USMK-7000-XXX-ccc - GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) - Microwave SLCC - Single Layer Ceramic Capacitors F> 50 GHz K-7000 ceramic DC blocking capacitors series USMK-7000-XXX-ccc - GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) - Microwave SLCC - Single Layer Ceramic Capacitors F> 50 GHz K-7000 ceramic DC blocking capacitors series US MICROWAVES GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) Advanced Microwave Components USMK-7000-XXX-ccc FEATURES APPLICATIONS SINGLE LAYER CERAMIC CAPACITOR (SLCC) Low to very High capacitance values. Low inductance. High Q for RF. Microwave & millimeter wave. By-pass and D.C. blocking applications. RF Bypass, DC Blocking, Filters, Submounts GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE US Microwaves USMK-7000-XXX-ccc series SLCC - single layer ceramic chip capacitors - are available from low to very High capacitance values, with low inductance, high Q for RF, microwave & millimeter wave, by-pass and D.C. blocking applications. Temperature Coefficient is (TC) = +10% -95% maximum change (non-linear). Dielectric Constant (K) = 7000. Capacitance values from 17pF to 1700pF. Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. Custom designs that match 50 ohm line widths of the capacitors with various dielectrics K or different die sizes L or W are available. Capacitors kits are also available: CERAMIC CHIP CAPACITORS LAB-Kit. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER VALUE UNITS Operating frequency > 50 GHz Capacitance value 17 to 1700 pF Standard measurement frequency 1 (C< or equal to 100 pF) MHz Standard measurement frequency 1 (C> 100 pF) kHz Insulation resistance (IR) 1E11 min. at 25 C Ohms Temperature coefficient (TC) 030 (non-linear) PPM/C Rated Voltage: 100 V Standard tolerances 10 % ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal Ceramic K=7000 71 L x W 2 Min. 4x4 mils, 3m thick, 99.99% electroplated gold with a TiW barrier Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SLCC DIE LAYOUT / MECHANICAL SPECIFICATIONS GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc SLCC CHIP MOUNT GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc ceramic chip capacitor mount SLCC ASSEMBLY PROCESS - SHORT APPLICATION NOTE US Microwaves ceramic chip capacitors are designed for thermosonic GOLD wire bonding and AuGe, AuSn or conductive silver epoxy die attach. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should NOT be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! The following is an important note that applies to Surface Mount Multi Chip Modules. In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180C to 220C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. This is one more reasons to avoid aluminum all together. TEMPERATURE CHARACTERISTICS GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc TEMPERATURE CHARACTERISTICS SLCC SERIES RESONANT FREQUENCY GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc SERIES RESONANT FREQUENCY STANDARD PRODUCTS ORDERING INFORMATION C [pF] C multiplier TOLERANCE PACKAGE Find part # STANDARD SIZES - PRODUCTS ORDERING INFORMATION USM P/N W [mil] L [mil] C(pF) MINIMUM ORDER U/P($) 1K U/P($) 5K U/P($) 10K U/P($) 50K U/P($) 100K K7000-010-17 10 10 17.00 $125/241 0.26 0.23 0.21 0.19 0.13 K7000-015-37 15 15 37.00 $125/218 0.29 0.25 0.23 0.21 0.14 K7000-020-67 20 20 67.00 $125/196 0.32 0.28 0.25 0.23 0.16 K7000-025-100 25 25 100.00 $125/176 0.36 0.31 0.28 0.26 0.18 K7000-030-150 30 30 150.00 $125/157 0.40 0.35 0.32 0.29 0.20 K7000-035-200 35 35 200.00 $125/141 0.44 0.39 0.35 0.32 0.22 K7000-040-270 40 40 270.00 $125/126 0.50 0.43 0.40 0.36 0.25 K7000-045-340 45 45 340.00 $125/113 0.55 0.48 0.44 0.40 0.28 K7000-050-420 50 50 420.00 $125/102 0.61 0.54 0.49 0.44 0.31 K7000-060-600 60 60 600.00 $125/83 0.75 0.66 0.60 0.54 0.38 K7000-070-820 70 70 820.00 $125/69 0.91 0.80 0.73 0.66 0.45 K7000-080-1100 80 80 1100.00 $125/58 1.09 0.95 0.87 0.79 0.54 K7000-090-1400 90 90 1400.00 $125/49 1.28 1.12 1.03 0.93 0.64 K7000-100-1700 100 100 1700.00 $125/42 1.50 1.31 1.20 1.09 0.75 STANDARD EIA-24 VALUES - PRODUCTS ORDERING INFORMATION USM P/N W[mils] L[mils] C[pf] USM P/N W[mils] L[mils] C[pf] USMK-7000-009-180 9 9 18 USMK-7000-029-181 29 29 180 USMK-7000-010-200 10 10 20 USMK-7000-030-201 30 30 200 USMK-7000-010-220 10 10 22 USMK-7000-032-221 32 32 220 USMK-7000-011-240 11 11 24 USMK-7000-033-241 33 33 240 USMK-7000-011-270 11 11 27 USMK-7000-035-271 35 35 270 USMK-7000-012-300 12 12 30 USMK-7000-037-301 37 37 300 USMK-7000-013-330 13 13 33 USMK-7000-039-331 39 39 330 USMK-7000-013-360 13 13 36 USMK-7000-041-361 41 41 360 USMK-7000-014-390 14 14 39 USMK-7000-042-391 42 42 390 USMK-7000-014-430 14 14 43 USMK-7000-044-431 44 44 430 USMK-7000-015-470 15 15 47 USMK-7000-046-471 46 46 470 USMK-7000-016-510 16 16 51 USMK-7000-048-511 48 48 510 USMK-7000-016-560 16 16 56 USMK-7000-050-561 50 50 560 USMK-7000-017-620 17 17 62 USMK-7000-053-621 53 53 620 USMK-7000-018-680 18 18 68 USMK-7000-055-681 55 55 680 USMK-7000-019-750 19 19 75 USMK-7000-058-751 58 58 750 USMK-7000-020-820 20 20 82 USMK-7000-061-821 61 61 820 USMK-7000-021-910 21 21 91 USMK-7000-064-911 64 64 910 USMK-7000-022-101 22 22 100 USMK-7000-067-102 67 67 1000 USMK-7000-023-111 23 23 110 USMK-7000-070-112 70 70 1100 USMK-7000-024-121 24 24 120 USMK-7000-074-122 74 74 1200 USMK-7000-025-131 25 25 130 USMK-7000-077-132 77 77 1300 USMK-7000-026-151 26 26 150 USMK-7000-082-152 82 82 1500 USMK-7000-027-161 27 27 160 USMK-7000-085-162 85 85 1600 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.

 
 
US MICROWAVES   GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC)
Advanced Microwave Components   USMK-7000-XXX-ccc
 
 

FEATURES
APPLICATIONS
SINGLE LAYER CERAMIC CAPACITOR (SLCC)
Low to very High capacitance values.
Low inductance.
High Q for RF.
Microwave & millimeter wave.
By-pass and D.C. blocking applications.
RF Bypass, DC Blocking, Filters, Submounts
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
US Microwaves USMK-7000-XXX-ccc series SLCC - single layer ceramic chip capacitors - are available from low to very High capacitance values, with low inductance, high Q for RF, microwave & millimeter wave, by-pass and D.C. blocking applications. Temperature Coefficient is (TC) = +10% -95% maximum change (non-linear). Dielectric Constant (K) = 7000. Capacitance values from 17pF to 1700pF. Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding.
Gold over platinum is available on special request with custom designs.
Custom designs that match 50 ohm line widths of the capacitors with various dielectrics K or different die sizes L or W are available.
Capacitors kits are also available: CERAMIC CHIP CAPACITORS LAB-Kit.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.

ELECTRICAL/MECHANICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Operating frequency > 50 GHz
Capacitance value 17 to 1700 pF
Standard measurement frequency 1 (C< or equal to 100 pF) MHz
Standard measurement frequency 1 (C> 100 pF) kHz
Insulation resistance (IR) 1E11 min. at 25 C Ohms
Temperature coefficient (TC) 030 (non-linear) PPM/C
Rated Voltage: 100 V
Standard tolerances 10 %
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

GENERAL DIE INFORMATION
Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal
Ceramic K=7000 7±1 L x W ±2 Min. 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Standard electrode metallization is Gold over Nickel compatible with epoxy, AuGe, AuSn die attaching and thermal compression or ultrasonic wire bonding. Gold over platinum is available on special request with custom designs.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, ceramic chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

SLCC DIE LAYOUT / MECHANICAL SPECIFICATIONS
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc
SLCC CHIP MOUNT
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc ceramic chip capacitor mount
SLCC ASSEMBLY PROCESS - SHORT APPLICATION NOTE
US Microwaves ceramic chip capacitors are designed for thermosonic GOLD wire bonding and AuGe, AuSn or conductive silver epoxy die attach. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should NOT be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! The following is an important note that applies to Surface Mount Multi Chip Modules. In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180C to 220C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. This is one more reasons to avoid aluminum all together.

TEMPERATURE CHARACTERISTICS
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc TEMPERATURE CHARACTERISTICS
SLCC SERIES RESONANT FREQUENCY
GHz SINGLE LAYER CERAMIC CHIP CAPACITORS (SLCC) USMK-7000-XXX-ccc SERIES RESONANT FREQUENCY

STANDARD PRODUCTS ORDERING INFORMATION

C [pF] C multiplier TOLERANCE PACKAGE
Find part #

STANDARD SIZES - PRODUCTS ORDERING INFORMATION
USM P/NW [mil]L [mil]C(pF)MINIMUM ORDERU/P($) 1KU/P($) 5KU/P($) 10KU/P($) 50KU/P($) 100K
K7000-010-17101017.00$125/2410.260.230.210.190.13
K7000-015-37151537.00$125/2180.290.250.230.210.14
K7000-020-67202067.00$125/1960.320.280.250.230.16
K7000-025-1002525100.00$125/1760.360.310.280.260.18
K7000-030-1503030150.00$125/1570.400.350.320.290.20
K7000-035-2003535200.00$125/1410.440.390.350.320.22
K7000-040-2704040270.00$125/1260.500.430.400.360.25
K7000-045-3404545340.00$125/1130.550.480.440.400.28
K7000-050-4205050420.00$125/1020.610.540.490.440.31
K7000-060-6006060600.00$125/830.750.660.600.540.38
K7000-070-8207070820.00$125/690.910.800.730.660.45
K7000-080-110080801100.00$125/581.090.950.870.790.54
K7000-090-140090901400.00$125/491.281.121.030.930.64
K7000-100-17001001001700.00$125/421.501.311.201.090.75

STANDARD EIA-24 VALUES - PRODUCTS ORDERING INFORMATION
USM P/NW[mils]L[mils]C[pf]USM P/NW[mils]L[mils]C[pf]
USMK-7000-009-1809918USMK-7000-029-1812929180
USMK-7000-010-200101020USMK-7000-030-2013030200
USMK-7000-010-220101022USMK-7000-032-2213232220
USMK-7000-011-240111124USMK-7000-033-2413333240
USMK-7000-011-270111127USMK-7000-035-2713535270
USMK-7000-012-300121230USMK-7000-037-3013737300
USMK-7000-013-330131333USMK-7000-039-3313939330
USMK-7000-013-360131336USMK-7000-041-3614141360
USMK-7000-014-390141439USMK-7000-042-3914242390
USMK-7000-014-430141443USMK-7000-044-4314444430
USMK-7000-015-470151547USMK-7000-046-4714646470
USMK-7000-016-510161651USMK-7000-048-5114848510
USMK-7000-016-560161656USMK-7000-050-5615050560
USMK-7000-017-620171762USMK-7000-053-6215353620
USMK-7000-018-680181868USMK-7000-055-6815555680
USMK-7000-019-750191975USMK-7000-058-7515858750
USMK-7000-020-820202082USMK-7000-061-8216161820
USMK-7000-021-910212191USMK-7000-064-9116464910
USMK-7000-022-1012222100USMK-7000-067-10267671000
USMK-7000-023-1112323110USMK-7000-070-11270701100
USMK-7000-024-1212424120USMK-7000-074-12274741200
USMK-7000-025-1312525130USMK-7000-077-13277771300
USMK-7000-026-1512626150USMK-7000-082-15282821500
USMK-7000-027-1612727160USMK-7000-085-16285851600

List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.


Last updated: July 06, 2009
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