| SPIRAL CHIP INDUCTORS LX4080T8Q-2LX13-100nH FEATURES 2 Spiral chip inductors, each 100nH with same orientation, in close proximity on 8mil thick quartz substrate (99.99% SiO2). APPLICATIONS These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. Spiral Chip Inductors Lab kits are available from stock: L-Kit Application note: AN 102 PRODUCT DESCRIPTION The LX4080T8Q-2LX13-100nH Series of spiral chip inductors are designed to be used in chip and wire hybrid circuits as RF choke in power supplies and microwave circuit resonant elements. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. U.S. Microwaves advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25µm, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. Application note AN 102 describes the recommended assembly for best performance. MICROWAVE APPLIED THIN FILM PRODUCTS MANUFACTURING PROCESS DESCRIPTION All thin film microwave products are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. SUBSTRATE INFORMATION INDUCTOR SPECIFICATIONS Material SiO2 -Quartz Thickness 8±1 mil Die size 40x80±3 mils, 30x30±3 mils Current rating 100mA@70°C Tolerance 20 % Capacitance <0.030pF CONDUCTORS The conductor and bonding pads are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. BACKSIDE METALS Backside of the die is NOT metallized. Standard TiW/Au or custom metallization is available for special orders. ELECTRICAL CHARACTERISTICS Inductance 106nH , Inductance Tolerance (Absolute) + 25°C ±20.0 % DC Resistance typ. 0.1W Current Rating: Max. 100mA@70°C Quality Factor Q @ 100MHz typ. 25.5 Series Self Resonance SRF typ. ff GHz Parallell Self Resonance PRF typ. ff GHz Operating Temperature Range - 55 to + 125°C Storage Temperature Range - 55 to + 125°C PRICES, DELIVERY & ORDERING INFORMATION PART# LX4080T8Q-2LX13-100nH Minim Order 100pc U/P($) $4.80 All US Microwaves products are available in die form. Typical delivery for die products is 1-2 weeks ARO. For Custom designs, delivery is 2-3 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are shipped in waffle packs. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
| US MICROWAVES Advanced Microwave Components |
CUSTOM
SPIRAL CHIP INDUCTORS LX4080T8Q-2LX13-100nH |
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| PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE |
| The LX4080T8Q-2LX13-100nH spiral chip dual inductors are designed to be used in chip and wire hybrid circuits as RF choke in power supplies and microwave circuit resonant elements. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. U.S. Microwaves advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25µm, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. Application note AN 102 describes the recommended assembly for best performance. |
| TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING |
| All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. |
| ELECTRICAL CHARACTERISTICS | ||
| PARAMETER | VALUE | UNITS |
| Number of turns | 13 | |
| Inductance | 106.25 | nH |
| Inductance Tolerance: Absolute, +25°C | ±20.0* | % |
| DC Resistance | typ. 4.58 | W |
| Current Rating: Max. @ + 70°C | typ. 100 | mA |
| Quality Factor Q @ 100MHz | typ. 29.1 | |
| Series Self Resonance SRF | typ. - tbp for 8 mils | GHz |
| Parallell Self Resonance PRF | typ. tbp for 8 mils | GHz |
| Operating Temperature Range | - 55 to + 125 | °C |
| Storage Temperature Range | - 55 to + 125 | °C |
| * The actual tolerance is within 5% because of fixed pattern. The specification of ±20.0% is meant to include design errors and in some cases for large inductance (>10nH) includes the bonding wire contribution to total inductance. | ||
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| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) | Bonding pads | Backside metal |
| SiO2 - Quartz | 8±1 | 40 x 80±3 | min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier | Backside of the die is NOT metallized. Standard TiW/Au or custom metallization is available for special orders. |
| All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). | ||||
| DIE LAYOUT - MECHANICAL SPECIFICATIONS |
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| STANDARD PRODUCTS ORDERING INFORMATION |
| STANDARD PRODUCTS PRICE LIST | |||
| USM PART # | Waffle Packs | MINIMUM ORDER QUANTITY | U/P($) |
| LX4080T8Q-2LX13-100nH | -WP | 1000pc | $4.80 |
| List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. | |||
| Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. | |||
| ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. |
| U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
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| Last updated: July 01, 2009 | |
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