USMZ50T-15-030100-WP - TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 100 mils length USMZ50T-15-030100-WP - Low return loss optimised up to 50GHz, Z50 50 ohm impedance microstrip transmission line on 15±0.5 mil alumina ceramic substrate USMZ50T-15-030100-WP - TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 100 mils length USMZ50T-15-030100-WP - Low return loss optimised up to 50GHz, Z50 50 ohm impedance microstrip transmission line on 15±0.5 mil alumina ceramic substrate USMZ50T-15-030050-WP - TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 50 mils length USMZ50T-15-030050-WP - Low return loss optimised up to 50GHz, Z50 50 ohm impedance microstrip transmission line on 15±0.5 mil alumina ceramic substrate US MICROWAVES TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 50 mils length Advanced Microwave Components USMZ50T-15-030050-WP FEATURES APPLICATIONS 50 OHM MICROSTRIP TRANSMISSION LINE Low insertion loss High reliability and ruggedness Available in different ceramic thickness and overall sizes. Engineering Lab Kits available Custom Z0 sizes available upon request. Most MicroStrip microwave applications use 50 ohm transmission lines as basic building block. TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 50 mils length USMZ50T-15-030050-WP PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE USM USMZ50T-15-030050-WP 50 ohm MicroStrip transmission lines are basic building blocks designed to be used in chip and wire microwave hybrid circuits. 50 ohms transmission lines are available in different alumina ceramic thicknesses and different widths and lengths. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER VALUE UNITS Impedance 50 ohms Transmission Line width W0 15 mils Width 30 mils Length 50 mils Thickness 15 mils Operating Temperature Range - 55 to + 125 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Top Conductor Backside metal Al2O3 - Aluminium Oxide 15±0.5 50 x 30 ±2 Standard 3µm thick, 99.99% electroplated gold with a TiW barrier Backside of the die is metallized with standard TiW/Au compatible with Au-Ge or silver filled conductive epoxy. Custom metallization is available for special orders. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). RETURN LOSS S-PARAMETERS TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 50 mils length USMZ50T-15-030050-WP CLICK TO ENLARGE S-PARAMETERS CARTESIAN PLOT CLICK TO VIEW SMITH CHART PLOT STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS PRICE LIST THICKNESS [mils] WIDTH [mils] LENGTH [mils] US MICROWAVES PART NUMBER WAFFLE PACKS MINIM ORDER QTY U/P [$] 15 30 50 USMZ50T-15-030050-WP -WP 193 $1.98 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 ©1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission. US MICROWAVES TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 100 mils length Advanced Microwave Components USMZ50T-15-030100-WP FEATURES APPLICATIONS 50 OHM MICROSTRIP TRANSMISSION LINE Low insertion loss High reliability and ruggedness Available in different ceramic thickness and overall sizes. Engineering Lab Kits available Custom Z0 sizes available upon request. Most MicroStrip microwave applications use 50 ohm transmission lines as basic building block. TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 100 mils length USMZ50T-15-030100-WP PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE USM USMZ50T-15-030100-WP 50 ohm MicroStrip transmission lines are basic building blocks designed to be used in chip and wire microwave hybrid circuits. 50 ohms transmission lines are available in different alumina ceramic thicknesses and different widths and lengths. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER VALUE UNITS Impedance 50 ohms Transmission Line width W0 15 mils Width 30 mils Length 100 mils Thickness 15 mils Operating Temperature Range - 55 to + 125 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Top Conductor Backside metal Al2O3 - Aluminium Oxide 15±0.5 100 x 30 ±2 Standard 3µm thick, 99.99% electroplated gold with a TiW barrier Backside of the die is metallized with standard TiW/Au compatible with Au-Ge or silver filled conductive epoxy. Custom metallization is available for special orders. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). RETURN LOSS S-PARAMETERS TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 100 mils length USMZ50T-15-030100-WP CLICK TO ENLARGE S-PARAMETERS CARTESIAN PLOT CLICK TO VIEW SMITH CHART PLOT STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS PRICE LIST THICKNESS [mils] WIDTH [mils] LENGTH [mils] US MICROWAVES PART NUMBER WAFFLE PACKS MINIM ORDER QTY U/P [$] 15 30 100 USMZ50T-15-030100-WP -WP 125 $3.2 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 ©1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.

 
 
US MICROWAVES   TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 100 mils length
Advanced Microwave Components   USMZ50T-15-030100-WP
 
 

FEATURES
APPLICATIONS
50 OHM MICROSTRIP TRANSMISSION LINE
Low insertion loss
High reliability and ruggedness
Available in different ceramic thickness and overall sizes.
Engineering Lab Kits available
Custom Z0 sizes available upon request.
Most MicroStrip microwave applications use 50 ohm transmission lines as basic building block.
TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 100 mils length USMZ50T-15-030100-WP

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
USM USMZ50T-15-030100-WP 50 ohm MicroStrip transmission lines are basic building blocks designed to be used in chip and wire microwave hybrid circuits. 50 ohms transmission lines are available in different alumina ceramic thicknesses and different widths and lengths.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1ohm/sq to 10,000ohms/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.

ELECTRICAL/MECHANICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Impedance 50 ohms
Transmission Line width W0 15 mils
Width 30 mils
Length 100 mils
Thickness 15 mils
Operating Temperature Range - 55 to + 125 °C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

GENERAL DIE INFORMATION
Substrate Thickness [mils] Size [mils] Top Conductor Backside metal
Al2O3 - Aluminium Oxide 15±0.5 100 x 30 ±2 Standard 3µm thick, 99.99% electroplated gold with a TiW barrier Backside of the die is metallized with standard TiW/Au compatible with Au-Ge or silver filled conductive epoxy. Custom metallization is available for special orders.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).

RETURN LOSS S-PARAMETERS
TUNABLE Z50 50Ohms transmission lines, 15 mils thick ceramic, 30 mils width, 100 mils length USMZ50T-15-030100-WP
CLICK TO ENLARGE S-PARAMETERS CARTESIAN PLOT CLICK TO VIEW SMITH CHART PLOT

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
THICKNESS
[mils]
WIDTH
[mils]
LENGTH
[mils]
US MICROWAVES
PART NUMBER
WAFFLE
PACKS
MINIM ORDER
QTY
U/P
[$]
15 30 100 USMZ50T-15-030100-WP -WP 125 $3.2
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.


Last updated: July 06, 2009
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