|
Heat sinks, isolated and ellectrically conductive heat sinks and stand offs on AlN Aluminium Nitride, BeO Beryllium Oxide, Si Silicon and Cu Copper , zero ohm jumpers, bonding island manufactured by US Microwaves - Thin film microwave and RF products
Heat sinks, stand offs, bonding islands, zero ohm jumpers, isolated, electrically conductive,aluminum nitride, beryllium oxide, silicon, quartz, glass, alumina ceramic, Thin Film Microwave Circuits
HSKALNI05xxxyyy 5 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI10xxxyyy 10 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI15xxxyyy 15 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI20xxxyyy 20 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI25xxxyyy 25 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI30xxxyyy 30 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI35xxxyyy 35 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI40xxxyyy 40 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNC05xxxyyy 5 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC10xxxyyy 10 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC15xxxyyy 15 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC20xxxyyy 20 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC25xxxyyy 25 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC30xxxyyy 30 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC35xxxyyy 35 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC40xxxyyy 40 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNI05xxxyyy 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks
HSKALNI10xxxyyy 10 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks
HSKALNI15xxxyyy 15 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks
HSKALNI20xxxyyy 20 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks
HSKALNI25xxxyyy 25 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks
HSKBEOI05xxxyyy 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks
HSKBEOI10xxxyyy 10 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks
HSKBEOI15xxxyyy 15 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks
HSKBEOI20xxxyyy 20 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks
HSKBEOI25xxxyyy 25 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks
HSKSII05xxxyyy 5 mils thick gold coated thin film Silicon Isolated heat sinks
HSKSII10xxxyyy 10 mils thick gold coated thin film Silicon Isolated heat sinks
HSKSII15xxxyyy 15 mils thick gold coated thin film Silicon Isolated heat sinks
HSKSII20xxxyyy 20 mils thick gold coated thin film Silicon Isolated heat sinks
HSKSII25xxxyyy 25 mils thick gold coated thin film Silicon Isolated heat sinks
HSKALNC05xxxyyy 5 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks
HSKALNC10xxxyyy 10 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks
HSKALNC15xxxyyy 15 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks
HSKALNC20xxxyyy 20 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks
HSKALNC25xxxyyy 25 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks
HSKBEOC05xxxyyy 5 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks
HSKBEOC10xxxyyy 10 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks
HSKBEOC15xxxyyy 15 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks
HSKBEOC20xxxyyy 20 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks
HSKBEOC25xxxyyy 25 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks
HSKSIC05xxxyyy 5 mils thick gold coated thin film Silicon Electrically Conductive heat sinks
HSKSIC10xxxyyy 10 mils thick gold coated thin film Silicon Electrically Conductive heat sinks
HSKSIC15xxxyyy 15 mils thick gold coated thin film Silicon Electrically Conductive heat sinks
HSKSIC20xxxyyy 20 mils thick gold coated thin film Silicon Electrically Conductive heat sinks
HSKSIC25xxxyyy 25 mils thick gold coated thin film Silicon Electrically Conductive heat sinks
HSKCUC05xxxyyy 5 mils thick gold coated thin film Copper Electrically Conductive heat sinks
HSKCUC10xxxyyy 10 mils thick gold coated thin film Copper Electrically Conductive heat sinks
Heat sinks, stand offs, bonding islands, zero ohm jumpers, isolated or electrically conductive, manufactured on aluminum nitride, beryllium oxide, silicon, quartz, glass or alumina ceramic.US MICROWAVES, manufacturer of high reliability microwave integrated circuits MIC technology. US Microwave offers a multitude of applied thin film products and microwave semiconductor
devices: manufactures and supplies high quality standard microwave thin film circuits and microwave devices using advanced technical ceramics and semiconductor materials; Products include RF micro devices for hybrid chip and wire applications; microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates,
capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes, varactor diodes and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.SEMICONIX Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems
such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays
that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes
arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE Labs Provides
Wafer Foundry, R&D support and Specialty Wafer Fab Processing to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors),
optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au
lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The
Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through holle and surface mounted packages. SEMICONWELL is suppling integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part
numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from
customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe. |
