| HSKALNI25xxxyyy Aluminum Nitride thermal management, therma plane, Laser diode submounts AlN - 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin - High heat transfer rate, High thermal conductivity Aluminum Nitride Gold Tin heat sink submounts and stand offs manufactured by US Microwaves HSKALNI25xxxyyy,thermal management, therma plane, Laser diode submounts,Gold Tin,Heat sink, submounts, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers HSKALNI25xxxyyy Aluminum Nitride thermal management, therma plane, Laser diode submounts AlN - 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin - High heat transfer rate, High thermal conductivity Aluminum Nitride Gold Tin heat sink submounts and stand offs manufactured by US Microwaves HSKALNI25xxxyyy,thermal management, therma plane, Laser diode submounts,Gold Tin,Heat sink, submounts, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers US MICROWAVES 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin Advanced Microwave Components HSKALNI25xxxyyy FEATURES APPLICATIONS AlN Isolated Heat Sink Submount High heat transfer rate High thermal conductivity Very good thermal contact Very good thermal shock resistance Microwave hybrid circuits Mount for GaAs microwave active devices Solid state RF power amplifiers 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin HSKALNI25xxxyyy HSKALNI25xxxyyy Aluminum Nitride Isolated Gold Tin Heat Sink Submounts PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The HSKALNI25xxxyyy series of microwave 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING HSKALNI25xxxyyy Aluminum Nitride Isolated Gold Tin Heat Sink Submounts ELECTRICAL/MECHANICAL CHARACTERISTICS LENGTH [mils] WIDTH [mils] PARAMETER SYMBOL VALUE UNITS - - Thickness T 25 mils 10 10 Thermal Resistance Rth 57.9 K/W Thermal Conductivity k 1.73E-02 W/K Capacitance C 0.008 pF 20 10 Thermal Resistance Rth 28.95 K/W Thermal Conductivity k 3.45E-02 W/K Capacitance C 0.016 pF 30 10 Thermal Resistance Rth 19.3 K/W Thermal Conductivity k 5.18E-02 W/K Capacitance C 0.023 pF 20 20 Thermal Resistance Rth 14.47 K/W Thermal Conductivity k 6.91E-02 W/K Capacitance C 0.031 pF 40 20 Thermal Resistance Rth 7.24 K/W Thermal Conductivity k 1.38E-01 W/K Capacitance C 0.063 pF 60 20 Thermal Resistance Rth 4.82 K/W Thermal Conductivity k 2.07E-01 W/K Capacitance C 0.094 pF 30 30 Thermal Resistance Rth 6.43 K/W Thermal Conductivity k 1.56E-01 W/K Capacitance C 0.07 pF 60 30 Thermal Resistance Rth 3.22 K/W Thermal Conductivity k 3.11E-01 W/K Capacitance C 0.141 pF 120 30 Thermal Resistance Rth 1.61 K/W Thermal Conductivity k 6.21E-01 W/K Capacitance C 0.282 pF 40 40 Thermal Resistance Rth 3.62 K/W Thermal Conductivity k 2.76E-01 W/K Capacitance C 0.125 pF 80 40 Thermal Resistance Rth 1.81 K/W Thermal Conductivity k 5.52E-01 W/K Capacitance C 0.25 pF 120 40 Thermal Resistance Rth 1.21 K/W Thermal Conductivity k 8.26E-01 W/K Capacitance C 0.376 pF 160 40 Thermal Resistance Rth 0.9 K/W Thermal Conductivity k 1.11E+00 W/K Capacitance C 0.501 pF 50 50 Thermal Resistance Rth 2.32 K/W Thermal Conductivity k 4.31E-01 W/K Capacitance C 0.196 pF 80 50 Thermal Resistance Rth 1.45 K/W Thermal Conductivity k 6.90E-01 W/K Capacitance C 0.313 pF 100 50 Thermal Resistance Rth 1.16 K/W Thermal Conductivity k 8.62E-01 W/K Capacitance C 0.391 pF 120 60 Thermal Resistance Rth 0.8 K/W Thermal Conductivity k 1.25E+00 W/K Capacitance C 0.564 pF 200 100 Thermal Resistance Rth 0.29 K/W Thermal Conductivity k 3.45E+00 W/K Capacitance C 1.565 pF 180 120 Thermal Resistance Rth 0.27 K/W Thermal Conductivity k 3.70E+00 W/K Capacitance C 1.691 pF 240 120 Thermal Resistance Rth 0.2 K/W Thermal Conductivity k 5.00E+00 W/K Capacitance C 2.254 pF 250 120 Thermal Resistance Rth 0.19 K/W Thermal Conductivity k 5.26E+00 W/K Capacitance C 2.348 pF 290 170 Thermal Resistance Rth 0.12 K/W Thermal Conductivity k 8.33E+00 W/K Capacitance C 3.858 pF 230 180 Thermal Resistance Rth 0.14 K/W Thermal Conductivity k 7.14E+00 W/K Capacitance C 3.24 pF 220 250 Thermal Resistance Rth 0.11 K/W Thermal Conductivity k 9.09E+00 W/K Capacitance C 4.305 pF 250 250 Thermal Resistance Rth 0.09 K/W Thermal Conductivity k 1.11E+01 W/K Capacitance C 4.891 pF 370 250 Thermal Resistance Rth 0.06 K/W Thermal Conductivity k 1.67E+01 W/K Capacitance C 7.239 pF ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. HSKALNI25xxxyyy Aluminum Nitride Isolated Gold Tin Heat Sink Submounts GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Case style AlN [Aluminum Nitride] 25±0.5 xxxxyyy±2 Frontside metal Backside metal The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. L x W mils, 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin HSKALNI25xxxyyy All US Microwaves Aluminum Nitride Isolated Gold Tin Heat Sink Submount products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). Aluminum Nitride Isolated Gold Tin Heat Sink Submounts STANDARD PRODUCTS ORDERING INFORMATION 25 mills Aluminum Nitride Isolated Gold Tin Heat Sink Submounts STANDARD PRODUCTS LENGTH [mils] WIDTH [mils] US MICROWAVES PART NUMBER WAFFLE PACKS MINIM ORDER QTY U/P [$] ORDER RFQ 10 10 HSKALNI25010010-BD0 -WP 241 $1.328 ORDER 20 10 HSKALNI25020010-BD0 -WP 220 $1.455 ORDER 30 10 HSKALNI25030010-BD0 -WP 203 $1.576 ORDER 20 20 HSKALNI25020020-BD0 -WP 196 $1.633 ORDER 40 20 HSKALNI25040020-BD0 -WP 161 $1.988 ORDER 60 20 HSKALNI25060020-BD0 -WP 137 $2.336 ORDER 30 30 HSKALNI25030030-BD0 -WP 157 $2.038 ORDER 60 30 HSKALNI25060030-BD0 -WP 118 $2.712 ORDER 120 30 HSKALNI25120030-BD0 -WP 79 $4.051 ORDER 40 40 HSKALNI25040040-BD0 -WP 126 $2.540 ORDER 80 40 HSKALNI25080040-BD0 -WP 88 $3.636 ORDER 120 40 HSKALNI25120040-BD0 -WP 67 $4.776 ORDER 160 40 HSKALNI25160040-BD0 -WP 55 $5.818 ORDER 50 50 HSKALNI25050050-BD0 -WP RFQ 80 50 HSKALNI25080050-BD0 -WP RFQ 100 50 HSKALNI25100050-BD0 -WP RFQ 120 60 HSKALNI25120060-BD0 -WP RFQ 200 100 HSKALNI25200100-BD0 -WP RFQ 180 120 HSKALNI25180120-BD0 -WP RFQ 240 120 HSKALNI25240120-BD0 -WP RFQ 250 120 HSKALNI25250120-BD0 -WP RFQ 290 170 HSKALNI25290170-BD0 -WP RFQ 230 180 HSKALNI25230180-BD0 -WP RFQ 220 250 HSKALNI25220250-BD0 -WP RFQ 250 250 HSKALNI25250250-BD0 -WP RFQ 370 250 HSKALNI25370250-BD0 -WP RFQ HSKALNI25xxxyyy Aluminum Nitride Isolated Gold Tin Heat Sink Submounts: Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. HSKALNI25xxxyyy Aluminum Nitride Isolated Gold Tin Heat Sink Submounts INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Aluminum Nitride Isolated Gold Tin Heat Sink Submounts may be ordered on line HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin SHIPPING/PACKAGING: All 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin SAMPLES: Samples of 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin Gold Tin Heat Sink Submounts standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales |
| US MICROWAVES | 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin | |
| Advanced Microwave Components | HSKALNI25xxxyyy | |
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FEATURES
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APPLICATIONS
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AlN Isolated Heat Sink Submount
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| HSKALNI25xxxyyy Aluminum Nitride Isolated Gold Tin Heat Sink Submounts |
| PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE |
| The HSKALNI25xxxyyy series of microwave 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs. |
| TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING |
| All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. |
| HSKALNI25xxxyyy Aluminum Nitride Isolated Gold Tin Heat Sink Submounts | |||||
| ELECTRICAL/MECHANICAL CHARACTERISTICS | |||||
| LENGTH [mils] | WIDTH [mils] | PARAMETER | SYMBOL | VALUE | UNITS |
| - | - | Thickness | T | 25 | mils |
| 10 | 10 | Thermal Resistance | Rth | 57.9 | K/W |
| Thermal Conductivity | k | 1.73E-02 | W/K | ||
| Capacitance | C | 0.008 | pF | ||
| 20 | 10 | Thermal Resistance | Rth | 28.95 | K/W |
| Thermal Conductivity | k | 3.45E-02 | W/K | ||
| Capacitance | C | 0.016 | pF | ||
| 30 | 10 | Thermal Resistance | Rth | 19.3 | K/W |
| Thermal Conductivity | k | 5.18E-02 | W/K | ||
| Capacitance | C | 0.023 | pF | ||
| 20 | 20 | Thermal Resistance | Rth | 14.47 | K/W |
| Thermal Conductivity | k | 6.91E-02 | W/K | ||
| Capacitance | C | 0.031 | pF | ||
| 40 | 20 | Thermal Resistance | Rth | 7.24 | K/W |
| Thermal Conductivity | k | 1.38E-01 | W/K | ||
| Capacitance | C | 0.063 | pF | ||
| 60 | 20 | Thermal Resistance | Rth | 4.82 | K/W |
| Thermal Conductivity | k | 2.07E-01 | W/K | ||
| Capacitance | C | 0.094 | pF | ||
| 30 | 30 | Thermal Resistance | Rth | 6.43 | K/W |
| Thermal Conductivity | k | 1.56E-01 | W/K | ||
| Capacitance | C | 0.07 | pF | ||
| 60 | 30 | Thermal Resistance | Rth | 3.22 | K/W |
| Thermal Conductivity | k | 3.11E-01 | W/K | ||
| Capacitance | C | 0.141 | pF | ||
| 120 | 30 | Thermal Resistance | Rth | 1.61 | K/W |
| Thermal Conductivity | k | 6.21E-01 | W/K | ||
| Capacitance | C | 0.282 | pF | ||
| 40 | 40 | Thermal Resistance | Rth | 3.62 | K/W |
| Thermal Conductivity | k | 2.76E-01 | W/K | ||
| Capacitance | C | 0.125 | pF | ||
| 80 | 40 | Thermal Resistance | Rth | 1.81 | K/W |
| Thermal Conductivity | k | 5.52E-01 | W/K | ||
| Capacitance | C | 0.25 | pF | ||
| 120 | 40 | Thermal Resistance | Rth | 1.21 | K/W |
| Thermal Conductivity | k | 8.26E-01 | W/K | ||
| Capacitance | C | 0.376 | pF | ||
| 160 | 40 | Thermal Resistance | Rth | 0.9 | K/W |
| Thermal Conductivity | k | 1.11E+00 | W/K | ||
| Capacitance | C | 0.501 | pF | ||
| 50 | 50 | Thermal Resistance | Rth | 2.32 | K/W |
| Thermal Conductivity | k | 4.31E-01 | W/K | ||
| Capacitance | C | 0.196 | pF | ||
| 80 | 50 | Thermal Resistance | Rth | 1.45 | K/W |
| Thermal Conductivity | k | 6.90E-01 | W/K | ||
| Capacitance | C | 0.313 | pF | ||
| 100 | 50 | Thermal Resistance | Rth | 1.16 | K/W |
| Thermal Conductivity | k | 8.62E-01 | W/K | ||
| Capacitance | C | 0.391 | pF | ||
| 120 | 60 | Thermal Resistance | Rth | 0.8 | K/W |
| Thermal Conductivity | k | 1.25E+00 | W/K | ||
| Capacitance | C | 0.564 | pF | ||
| 200 | 100 | Thermal Resistance | Rth | 0.29 | K/W |
| Thermal Conductivity | k | 3.45E+00 | W/K | ||
| Capacitance | C | 1.565 | pF | ||
| 180 | 120 | Thermal Resistance | Rth | 0.27 | K/W |
| Thermal Conductivity | k | 3.70E+00 | W/K | ||
| Capacitance | C | 1.691 | pF | ||
| 240 | 120 | Thermal Resistance | Rth | 0.2 | K/W |
| Thermal Conductivity | k | 5.00E+00 | W/K | ||
| Capacitance | C | 2.254 | pF | ||
| 250 | 120 | Thermal Resistance | Rth | 0.19 | K/W |
| Thermal Conductivity | k | 5.26E+00 | W/K | ||
| Capacitance | C | 2.348 | pF | ||
| 290 | 170 | Thermal Resistance | Rth | 0.12 | K/W |
| Thermal Conductivity | k | 8.33E+00 | W/K | ||
| Capacitance | C | 3.858 | pF | ||
| 230 | 180 | Thermal Resistance | Rth | 0.14 | K/W |
| Thermal Conductivity | k | 7.14E+00 | W/K | ||
| Capacitance | C | 3.24 | pF | ||
| 220 | 250 | Thermal Resistance | Rth | 0.11 | K/W |
| Thermal Conductivity | k | 9.09E+00 | W/K | ||
| Capacitance | C | 4.305 | pF | ||
| 250 | 250 | Thermal Resistance | Rth | 0.09 | K/W |
| Thermal Conductivity | k | 1.11E+01 | W/K | ||
| Capacitance | C | 4.891 | pF | ||
| 370 | 250 | Thermal Resistance | Rth | 0.06 | K/W |
| Thermal Conductivity | k | 1.67E+01 | W/K | ||
| Capacitance | C | 7.239 | pF | ||
| ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. | |||||
| HSKALNI25xxxyyy Aluminum Nitride Isolated Gold Tin Heat Sink Submounts | |||
| GENERAL DIE INFORMATION | |||
| Substrate | Thickness [mils] | Size [mils] | Case style |
| AlN [Aluminum Nitride] | 25±0.5 | xxxxyyy±2 | |
| Frontside metal | Backside metal | ||
| The standard front side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. | The standard back side metallization (BD0 - compatible with AuSn,AuGe die attach) is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Other available metallization schemes are -BD1: Ti/Pd/Au compatible with AuSn,AuGe -BD2: Ti/Pt/Au compatible with AuSn,AuGe -BD3: Ti/Ni/Au compatible with Soft Solder SAC -BD4: Ti/Pt/AuSn compatible with AuSn eutectic -BD5: Ti/Ni/Sn compatible with Soft Solder SAC. Custom metallization is available for special orders. | ||
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| All US Microwaves Aluminum Nitride Isolated Gold Tin Heat Sink Submount products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). | |||
| Aluminum Nitride Isolated Gold Tin Heat Sink Submounts STANDARD PRODUCTS ORDERING INFORMATION |
| 25 mills Aluminum Nitride Isolated Gold Tin Heat Sink Submounts STANDARD PRODUCTS | ||||||
| LENGTH [mils] |
WIDTH [mils] |
US MICROWAVES PART NUMBER |
WAFFLE PACKS |
MINIM ORDER QTY |
U/P [$] |
ORDER RFQ |
| 10 | 10 | HSKALNI25010010-BD0 | -WP | 241 | $1.328 | ORDER |
| 20 | 10 | HSKALNI25020010-BD0 | -WP | 220 | $1.455 | ORDER |
| 30 | 10 | HSKALNI25030010-BD0 | -WP | 203 | $1.576 | ORDER |
| 20 | 20 | HSKALNI25020020-BD0 | -WP | 196 | $1.633 | ORDER |
| 40 | 20 | HSKALNI25040020-BD0 | -WP | 161 | $1.988 | ORDER |
| 60 | 20 | HSKALNI25060020-BD0 | -WP | 137 | $2.336 | ORDER |
| 30 | 30 | HSKALNI25030030-BD0 | -WP | 157 | $2.038 | ORDER |
| 60 | 30 | HSKALNI25060030-BD0 | -WP | 118 | $2.712 | ORDER |
| 120 | 30 | HSKALNI25120030-BD0 | -WP | 79 | $4.051 | ORDER |
| 40 | 40 | HSKALNI25040040-BD0 | -WP | 126 | $2.540 | ORDER |
| 80 | 40 | HSKALNI25080040-BD0 | -WP | 88 | $3.636 | ORDER |
| 120 | 40 | HSKALNI25120040-BD0 | -WP | 67 | $4.776 | ORDER |
| 160 | 40 | HSKALNI25160040-BD0 | -WP | 55 | $5.818 | ORDER |
| 50 | 50 | HSKALNI25050050-BD0 | -WP | RFQ | ||
| 80 | 50 | HSKALNI25080050-BD0 | -WP | RFQ | ||
| 100 | 50 | HSKALNI25100050-BD0 | -WP | RFQ | ||
| 120 | 60 | HSKALNI25120060-BD0 | -WP | RFQ | ||
| 200 | 100 | HSKALNI25200100-BD0 | -WP | RFQ | ||
| 180 | 120 | HSKALNI25180120-BD0 | -WP | RFQ | ||
| 240 | 120 | HSKALNI25240120-BD0 | -WP | RFQ | ||
| 250 | 120 | HSKALNI25250120-BD0 | -WP | RFQ | ||
| 290 | 170 | HSKALNI25290170-BD0 | -WP | RFQ | ||
| 230 | 180 | HSKALNI25230180-BD0 | -WP | RFQ | ||
| 220 | 250 | HSKALNI25220250-BD0 | -WP | RFQ | ||
| 250 | 250 | HSKALNI25250250-BD0 | -WP | RFQ | ||
| 370 | 250 | HSKALNI25370250-BD0 | -WP | RFQ | ||
| HSKALNI25xxxyyy Aluminum Nitride Isolated Gold Tin Heat Sink Submounts: List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. | ||||||
| Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. | ||||||
| STANDARD PRODUCTS AVAILABLE FROM STOCK - ORDERING INFORMATION | ||||||
| USM P/N | MIN QTY | U/P | ORDER/RFQ | STOCK QTY | U/P | ORDER/RFQ |
| No part available from stock | ||||||
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ORDERING: Aluminum Nitride Isolated Gold Tin Heat Sink Submounts may be ordered on line
HERE.
A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin products packaged in waffle packs is 2-4 weeks ARO. For custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, heat sink devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples of 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all 25 mils Aluminum Nitride Isolated submounts and heat sinks gold tin Gold Tin Heat Sink Submounts standard products provided minimum order quantities are met. |
| U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. |
| Home | Product Tree | Tech. Support | Request Quote | Inventory | Place Order | Contact sales |
| Last updated: September 24, 2010 | |
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