USMK-10000-XXX-ccc - GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) - Microwave SLCC - Single Layer Ceramic Capacitors F> 50 GHz K-10000 ceramic DC blocking capacitors series USMK-10000-XXX-ccc - GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) - Microwave SLCC - Single Layer Ceramic Capacitors F> 50 GHz K-10000 ceramic DC blocking capacitors series US MICROWAVES GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) Advanced Microwave Components USMK-10000-XXX-ccc FEATURES APPLICATIONS SINGLE LAYER CERAMIC CAPACITOR (SLCC) Low to very High capacitance values. Low inductance. High Q for RF. Microwave & millimeter wave. By-pass and D.C. blocking applications. RF Bypass, DC Blocking, Filters, Submounts GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE US Microwaves USMK-10000-XXX-ccc series SLCC - single layer ceramic chip capacitors - are available from low to very High capacitance values, with low inductance, high Q for RF, microwave & millimeter wave, by-pass and D.C. blocking applications. Temperature Coefficient is (TC) = +10% -95% maximum change (non-linear). Dielectric Constant (K) = 10000. Capacitance values from 25pF to 2500pF. Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. Custom designs that match 50 ohm line widths of the capacitors with various dielectrics K or different die sizes L or W are available. Capacitors kits are also available: CERAMIC CHIP CAPACITORS LAB-Kit. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER VALUE UNITS Operating frequency > 50 GHz Capacitance value 25 to 2500 pF Standard measurement frequency 1 (C< or equal to 100 pF) MHz Standard measurement frequency 1 (C> 100 pF) kHz Insulation resistance (IR) 1E11 min. at 25 C Ohms Temperature coefficient (TC) 030 (non-linear) PPM/C Rated Voltage: 100 V Standard tolerances 10 % ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal Ceramic K=10000 71 L x W 2 Min. 4x4 mils, 3m thick, 99.99% electroplated gold with a TiW barrier Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SLCC DIE LAYOUT / MECHANICAL SPECIFICATIONS GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc SLCC CHIP MOUNT GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc ceramic chip capacitor mount SLCC ASSEMBLY PROCESS - SHORT APPLICATION NOTE US Microwaves ceramic chip capacitors are designed for thermosonic GOLD wire bonding and AuGe, AuSn or conductive silver epoxy die attach. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should NOT be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! The following is an important note that applies to Surface Mount Multi Chip Modules. In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180C to 220C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. This is one more reasons to avoid aluminum all together. TEMPERATURE CHARACTERISTICS GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc TEMPERATURE CHARACTERISTICS SLCC SERIES RESONANT FREQUENCY GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc SERIES RESONANT FREQUENCY STANDARD PRODUCTS ORDERING INFORMATION C [pF] C multiplier TOLERANCE PACKAGE Find part # STANDARD SIZES - PRODUCTS ORDERING INFORMATION USM P/N W [mil] L [mil] C(pF) MINIMUM ORDER U/P($) 1K U/P($) 5K U/P($) 10K U/P($) 50K U/P($) 100K K10000-010-25 10 10 25.000 $125/241 0.260 0.230 0.210 0.190 0.130 K10000-015-56 15 15 56.000 $125/218 0.290 0.250 0.230 0.210 0.140 K10000-020-100 20 20 100.000 $125/196 0.320 0.280 0.250 0.230 0.160 K10000-025-160 25 25 160.000 $125/176 0.360 0.310 0.280 0.260 0.180 K10000-030-220 30 30 220.000 $125/157 0.400 0.350 0.320 0.290 0.200 K10000-035-300 35 35 300.000 $125/141 0.440 0.390 0.350 0.320 0.220 K10000-040-400 40 40 400.000 $125/126 0.500 0.430 0.400 0.360 0.250 K10000-045-500 45 45 500.000 $125/113 0.550 0.480 0.440 0.400 0.280 K10000-050-620 50 50 620.000 $125/102 0.610 0.540 0.490 0.440 0.310 K10000-060-900 60 60 900.000 $125/83 0.750 0.660 0.600 0.540 0.380 K10000-070-1200 70 70 1200.000 $125/69 0.910 0.800 0.730 0.660 0.450 K10000-080-1600 80 80 1600.000 $125/58 1.090 0.950 0.870 0.790 0.540 K10000-090-2000 90 90 2000.000 $125/49 1.280 1.120 1.030 0.930 0.640 K10000-100-2600 100 100 2600.000 $125/42 1.500 1.310 1.200 1.090 0.750 STANDARD EIA-24 VALUES - PRODUCTS ORDERING INFORMATION USM P/N W[mils] L[mils] C[pf] USM P/N W[mils] L[mils] C[pf] USMK-10000-010-270 10 10 27 USMK-10000-029-271 29 29 270 USMK-10000-010-300 10 10 30 USMK-10000-031-301 31 31 300 USMK-10000-011-330 11 11 33 USMK-10000-033-331 33 33 330 USMK-10000-011-360 11 11 36 USMK-10000-034-361 34 34 360 USMK-10000-012-390 12 12 39 USMK-10000-035-391 35 35 390 USMK-10000-012-430 12 12 43 USMK-10000-037-431 37 37 430 USMK-10000-013-470 13 13 47 USMK-10000-039-471 39 39 470 USMK-10000-013-510 13 13 51 USMK-10000-040-511 40 40 510 USMK-10000-014-560 14 14 56 USMK-10000-042-561 42 42 560 USMK-10000-014-620 14 14 62 USMK-10000-044-621 44 44 620 USMK-10000-015-680 15 15 68 USMK-10000-047-681 47 47 680 USMK-10000-016-750 16 16 75 USMK-10000-049-751 49 49 750 USMK-10000-016-820 16 16 82 USMK-10000-051-821 51 51 820 USMK-10000-017-910 17 17 91 USMK-10000-054-911 54 54 910 USMK-10000-018-101 18 18 100 USMK-10000-056-102 56 56 1000 USMK-10000-019-111 19 19 110 USMK-10000-059-112 59 59 1100 USMK-10000-020-121 20 20 120 USMK-10000-062-122 62 62 1200 USMK-10000-021-131 21 21 130 USMK-10000-064-132 64 64 1300 USMK-10000-022-151 22 22 150 USMK-10000-069-152 69 69 1500 USMK-10000-023-161 23 23 160 USMK-10000-071-162 71 71 1600 USMK-10000-024-181 24 24 180 USMK-10000-075-182 75 75 1800 USMK-10000-025-201 25 25 200 USMK-10000-079-202 79 79 2000 USMK-10000-027-221 27 27 220 USMK-10000-083-222 83 83 2200 USMK-10000-028-241 28 28 240 USMK-10000-087-242 87 87 2400 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.

 
 
US MICROWAVES   GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC)
Advanced Microwave Components   USMK-10000-XXX-ccc
 
 

FEATURES
APPLICATIONS
SINGLE LAYER CERAMIC CAPACITOR (SLCC)
Low to very High capacitance values.
Low inductance.
High Q for RF.
Microwave & millimeter wave.
By-pass and D.C. blocking applications.
RF Bypass, DC Blocking, Filters, Submounts
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
US Microwaves USMK-10000-XXX-ccc series SLCC - single layer ceramic chip capacitors - are available from low to very High capacitance values, with low inductance, high Q for RF, microwave & millimeter wave, by-pass and D.C. blocking applications. Temperature Coefficient is (TC) = +10% -95% maximum change (non-linear). Dielectric Constant (K) = 10000. Capacitance values from 25pF to 2500pF. Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding.
Gold over platinum is available on special request with custom designs.
Custom designs that match 50 ohm line widths of the capacitors with various dielectrics K or different die sizes L or W are available.
Capacitors kits are also available: CERAMIC CHIP CAPACITORS LAB-Kit.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.

ELECTRICAL/MECHANICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Operating frequency > 50 GHz
Capacitance value 25 to 2500 pF
Standard measurement frequency 1 (C< or equal to 100 pF) MHz
Standard measurement frequency 1 (C> 100 pF) kHz
Insulation resistance (IR) 1E11 min. at 25 C Ohms
Temperature coefficient (TC) 030 (non-linear) PPM/C
Rated Voltage: 100 V
Standard tolerances 10 %
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

GENERAL DIE INFORMATION
Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal
Ceramic K=10000 7±1 L x W ±2 Min. 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

SLCC DIE LAYOUT / MECHANICAL SPECIFICATIONS
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc
SLCC CHIP MOUNT
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc ceramic chip capacitor mount
SLCC ASSEMBLY PROCESS - SHORT APPLICATION NOTE
US Microwaves ceramic chip capacitors are designed for thermosonic GOLD wire bonding and AuGe, AuSn or conductive silver epoxy die attach. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should NOT be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! The following is an important note that applies to Surface Mount Multi Chip Modules. In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180C to 220C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. This is one more reasons to avoid aluminum all together.

TEMPERATURE CHARACTERISTICS
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc TEMPERATURE CHARACTERISTICS
SLCC SERIES RESONANT FREQUENCY
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-10000-XXX-ccc SERIES RESONANT FREQUENCY

STANDARD PRODUCTS ORDERING INFORMATION

C [pF] C multiplier TOLERANCE PACKAGE
Find part #

STANDARD SIZES - PRODUCTS ORDERING INFORMATION
USM P/NW [mil]L [mil]C(pF)MINIMUM ORDERU/P($) 1KU/P($) 5KU/P($) 10KU/P($) 50KU/P($) 100K
K10000-010-25101025.000$125/2410.2600.2300.2100.1900.130
K10000-015-56151556.000$125/2180.2900.2500.2300.2100.140
K10000-020-1002020100.000$125/1960.3200.2800.2500.2300.160
K10000-025-1602525160.000$125/1760.3600.3100.2800.2600.180
K10000-030-2203030220.000$125/1570.4000.3500.3200.2900.200
K10000-035-3003535300.000$125/1410.4400.3900.3500.3200.220
K10000-040-4004040400.000$125/1260.5000.4300.4000.3600.250
K10000-045-5004545500.000$125/1130.5500.4800.4400.4000.280
K10000-050-6205050620.000$125/1020.6100.5400.4900.4400.310
K10000-060-9006060900.000$125/830.7500.6600.6000.5400.380
K10000-070-120070701200.000$125/690.9100.8000.7300.6600.450
K10000-080-160080801600.000$125/581.0900.9500.8700.7900.540
K10000-090-200090902000.000$125/491.2801.1201.0300.9300.640
K10000-100-26001001002600.000$125/421.5001.3101.2001.0900.750

STANDARD EIA-24 VALUES - PRODUCTS ORDERING INFORMATION
USM P/NW[mils]L[mils]C[pf]USM P/NW[mils]L[mils]C[pf]
USMK-10000-010-270101027USMK-10000-029-2712929270
USMK-10000-010-300101030USMK-10000-031-3013131300
USMK-10000-011-330111133USMK-10000-033-3313333330
USMK-10000-011-360111136USMK-10000-034-3613434360
USMK-10000-012-390121239USMK-10000-035-3913535390
USMK-10000-012-430121243USMK-10000-037-4313737430
USMK-10000-013-470131347USMK-10000-039-4713939470
USMK-10000-013-510131351USMK-10000-040-5114040510
USMK-10000-014-560141456USMK-10000-042-5614242560
USMK-10000-014-620141462USMK-10000-044-6214444620
USMK-10000-015-680151568USMK-10000-047-6814747680
USMK-10000-016-750161675USMK-10000-049-7514949750
USMK-10000-016-820161682USMK-10000-051-8215151820
USMK-10000-017-910171791USMK-10000-054-9115454910
USMK-10000-018-1011818100USMK-10000-056-10256561000
USMK-10000-019-1111919110USMK-10000-059-11259591100
USMK-10000-020-1212020120USMK-10000-062-12262621200
USMK-10000-021-1312121130USMK-10000-064-13264641300
USMK-10000-022-1512222150USMK-10000-069-15269691500
USMK-10000-023-1612323160USMK-10000-071-16271711600
USMK-10000-024-1812424180USMK-10000-075-18275751800
USMK-10000-025-2012525200USMK-10000-079-20279792000
USMK-10000-027-2212727220USMK-10000-083-22283832200
USMK-10000-028-2412828240USMK-10000-087-24287872400

List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.


Last updated: July 06, 2009
US MICROWAVES | Tel:408-758-8690 Fax: 408-986-8027 | USMICROWAVES

©1990-2018 US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.