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09.05.2007 Flip chip spiral chip inductors use bumped gold pads rather than gold wires to reduce parasitic inductance US Microwaves has completed development of the first flip chip spiral chip inductor using bumped gold pads. The flip chip spiral chip inductor is easily mounted by thermocompression or conductive epoxy. The ability to be attached with conductive epoxy opens the possibility of using these high-Q and ultra-high-self-resonance inductors on other substrates than gold-coated thin films on ceramic circuits. Designed and manufactured by US Microwaves in 1990 for military and industrial applications, the spiral chip inductors now can find their place in optoelectronic and wireless consumer products as well. Flip chip spiral inductors eliminate up to 3nH of parasitic inductance associated with the gold wires used for the standard series USMLX3000Q20-xxx and USMLX5000Q20-xxx. Eliminating the parasitic inductance improves inductor performance, self-resonance, precision and operability in the high gigahertz range applications. The fact that the substrate is transparent fused silica is a bonus feature that helps in flip chip mounting operation without sophisticated and expensive equipment. Manufactured with 100% pure gold, the chip does not need any protection and can operate even in hostile environments. Sample quantities are available now. The USMLX3000Q20-xxx and USMLX5000Q20-xxx series are priced at US $1.997 in 100,000-unit quantities and $3.747 in 5000-unit quantities. Production lead-time is 2-4 weeks ARO.