HSKBEOI05030010 Beryllium Oxide thermal management, therma plane, Laser diode submounts BeO - 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks - High heat transfer rate, High thermal conductivity Beryllium Oxide heat sinks and stand offs manufactured by US Microwaves HSKBEOI05030010,thermal management,therma plane,Laser diode submounts,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers HSKBEOI05030010 Beryllium Oxide thermal management, therma plane, Laser diode submounts BeO - 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks - High heat transfer rate, High thermal conductivity Beryllium Oxide heat sinks and stand offs manufactured by US Microwaves HSKBEOI05030010,thermal management,therma plane,Laser diode submounts,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers US MICROWAVES 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks Advanced Microwave Components HSKBEOI05030010 FEATURES APPLICATIONS BeO Isolated Heat Sink High heat transfer rate High thermal conductivity Very good thermal contact Very good thermal shock resistance Microwave hybrid circuits Mount for GaAs microwave active devices Solid state RF power amplifiers 30x10 mils, 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI05030010 HSKBEOI05030010 Beryllium Oxide Isolated Heat Sink PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The HSKBEOI05030010 series of microwave 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING HSKBEOI05030010 Beryllium Oxide Isolated Heat Sink ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER SYMBOL VALUE UNITS Length L 30 mils Width W 10 mils Thickness T 5 mils Thermal Resistance Rth 2.34 K/W Thermal Conductivity k 4.27E-01 W/K Capacitance C 0.09 pF ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. HSKBEOI05030010 Beryllium Oxide Isolated Heat Sink GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Case style BeO [Beryllium Oxide] 5±0.5 30x10±2 Frontside metal Backside metal The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. 30x10 mils, 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI05030010 All US Microwaves Beryllium Oxide Isolated Heat Sink products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). Beryllium Oxide Isolated Heat Sink STANDARD PRODUCTS ORDERING INFORMATION Beryllium Oxide Isolated Heat Sink STANDARD PRODUCTS T L W METAL DIE ATTACH US MICROWAVES PART NUMBER WAFFLE PACKS MIN. QTY U/P [$] ORDER [mils] 5 30 10 TiW/Au AuSi, AuGe, epoxy HSKBEOI05030010-BD0 -WP 1015 $1.576 ORDER Ti/Pd/Au AuSn, AuGe HSKBEOI05030010-BD1 -WP RFQ Ti/Pt/Au AuSn, AuGe HSKBEOI05030010-BD2 -WP RFQ Ti/Ni/Au Soft Solder SAC HSKBEOI05030010-BD3 -WP RFQ Ti/Pt/AuSn AuSn eutectic HSKBEOI05030010-BD4 -WP RFQ Ti/Ni/Sn Soft Solder SAC HSKBEOI05030010-BD5 -WP RFQ 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI05030010: Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. HSKBEOI05030010 Beryllium Oxide Isolated Heat Sink INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Beryllium Oxide Isolated Heat Sink may be ordered on line HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks BeO SHIPPING/PACKAGING: All 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks SAMPLES: Samples of 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all Beryllium Oxide Isolated Heat Sink standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales

 
 
US MICROWAVES   5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks
Advanced Microwave Components   HSKBEOI05030010
 
 

FEATURES
APPLICATIONS
BeO Isolated Heat Sink
High heat transfer rate
High thermal conductivity
Very good thermal contact
Very good thermal shock resistance
Microwave hybrid circuits
Mount for GaAs microwave active devices
Solid state RF power amplifiers
30x10 mils, 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI05030010

HSKBEOI05030010 Beryllium Oxide Isolated Heat Sink
PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The HSKBEOI05030010 series of microwave 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55C to +125C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.

HSKBEOI05030010 Beryllium Oxide Isolated Heat Sink
ELECTRICAL/MECHANICAL CHARACTERISTICS
PARAMETER SYMBOL VALUE UNITS
Length L 30 mils
Width W 10 mils
Thickness T 5 mils
Thermal Resistance Rth 2.34 K/W
Thermal Conductivity k 4.27E-01 W/K
Capacitance C 0.09 pF
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

HSKBEOI05030010 Beryllium Oxide Isolated Heat Sink
GENERAL DIE INFORMATION
Substrate Thickness [mils] Size [mils] Case style
BeO [Beryllium Oxide] 5±0.5 30x10±2  
Frontside metal Backside metal
The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders.
30x10 mils, 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI05030010
All US Microwaves Beryllium Oxide Isolated Heat Sink products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).

Beryllium Oxide Isolated Heat Sink STANDARD PRODUCTS ORDERING INFORMATION

Beryllium Oxide Isolated Heat Sink STANDARD PRODUCTS
T L W METAL DIE ATTACH US MICROWAVES
PART NUMBER
WAFFLE
PACKS
MIN.
QTY
U/P
[$]
ORDER
[mils]
5 30 10 TiW/Au AuSi, AuGe, epoxy HSKBEOI05030010-BD0 -WP 1015 $1.576 ORDER
Ti/Pd/Au AuSn, AuGe HSKBEOI05030010-BD1 -WP     RFQ
Ti/Pt/Au AuSn, AuGe HSKBEOI05030010-BD2 -WP     RFQ
Ti/Ni/Au Soft Solder SAC HSKBEOI05030010-BD3 -WP     RFQ
Ti/Pt/AuSn AuSn eutectic HSKBEOI05030010-BD4 -WP     RFQ
Ti/Ni/Sn Soft Solder SAC HSKBEOI05030010-BD5 -WP     RFQ
5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI05030010: List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

STANDARD PRODUCTS AVAILABLE FROM STOCK - ORDERING INFORMATION
USM P/NMIN QTYU/PORDER/RFQSTOCK QTYU/PORDER/RFQ
No part available from stock

HSKBEOI05030010 Beryllium Oxide Isolated Heat Sink INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Beryllium Oxide Isolated Heat Sink may be ordered on line HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks BeO products packaged in waffle packs is 2-4 weeks ARO. For custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, heat sink devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples of 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all Beryllium Oxide Isolated Heat Sink standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.


Last updated: September 24, 2010
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