USMK-120-031-3P6 - GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) - Microwave SLCC - Single Layer Ceramic Capacitors F> 50 GHz K-120 ceramic DC blocking capacitors series

USMK-120-031-3P6 - GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) - Microwave SLCC - Single Layer Ceramic Capacitors F> 50 GHz K-120 ceramic DC blocking capacitors series AVX KYOCERA GH101A3R6K,AVX KYOCERA GH151A3R6K,AVX KYOCERA GH201A3R6K,AVX KYOCERA GH251A3R6K,AVX KYOCERA GH351A3R6K,AVX KYOCERA GH501A3R6K,AVX KYOCERA GH701A3R6K,AVX KYOCERA GB151A3R6K,AVX KYOCERA GB201A3R6K,AVX KYOCERA GB251A3R6K,AVX KYOCERA GB351A3R6K,AVX KYOCERA GB501A3R6K USMK-120-031-3P6 - GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) - Microwave SLCC - Single Layer Ceramic Capacitors F> 50 GHz K-120 ceramic DC blocking capacitors series AVX KYOCERA GH101A3R6K,AVX KYOCERA GH151A3R6K,AVX KYOCERA GH201A3R6K,AVX KYOCERA GH251A3R6K,AVX KYOCERA GH351A3R6K,AVX KYOCERA GH501A3R6K,AVX KYOCERA GH701A3R6K,AVX KYOCERA GB151A3R6K,AVX KYOCERA GB201A3R6K,AVX KYOCERA GB251A3R6K,AVX KYOCERA GB351A3R6K,AVX KYOCERA GB501A3R6K US MICROWAVES GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) Advanced Microwave Components USMK-120-031-3P6 FEATURES APPLICATIONS SINGLE LAYER CERAMIC CAPACITOR (SLCC) Low to very High capacitance values. Low inductance. High Q for RF. Microwave & millimeter wave. By-pass and D.C. blocking applications. RF Bypass, DC Blocking, Filters, Submounts GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-120-031-3P6 PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE US Microwaves USMK-120-031-3P6 series SLCC - single layer ceramic chip capacitors - are available from low to very High capacitance values, with low inductance, high Q for RF, microwave & millimeter wave, by-pass and D.C. blocking applications. Temperature Coefficient is (TC) = +10% -95% maximum change (non-linear). Dielectric Constant (K) = 120. Capacitance values from 0.4pF to 43pF. Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. Custom designs that match 50 ohm line widths of the capacitors with various dielectrics K or different die sizes L or W are available. Capacitors kits are also available: CERAMIC CHIP CAPACITORS LAB-Kit. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER VALUE UNITS Operating frequency > 50 GHz Capacitance value 3.6 pF Standard measurement frequency 1 (C< or equal to 100 pF) MHz Standard measurement frequency 1 (C> 100 pF) kHz Insulation resistance (IR) 1E11 min. at 25 °C Ohms Temperature coefficient (TC) 0±30 (non-linear) PPM/°C Rated Voltage: 100 V Standard tolerances ±10 % ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal Ceramic K=120 7±1 31 x 31 ±2 Min. 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SLCC DIE LAYOUT / MECHANICAL SPECIFICATIONS GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-120-031-3P6 SLCC CHIP MOUNT GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-120-031-3P6 ceramic chip capacitor mount SLCC ASSEMBLY PROCESS - SHORT APPLICATION NOTE US Microwaves ceramic chip capacitors are designed for thermosonic GOLD wire bonding and AuGe, AuSn or conductive silver epoxy die attach. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should NOT be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! The following is an important note that applies to Surface Mount Multi Chip Modules. In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. This is one more reasons to avoid aluminum all together. TEMPERATURE CHARACTERISTICS GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-120-031-3P6 TEMPERATURE CHARACTERISTICS SERIES RESONANT FREQUENCY GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-120-031-3P6 SERIES RESONANT FREQUENCY STANDARD PRODUCTS ORDERING INFORMATION USM P/N C [pF] PACKAGE USMK-120-031-3P6 3.6 -WP Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Min. Qty E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. 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US MICROWAVES		GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC)
Advanced Microwave Components		USMK-120-031-3P6

FEATURES

APPLICATIONS

SINGLE LAYER CERAMIC CAPACITOR (SLCC)

Low to very High capacitance values.

Low inductance.

High Q for RF.

Microwave & millimeter wave.

By-pass and D.C. blocking applications.

RF Bypass, DC Blocking, Filters, Submounts

GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-120-031-3P6

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE

US Microwaves USMK-120-031-3P6 series SLCC - single layer ceramic chip capacitors - are available from low to very High capacitance values, with low inductance, high Q for RF, microwave & millimeter wave, by-pass and D.C. blocking applications. Temperature Coefficient is (TC) = +10% -95% maximum change (non-linear). Dielectric Constant (K) = 120. Capacitance values from 0.4pF to 43pF. Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding.
Gold over platinum is available on special request with custom designs.
Custom designs that match 50 ohm line widths of the capacitors with various dielectrics K or different die sizes L or W are available.
Capacitors kits are also available: CERAMIC CHIP CAPACITORS LAB-Kit.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING

All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.

ELECTRICAL/MECHANICAL CHARACTERISTICS
PARAMETER	VALUE	UNITS
Operating frequency	> 50	GHz
Capacitance value	3.6	pF
Standard measurement frequency	1 (C< or equal to 100 pF)	MHz
Standard measurement frequency	1 (C> 100 pF)	kHz
Insulation resistance (IR)	1E11 min. at 25 °C	Ohms
Temperature coefficient (TC)	0±30 (non-linear)	PPM/°C
Rated Voltage:	100	V
Standard tolerances	±10	%
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

GENERAL DIE INFORMATION
Substrate	Thickness [mils]	Size [mils]	Bonding Pads	Backside metal
Ceramic K=120	7±1	31 x 31 ±2	Min. 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier	Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

SLCC DIE LAYOUT / MECHANICAL SPECIFICATIONS

SLCC CHIP MOUNT

GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-120-031-3P6 ceramic chip capacitor mount

SLCC ASSEMBLY PROCESS - SHORT APPLICATION NOTE

US Microwaves ceramic chip capacitors are designed for thermosonic GOLD wire bonding and AuGe, AuSn or conductive silver epoxy die attach. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should NOT be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! The following is an important note that applies to Surface Mount Multi Chip Modules. In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. This is one more reasons to avoid aluminum all together.

TEMPERATURE CHARACTERISTICS

SERIES RESONANT FREQUENCY

STANDARD PRODUCTS ORDERING INFORMATION

USM P/N	C [pF]	PACKAGE
USMK-120-031-3P6	3.6	-WP

List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.

Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

Last updated: July 06, 2009
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