USMK-30-XXX-ccc - GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) - Microwave SLCC - Single Layer Ceramic Capacitors F> 50 GHz K-30 ceramic DC blocking capacitors series USMK-30-XXX-ccc - GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) - Microwave SLCC - Single Layer Ceramic Capacitors F> 50 GHz K-30 ceramic DC blocking capacitors series US MICROWAVES GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) Advanced Microwave Components USMK-30-XXX-ccc FEATURES APPLICATIONS SINGLE LAYER CERAMIC CAPACITOR (SLCC) Low to very High capacitance values. Low inductance. High Q for RF. Microwave & millimeter wave. By-pass and D.C. blocking applications. RF Bypass, DC Blocking, Filters, Submounts GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE US Microwaves USMK-30-XXX-ccc series SLCC - single layer ceramic chip capacitors - are available from low to very High capacitance values, with low inductance, high Q for RF, microwave & millimeter wave, by-pass and D.C. blocking applications. Temperature Coefficient is (TC) = +10% -95% maximum change (non-linear). Dielectric Constant (K) = 30. Capacitance values from 0.1pF to 10pF. Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. Custom designs that match 50 ohm line widths of the capacitors with various dielectrics K or different die sizes L or W are available. Capacitors kits are also available: CERAMIC CHIP CAPACITORS LAB-Kit. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER VALUE UNITS Operating frequency > 50 GHz Capacitance value 0.1 to 10 pF Standard measurement frequency 1 (C< or equal to 100 pF) MHz Standard measurement frequency 1 (C> 100 pF) kHz Insulation resistance (IR) 1E11 min. at 25 C Ohms Temperature coefficient (TC) 030 (non-linear) PPM/C Rated Voltage: 100 V Standard tolerances 10 % ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal Ceramic K=30 71 L x W 2 Min. 4x4 mils, 3m thick, 99.99% electroplated gold with a TiW barrier Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SLCC DIE LAYOUT / MECHANICAL SPECIFICATIONS GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc SLCC CHIP MOUNT GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc ceramic chip capacitor mount SLCC ASSEMBLY PROCESS - SHORT APPLICATION NOTE US Microwaves ceramic chip capacitors are designed for thermosonic GOLD wire bonding and AuGe, AuSn or conductive silver epoxy die attach. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should NOT be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! The following is an important note that applies to Surface Mount Multi Chip Modules. In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180C to 220C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. This is one more reasons to avoid aluminum all together. TEMPERATURE CHARACTERISTICS GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc TEMPERATURE CHARACTERISTICS SLCC SERIES RESONANT FREQUENCY GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc SERIES RESONANT FREQUENCY STANDARD PRODUCTS ORDERING INFORMATION C [pF] C multiplier TOLERANCE PACKAGE Find part # STANDARD SIZES - PRODUCTS ORDERING INFORMATION USM P/N W [mil] L [mil] C(pF) MINIMUM ORDER U/P($) 1K U/P($) 5K U/P($) 10K U/P($) 50K U/P($) 100K K30-010-0P1 10 10 0.10 $125/241 0.26 0.23 0.21 0.19 0.13 K30-015-0P2 15 15 0.20 $125/218 0.29 0.25 0.23 0.21 0.14 K30-020-0P4 20 20 0.40 $125/196 0.32 0.28 0.25 0.23 0.16 K30-025-0P7 25 25 0.70 $125/176 0.36 0.31 0.28 0.26 0.18 K30-030-1 30 30 1.00 $125/157 0.40 0.35 0.32 0.29 0.20 K30-035-1P3 35 35 1.30 $125/141 0.44 0.39 0.35 0.32 0.22 K30-040-1P8 40 40 1.80 $125/126 0.50 0.43 0.40 0.36 0.25 K30-045-2P2 45 45 2.20 $125/113 0.55 0.48 0.44 0.40 0.28 K30-050-2P8 50 50 2.80 $125/102 0.61 0.54 0.49 0.44 0.31 K30-060-4 60 60 4.00 $125/83 0.75 0.66 0.60 0.54 0.38 K30-070-5P4 70 70 5.40 $125/69 0.91 0.80 0.73 0.66 0.45 K30-080-7 80 80 7.00 $125/58 1.09 0.95 0.87 0.79 0.54 K30-090-9 90 90 9.00 $125/49 1.28 1.12 1.03 0.93 0.64 K30-100-10 100 100 10.00 $125/42 1.50 1.31 1.20 1.09 0.75 STANDARD EIA-24 VALUES - PRODUCTS ORDERING INFORMATION USM P/N W[mils] L[mils] C[pf] USM P/N W[mils] L[mils] C[pf] USMK-30-011-0P1 11 11 0.1 USMK-30-033-1 33 33 1 USMK-30-011-0P11 11 11 0.11 USMK-30-034-1P1 34 34 1.1 USMK-30-012-0P12 12 12 0.12 USMK-30-036-1P2 36 36 1.2 USMK-30-012-0P13 12 12 0.13 USMK-30-037-1P3 37 37 1.3 USMK-30-013-0P15 13 13 0.15 USMK-30-040-1P5 40 40 1.5 USMK-30-013-0P16 13 13 0.16 USMK-30-041-1P6 41 41 1.6 USMK-30-014-0P18 14 14 0.18 USMK-30-044-1P8 44 44 1.8 USMK-30-015-0P2 15 15 0.2 USMK-30-046-2 46 46 2 USMK-30-016-0P22 16 16 0.22 USMK-30-048-2P2 48 48 2.2 USMK-30-016-0P24 16 16 0.24 USMK-30-050-2P4 50 50 2.4 USMK-30-017-0P27 17 17 0.27 USMK-30-053-2P7 53 53 2.7 USMK-30-018-0P3 18 18 0.3 USMK-30-056-3 56 56 3 USMK-30-019-0P33 19 19 0.33 USMK-30-059-3P3 59 59 3.3 USMK-30-020-0P36 20 20 0.36 USMK-30-062-3P6 62 62 3.6 USMK-30-021-0P39 21 21 0.39 USMK-30-064-3P9 64 64 3.9 USMK-30-022-0P43 22 22 0.43 USMK-30-067-4P3 67 67 4.3 USMK-30-023-0P47 23 23 0.47 USMK-30-070-4P7 70 70 4.7 USMK-30-024-0P51 24 24 0.51 USMK-30-073-5P1 73 73 5.1 USMK-30-025-0P56 25 25 0.56 USMK-30-077-5P6 77 77 5.6 USMK-30-026-0P62 26 26 0.62 USMK-30-081-6P2 81 81 6.2 USMK-30-027-0P68 27 27 0.68 USMK-30-084-6P8 84 84 6.8 USMK-30-028-0P75 28 28 0.75 USMK-30-089-7P5 89 89 7.5 USMK-30-030-0P82 30 30 0.82 USMK-30-093-8P2 93 93 8.2 USMK-30-031-0P91 31 31 0.91 USMK-30-098-9P1 98 98 9.1 USMK-30-033-1 33 33 1 USMK-30-102-100 102 102 10 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.

 
 
US MICROWAVES   GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC)
Advanced Microwave Components   USMK-30-XXX-ccc
 
 

FEATURES
APPLICATIONS
SINGLE LAYER CERAMIC CAPACITOR (SLCC)
Low to very High capacitance values.
Low inductance.
High Q for RF.
Microwave & millimeter wave.
By-pass and D.C. blocking applications.
RF Bypass, DC Blocking, Filters, Submounts
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
US Microwaves USMK-30-XXX-ccc series SLCC - single layer ceramic chip capacitors - are available from low to very High capacitance values, with low inductance, high Q for RF, microwave & millimeter wave, by-pass and D.C. blocking applications. Temperature Coefficient is (TC) = +10% -95% maximum change (non-linear). Dielectric Constant (K) = 30. Capacitance values from 0.1pF to 10pF. Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding.
Gold over platinum is available on special request with custom designs.
Custom designs that match 50 ohm line widths of the capacitors with various dielectrics K or different die sizes L or W are available.
Capacitors kits are also available: CERAMIC CHIP CAPACITORS LAB-Kit.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.

ELECTRICAL/MECHANICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Operating frequency > 50 GHz
Capacitance value 0.1 to 10 pF
Standard measurement frequency 1 (C< or equal to 100 pF) MHz
Standard measurement frequency 1 (C> 100 pF) kHz
Insulation resistance (IR) 1E11 min. at 25 C Ohms
Temperature coefficient (TC) 030 (non-linear) PPM/C
Rated Voltage: 100 V
Standard tolerances 10 %
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

GENERAL DIE INFORMATION
Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal
Ceramic K=30 7±1 L x W ±2 Min. 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

SLCC DIE LAYOUT / MECHANICAL SPECIFICATIONS
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc
SLCC CHIP MOUNT
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc ceramic chip capacitor mount
SLCC ASSEMBLY PROCESS - SHORT APPLICATION NOTE
US Microwaves ceramic chip capacitors are designed for thermosonic GOLD wire bonding and AuGe, AuSn or conductive silver epoxy die attach. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should NOT be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! The following is an important note that applies to Surface Mount Multi Chip Modules. In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180C to 220C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. This is one more reasons to avoid aluminum all together.

TEMPERATURE CHARACTERISTICS
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc TEMPERATURE CHARACTERISTICS
SLCC SERIES RESONANT FREQUENCY
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-30-XXX-ccc SERIES RESONANT FREQUENCY

STANDARD PRODUCTS ORDERING INFORMATION

C [pF] C multiplier TOLERANCE PACKAGE
Find part #

STANDARD SIZES - PRODUCTS ORDERING INFORMATION
USM P/NW [mil]L [mil]C(pF)MINIMUM ORDERU/P($) 1KU/P($) 5KU/P($) 10KU/P($) 50KU/P($) 100K
K30-010-0P110100.10$125/2410.260.230.210.190.13
K30-015-0P215150.20$125/2180.290.250.230.210.14
K30-020-0P420200.40$125/1960.320.280.250.230.16
K30-025-0P725250.70$125/1760.360.310.280.260.18
K30-030-130301.00$125/1570.400.350.320.290.20
K30-035-1P335351.30$125/1410.440.390.350.320.22
K30-040-1P840401.80$125/1260.500.430.400.360.25
K30-045-2P245452.20$125/1130.550.480.440.400.28
K30-050-2P850502.80$125/1020.610.540.490.440.31
K30-060-460604.00$125/830.750.660.600.540.38
K30-070-5P470705.40$125/690.910.800.730.660.45
K30-080-780807.00$125/581.090.950.870.790.54
K30-090-990909.00$125/491.281.121.030.930.64
K30-100-1010010010.00$125/421.501.311.201.090.75

STANDARD EIA-24 VALUES - PRODUCTS ORDERING INFORMATION
USM P/NW[mils]L[mils]C[pf]USM P/NW[mils]L[mils]C[pf]
USMK-30-011-0P111110.1USMK-30-033-133331
USMK-30-011-0P1111110.11USMK-30-034-1P134341.1
USMK-30-012-0P1212120.12USMK-30-036-1P236361.2
USMK-30-012-0P1312120.13USMK-30-037-1P337371.3
USMK-30-013-0P1513130.15USMK-30-040-1P540401.5
USMK-30-013-0P1613130.16USMK-30-041-1P641411.6
USMK-30-014-0P1814140.18USMK-30-044-1P844441.8
USMK-30-015-0P215150.2USMK-30-046-246462
USMK-30-016-0P2216160.22USMK-30-048-2P248482.2
USMK-30-016-0P2416160.24USMK-30-050-2P450502.4
USMK-30-017-0P2717170.27USMK-30-053-2P753532.7
USMK-30-018-0P318180.3USMK-30-056-356563
USMK-30-019-0P3319190.33USMK-30-059-3P359593.3
USMK-30-020-0P3620200.36USMK-30-062-3P662623.6
USMK-30-021-0P3921210.39USMK-30-064-3P964643.9
USMK-30-022-0P4322220.43USMK-30-067-4P367674.3
USMK-30-023-0P4723230.47USMK-30-070-4P770704.7
USMK-30-024-0P5124240.51USMK-30-073-5P173735.1
USMK-30-025-0P5625250.56USMK-30-077-5P677775.6
USMK-30-026-0P6226260.62USMK-30-081-6P281816.2
USMK-30-027-0P6827270.68USMK-30-084-6P884846.8
USMK-30-028-0P7528280.75USMK-30-089-7P589897.5
USMK-30-030-0P8230300.82USMK-30-093-8P293938.2
USMK-30-031-0P9131310.91USMK-30-098-9P198989.1
USMK-30-033-133331USMK-30-102-10010210210

List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.


Last updated: July 06, 2009
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