks - 8/97
    IPC TM-650 2.3.4.2A Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure - 12/94
    IPC TM-650 2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride- 5/86
    IPC TM-650 2.3.5B Density, Insulating Material - 8/97
    IPC TM-650 2.3.6A Etching, Ammonium Persulfate Method - 7/75
    IPC TM-650 2.3.7A Etching, Ferric Chloride Method - 7/75
    IPC TM-650 2.3.7.1A Cupric Chloride Etching Method - 12/94
    IPC TM-650 2.3.7.2A Alkaline Etching Method - 12/94
    IPC TM-650 2.3.8A Flammability, Flexible Insulating Materials- 12/82
    IPC TM-650 2.3.8.1 Flammability of Flexible Printed Wiring- 12/88
    IPC TM-650 2.3.9D Flammability of Prepreg and Thin Laminate - 8/97
    IPC TM-650 2.3.10B Flammability of Laminate - 12/94
    IPC TM-650 2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate- 8/98
    IPC TM-650 2.3.11 Glass Fabric Construction- 4/73
    IPC TM-650 2.3.13 Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods- 1/95
    IPC TM-650 2.3.14 Print, Etch, and Plate Test- 4/73
    IPC TM-650 2.3.15C Purity, Copper Foil or Plating - 8/97
    IPC TM-650 2.3.16B Resin Content of Prepreg, by Burn-off - 12/94
    IPC TM-650 2.3.16.1C Resin Content of Prepeg, by Treated Weight--12/94
    IPC TM-650 2.3.16.2 Treated Weight of Prepreg - 12/94
    IPC TM-650 2.3.17D Resin Flow Percent of Prepreg - 8/97
    IPC TM-650 2.3.17.1B Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98
    IPC TM-650 2.3.17.2B Resin Flow of "No Flow" Prepreg - 8/97
    IPC TM-650 2.3.15A Gel Time, Prepreg Materials - 4/86
    IPC TM-650 2.3.19C Volatile Content of Prepreg - 12/94
    IPC TM-650 2.3.20 Plating Quality, Hull Cell Method - 8/97
    IPC TM-650 2.3.22 Copper Protective Coating Quality - 2-78
    IPC TM-650 2.3.23B Cure (Permanency) Thermally Cured Solder Mask - 2/88
    IPC TM-650 2.3.23.1A Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88
    IPC TM-650 2.3.24 Porosity of Gold Plating- 2/78
    IPC TM-650 2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85
    IPC TM-650 2.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) - 8/97
    IPC TM-650 2.3.25B Detection and Measurement of Ionizable Surface Contaminants - 8/97
    IPC TM-650 2.3.26A Ionizable Detection of Surface Contaminants (Dynamic Method) - 11/94
    IPC TM-650 2.3.26.1 Ionizable Detection of Surface Contaminants (Static Method) - 11/94
    IPC TM-650 2.3.26.2 Mobile Ion Content of Polymer Films - 7/95
    IPC TM-650 2.3.27 Cleanliness Test - Residual Rosin - 1/95
    IPC TM-650 2.3.27.1 Rosin Flux Residue Analysis-HPLC Method - 1/95
    IPC TM-650 2.3.28 Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95
    IPC TM-650 2.3.29 Flammability, Flexible Flat Cable- 11/88
    IPC TM-650 2.3.30A Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81
    IPC TM-650 2.3.31 Relative Degree of Cure of U.V. Curable Material - 2/88
    IPC TM-650 2.3.32C Flux Induced Corrosion (Copper Mirror Method)- 1/95
    IPC TM-650 2.3.33C Presence of Halides in Flux, Silver Chromate Method - 1/95
    IPC TM-650 2.3.34B Solids Content, Flux - 1/95
    IPC TM-650 2.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95
    IPC TM-650 2.3.35B Halide Content, Quantitative (Chloride and Bromide)- 1/95
    IPC TM-650 2.3.35.1 Fluorides by Spot Test, Fluxes - Qualitative - 1/95
    IPC TM-650 2.3.35.2 Flouride Concentration, Fluxes - Quantitative--1/95
    IPC TM-650 2.3.36 Acid Acceptance of Chlorinated Solvents- 10/85
    IPC TM-650 2.3.37B Volatile Content of Adhesive Coated Dielectric Films - 5/98
    IPC TM-650 2.3.38B Surface Organic Contaminant Detection Test - 8/97
    IPC TM-650 2.3.39B Surface Organic Contaminant Identification Test (Infrared Analytical Method) - 8/97
    IPC TM-650 2.3.40 Thermal Stability - 7/95
    IPC TM-650 2.4.1D Adhesion, Tape Testing--8/97
    IPC TM-650 2.4.1.1B Adhesion, Marking Paints and Inks--11/88
    IPC TM-650 2.4.1.2 Adhesion of Conductors on Hybrid Substrates--12/87
    IPC TM-650 2.4.1.3 Adhesion, Resistors (Hybrid Circuits)--12/87
    IPC TM-650 2.4.1.4 Adhesion, Overglaze (Hybrid Circuits)--12/87
    IPC TM-650 2.4.1.5A Determination of Heat Transfer--5/95
    IPC TM-650 2.4.1.6 Adhesion, Polymer Coating--7/95
    IPC TM-650 2.4.2A Ductility of Copper Foil--3/76
    IPC TM-650 2.4.2.1D Flexural Fatigue and Ductility, Foil--3/91
    IPC TM-650 2.4.3D Flexural Fatigue, Flexible Printed Wiring Materials--5/98
    IPC TM-650 2.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91
    IPC TM-650 2.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91
    IPC TM-650 2.4.4B Flexural Strength of Laminates (at Ambient Temperature)--12/94
    IPC TM-650 2.4.4.1A Flexural Strength of Laminates (at Elevated Temperature)--12/94
    IPC TM-650 2.4.5 Folding Endurance, Flexible Printed Wiring Materials--4/73
    IPC TM-650 2.4.6 Hot Oil--4/73
    IPC TM-650 2.4.7A Machinability, Printed Wiring Materials--7/75
    IPC TM-650 2.4.8C Peel Strength of Metallic Clad Laminates--12/94
    IPC TM-650 2.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86
    IPC TM-650 2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)--12/94
    IPC TM-650 2.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)--12/94
    IPC TM-650 2.4.8.4 Carrier Release, Thin Copper--1/90
    IPC TM-650 2.4.9D Peel Strength, Flexible Dielectric Materials--10/88
    IPC TM-650 2.4.9.1 Peel Strength of Flexible Circuits - 11/98
    IPC TM-650 2.4.9.2 Bonding Process - 11/98
    IPC TM-650 2.4.10 Plating Adhesion--4/73
    IPC TM-650 2.4.11 Shear Strength Flexible Dielectric Materials--4/73
    IPC TM-650 2.4.12A Solderability, Edge Dip Method--6/91
    IPC TM-650 2.4.13F Solder Float Resistance Flexible Printed Wiring Materials--5/98
    IPC TM-650 2.4.13.1 Thermal Stress of Laminates--12/94
    IPC TM-650 2.4.14 Solderability of Metallic Surfaces--4/73
    IPC TM-650 2.4.14.1 Solderability, Wave Solder Method--3/79
    IPC TM-650 2.4.14.2 Liquid Flux Activity, Wetting Balance Method--1/95
    IPC TM-650 2.4.15A Surface Finish, Metal Foil--3/76
    IPC TM-650 2.4.16A Initiation Tear Strength, Flexible Insulating Materials--12/82
    IPC TM-650 2.4.17 Tear Strength, Propagation--4/73
    IPC TM-650 2.4.17.1A Propagation, Tear Strength, Flexible Insulating Materials--12/82
    IPC TM-650 2.4.15B Tensile Strength and Elongation, Copper Foil--8/80
    IPC TM-650 2.4.15.1 Tensile Strength and Elongation, In-House Plating--8/97
    IPC TM-650 2.4.15.2 Hot Rupture Strength, Foil--7/89
    IPC TM-650 2.4.15.3 Tensile Strength, Elongation, and Modulus--7/95
    IPC TM-650 2.4.19C Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98
    IPC TM-650 2.4.20 Terminal Bond Strength, Flexible Printed Wiring--4/73
    IPC TM-650 2.4.21D Land Bond Strength, Unsupported Component Hole--8/97
    IPC TM-650 2.4.21.1C Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91
    IPC TM-650 2.4.22C Bow and Twist (Percentage)--6/99
    IPC TM-650 2.4.22.1C Bow and Twist-Laminate--5/93
    IPC TM-650 2.4.22.2 Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95
    IPC TM-650 2.4.23 Soldering Resistance of Laminate Materials--3/79
    IPC TM-650 2.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion by TMA--12/94
    IPC TM-650 2.4.24.1 Time to Delamination (TMA Method)--12/94
    IPC TM-650 2.4.24.2 Glass Transition Temperature of Organic Films - DMA Method--7/95
    IPC TM-650 2.4.24.3 Glass Transition Temperature of Organic Films - TMA Method--7/95
    IPC TM-650 2.4.24.4 Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method - 11/98
    IPC TM-650 2.4.24.5 Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method -11/98
    IPC TM-650 2.4.25C Glass Transition Temperature and Cure Factor by DSC--12/94
    IPC TM-650 2.4.26 Tape Test for Additive Printed Boards--3/79
    IPC TM-650 2.4.27.1B Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95
    IPC TM-650 2.4.27.2A Solder Mask Abrasion (Pencil Method)--2/88
    IPC TM-650 2.4.28B Adhesion, Solder Mask (Non-Melting Metals)--8/97
    IPC TM-650 2.4.28.1B Adhesion, Solder Resist (Mask), Tape Test Method--8/97
    IPC TM-650 2.4.29B Adhesion, Solder Mask, Flexible Circuit--2/88
    IPC TM-650 2.4.30 Impact Resistance, Polymer Film--10/86
    IPC TM-650 2.4.31A Folding, Flexible Flat Cable--4/86
    IPC TM-650 2.4.32A Fold Temperature Testing, Flexible Flat Cable--4/86
    IPC TM-650 2.4.33C Flexural Fatigue and Ductility, Flat Cable--3/91
    IPC TM-650 2.4.34 Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to 1,600,000 Centipose)--1/95
    IPC TM-650 2.4.34.1 Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose)--1/95
    IPC TM-650 2.4.34.2 Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose)--1/95
    IPC TM-650 2.4.34.3 Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose)--1/95
    IPC TM-650 2.4.34.4 Paste Flux Viscosity - T-Bar Spindle Method--1/95
    IPC TM-650 2.4.35 Solder Paste - Slump Test--1/95
    IPC TM-650 2.4.36B Rework Simulation, Plated-Through Holes for Leaded Components--8/97
    IPC TM-650 2.4.37A Evaluation of Hand Soldering Tools for Terminal Connections--7/91
    IPC TM-650 2.4.37.1A Evaluation of Hand Soldering Tools for Printed Wiring Board Applications--7/91
    IPC TM-650 2.4.37.2 Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93
    IPC TM-650 2.4.38A Prepeg Scaled Flow Testing--6/91
    IPC TM-650 2.4.39A Dimensional Stability, Glass Reinforced Thin Laminates--2/86
    IPC TM-650 2.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87
    IPC TM-650 2.4.41 Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86
    IPC TM-650 2.4.41.1A Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method--8/97
    IPC TM-650 2.4.41.2 Coefficient of Thermal Expansion - Strain Gage Method--8/97
    IPC TM-650 2.4.41.3 In-Plane Coefficient of Thermal Expansion, Organic Films--7/95
    IPC TM-650 2.4.41.4 Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95
    IPC TM-650 2.4.42 Torsional Strength of Chip Adhesives--2/88
    IPC TM-650 2.4.42.1 High Tempreature Mechanical Strength Retention of Adhesives--3/88
    IPC TM-650 2.4.42.2 Die Shear Strength--2/98
    IPC TM-650 2.4.42.3 Wire Bond Pull Strength--2/98
    IPC TM-650 2.4.43 Solder Paste - Solder Ball Test--1/95
    IPC TM-650 2.4.44 Solder Paste - Tack Test--3/98
    IPC TM-650 2.4.45 Solder Paste - Wetting Test--1/95
    IPC TM-650 2.4.46 Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms--1/95
    IPC TM-650 2.4.47 Flux Residue Dryness--1/95
    IPC TM-650 2.4.48 Spitting of Flux-Cored Wire Solder--1/95
    IPC TM-650 2.4.49 Solder Pool Test--1/95
    IPC TM-650 2.4.50 Thermal Conductivity, Polymer Films--7/95
    IPC TM-650 2.4.51 Self Shimming Thermally Conductive Adhesives--1/95
    IPC TM-650 2.5.1B Arc Resistance of Printed Wiring Materials--5/86
    IPC TM-650 2.5.2A Capacitance of Insulating Materials--7/75
    IPC TM-650 2.5.3B Current Breakdown, Plated Through Holes--8/97
    IPC TM-650 2.5.4 Current Carrying Capacity, Multilayer Printed Wring--4/73
    IPC TM-650 2.5.4.1A Conductor Temperature Rise Due to Current Changes in Conductors--8/97
    IPC TM-650 2.5.5A Dielectric Constant of Printed Wiring Materials--7/75
    IPC TM-650 2.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 100MHz (Contacting Electrode Systems)--5/86
    IPC TM-650 2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method--12/87
    IPC TM-650 2.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)--12/87
    IPC TM-650 2.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method--10/85
    IPC TM-650 2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band--3/98
    IPC TM-650 2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ--3/98
    IPC TM-650 2.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates--5/89
    IPC TM-650 2.5.5.7 Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR--11/92
    IPC TM-650 2.5.5.8 Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95
    IPC TM-650 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98
    IPC TM-650 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material--5/86
    IPC TM-650 2.5.6.1A Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings--2/88
    IPC TM-650 2.5.6.2A Electric Strength of Printed Wiring Material--8/97
    IPC TM-650 2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength--10/86
    IPC TM-650 2.5.7C Dielectric Withstanding Voltage, PWB--8/97
    IPC TM-650 2.5.8A Dissipation Factor of Flexible Printed Wiring Material--7/75
    IPC TM-650 2.5.10A Insulation Resistance, Multilayer Printed Wiring (Between Layers)--12/87
    IPC TM-650 2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds--11/98
    IPC TM-650 2.5.11 Insulation Resistance, Multilayer Printed Wiring (Within a Layer)--4/73
    IPC TM-650 2.5.12 Interconnection Resistance, Multilayer Printed Wiring--4/73
    IPC TM-650 2.5.13A Resistance of Copper Foil--3/76
    IPC TM-650 2.5.14A Resistivity of Copper Foil--8/76
    IPC TM-650 2.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86
    IPC TM-650 2.5.16A Shorts, Internal on Multilayer Printed Wiring--11/88
    IPC TM-650 2.5.17E Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98
    IPC TM-650 2.5.17.1A Volume and Surface Resistivity of Dielectric Materials--12/94
    IPC TM-650 2.5.17.2 Volume Resistivity of Conductive Resistance Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method--11/98
    IPC TM-650 2.5.15B Characteristic Impedance Flat Cables (Unbalanced)--7/84
    IPC TM-650 2.5.19A Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84
    IPC TM-650 2.5.19.1A Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)--7/84
    IPC TM-650 2.5.21A Digital Unbalanced Crosstalk, Flat Cable--3/84
    IPC TM-650 2.5.24 Conductor Resistance, Flexible Flat Cable--6/79
    IPC TM-650 2.5.25A Dielectric Withstand Voltage Flexible Fat Cable--11/85
    IPC TM-650 2.5.26A Insulation Resistance Flexible Flat Cable--11/85
    IPC TM-650 2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79
    IPC TM-650 2.5.28A Q Resonance, Flexible Printed Wiring Materials--4/88
    IPC TM-650 2.5.30 Balanced and Unbalanced Cable Attenuation Measurements--12/87
    IPC TM-650 2.5.31 Current Leakage (Through Overglaze Films)--12/87
    IPC TM-650 2.5.32 Resistance Test, Plated Through-Holes--12/87
    IPC TM-650 2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools--11/98
    IPC TM-650 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools (Ground Measurements)--11/98
    IPC TM-650 2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools (Transient Measurements)--11/98
    IPC TM-650 2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools (Current Leakage Measurements)--11/98
    IPC TM-650 2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)--11/98
    IPC TM-650 2.6.1E Fungus Resistance Printed Wiring Materials--8/97
    IPC TM-650 2.6.2C Water Absorption, Flexible Printed Wiring--5/98
    IPC TM-650 2.6.2.1A Water Absorption, Metal Clad Plastic Laminates--5/86
    IPC TM-650 2.6.3E Moisture and Insulation Resistance, Printed Boards--8/97
    IPC TM-650 2.6.3.1C Moisture and Insulation Resistance-Polymeric Solder Masks and Conformal Coatings--11/98
    IPC TM-650 2.6.3.2B Moisture and Insulation Resistance, Flexible Base Dielectric--5/88
    IPC TM-650 2.6.3.3A Surface Insulation Resistance, Fluxes--1/95
    IPC TM-650 2.6.4A Outgassing, Printed Boards--8/97
    IPC TM-650 2.6.5C Physical Shock, Multilayer Printed Wiring--8/97
    IPC TM-650 2.6.6B Temperature Cycling, Printed Wiring Board--12/87
    IPC TM-650 2.6.7A Thermal Shock and Continuity, Printed Board--8/97
    IPC TM-650 2.6.7.1 Thermal Shock--Polymer Solder Mask Coatings--2/88
    IPC TM-650 2.6.7.2A Thermal Shock, Continuity and Microsection, Printed Board--8/97
    IPC TM-650 2.6.8D Thermal Stress, Plated Through-Holes--3/98
    IPC TM-650 2.6.8.1 Thermal Stress, Laminate--9/91
    IPC TM-650 2.6.9A Vibration, Rigid Printed Wiring--8/97
    IPC TM-650 2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy--1/95
    IPC TM-650 2.6.9.2 Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy--1/95
    IPC TM-650 2.6.10A X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods--8/97
    IPC TM-650 2.6.11B Hydrolytic Stability Solder Mask and/or Conformal Coating--11/88
    IPC TM-650 2.6.12 Temperature Testing, Flexible Flat Cable--6/79
    IPC TM-650 2.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring--10/85
    IPC TM-650 2.6.14A Resistance to Electrochemical Migration, Polymer Solder Mask--8/87
    IPC TM-650 2.6.15B Corrosion, Flux--1/95
    IPC TM-650 2.6.16 Pressure Vessel Method for Glass Epoxy Laminate Integrity--7/85
    IPC TM-650 2.6.16.1 Moisture Resistance of HDIS Under High Temperature and Pressure (Pressure Vessel)--8/98
    IPC TM-650 2.6.17 Hydrolitic Stability, Flexible Printed Wiring Material--12/82
    IPC TM-650 2.6.15A Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85
    IPC TM-650 2.6.19 Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards--12/87
    IPC TM-650 2.6.20A Assessment of Plastic Encapsulated Electronic Components for Susceptibility to Moisture/Reflow Induced Damage--1/95
    IPC TM-650 2.6.21 Service Temperature of Flexible Printed Wiring--12/88
    IPC TM-650 2.6.22 Superseded by J-STD-035
    IPC TM-650 2.6.23 Test Procedure for Steam Ager Temperature Repeatability--7/93
    JEDEC JESD-22 22-A100-A Cycled Temperature Humidity Bias Life Test
    JEDEC JESD-22 22-A101-B Steady State Temperature Humidity Bias Life Test
    JEDEC JESD-22 22-A102-B Accelerated Moisture Resistance - Unbiased Autoclave
    JEDEC JESD-22 22-A103-A High Temperature Storage Life
    JEDEC JESD-22 22-A104-A Temperature Cycling
    JEDEC JESD-22 22-A105-B Power and Temperature Cycling
    JEDEC JESD-22 22-A106-A Thermal Shock
    JEDEC JESD-22 22-A107-A Salt Atmosphere
    JEDEC JESD-22 22-A108-A Bias Life
    JEDEC JESD-22 22-A109 Hermeticity
    JEDEC JESD-22 22-A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST)
    JEDEC JESD-22 22-A112-A Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices
    JEDEC JESD-22 22-A113-B Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing
    JEDEC JESD-22 22-A114-A Electrostatic Discharge (ESD) Sensitivity Testing, Human Body Model (HBM)
    JEDEC JESD-22 22-A115-A Electrostatic Discharge (ESD) Sensitivity Testing, Machine Model (MM)
    JEDEC JESD-22 22-B100-A Physical Dimensions
    JEDEC JESD-22 22-B101 External Visual
    JEDEC JESD-22 22-B102-C Solderability
    JEDEC JESD-22 22-B103-A Vibration, Variable Frequency
    JEDEC JESD-22 22-B104-A Mechanical Shock
    JEDEC JESD-22 22-B105-A Lead Integrity
    JEDEC JESD-22 22-B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices
    JEDEC JESD-22 22-B107-A Marking Permanency
    JEDEC JESD-22 22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices
    JEDEC JESD-22 22-C100-A High Temperature Continuity
    JEDEC JESD-22 22-C101 Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components

    HOME Application Notes Last updated: November 23, 2009

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